KR920001660A - 반도체 장치의 조립장치 - Google Patents
반도체 장치의 조립장치 Download PDFInfo
- Publication number
- KR920001660A KR920001660A KR1019900008515A KR900008515A KR920001660A KR 920001660 A KR920001660 A KR 920001660A KR 1019900008515 A KR1019900008515 A KR 1019900008515A KR 900008515 A KR900008515 A KR 900008515A KR 920001660 A KR920001660 A KR 920001660A
- Authority
- KR
- South Korea
- Prior art keywords
- conveying line
- semiconductor device
- assembly
- pores
- semi
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 238000007689 inspection Methods 0.000 claims 2
- 239000011148 porous material Substances 0.000 claims 2
- 239000011265 semifinished product Substances 0.000 claims 2
- 239000000284 extract Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 이 발명의 한 실시예에 관한 반도체 장치의 조립장치를 표시하는 블럭도.
제 2도 및 제 3도는 각각 실시예의 주요부를 표시하는 개략 사시도 및 구체적인 사시도.
Claims (1)
- 반도체 장치의 반제품을 반송하는 반송라인과 상기 반송 라인 상에 배치됨과 아울러 반제품에 기공을 실시하는 기공부와 상기 반송 라인과는 별도로 배치됨과 아울러 상기 가공부에서 가공이 실시된 가공피품의 검사를 행하는 검사부와, 상기 가공필품을 상기 반송 라인으로부터 뽑아내어 상기 검사부에 이송함과 아울러 상기 검사부에 의한 검사 종료후에 그 가공필품을 상기 반송라인에 반송하는 전송부와를 구비한 것을 특징으로 하는 반도체 장치의 조립장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-174174 | 1980-07-07 | ||
JP1174174A JPH0340439A (ja) | 1989-07-07 | 1989-07-07 | 半導体装置の組立装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920001660A true KR920001660A (ko) | 1992-01-30 |
KR940006576B1 KR940006576B1 (ko) | 1994-07-22 |
Family
ID=15974003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900008515A KR940006576B1 (ko) | 1980-07-07 | 1990-06-11 | 반도체 장치의 조립장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4982728A (ko) |
JP (1) | JPH0340439A (ko) |
KR (1) | KR940006576B1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2668734B2 (ja) * | 1989-10-23 | 1997-10-27 | 株式会社新川 | ワイヤボンデイング方法 |
JP2770098B2 (ja) * | 1992-02-17 | 1998-06-25 | 株式会社カイジョー | 自動ボンディング装置 |
US5680936A (en) * | 1995-03-14 | 1997-10-28 | Automated Technologies Industries, Inc. | Printed circuit board sorting device |
IL139536A (en) * | 1996-02-23 | 2004-02-08 | Orbotech Ltd | Conveyor system having selectively enabled conveyor elements |
JP3862841B2 (ja) * | 1997-12-16 | 2006-12-27 | 本田技研工業株式会社 | 自動車ボディの組立ライン |
US6232878B1 (en) * | 1999-05-20 | 2001-05-15 | Checkpoint Systems, Inc. | Resonant circuit detection, measurement and deactivation system employing a numerically controlled oscillator |
US7219786B1 (en) | 2003-02-18 | 2007-05-22 | Eric Sari | Operator position adjustable production line machine |
USRE46120E1 (en) | 2003-02-18 | 2016-08-23 | Eric Sari | Operator position adjustable production line machine |
KR100703621B1 (ko) * | 2004-05-07 | 2007-04-05 | 최희숙 | 헤어피스 붙임장치 및 헤어피스 붙임방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL301740A (ko) * | 1963-01-02 | 1900-01-01 | ||
US3878726A (en) * | 1970-06-26 | 1975-04-22 | Touru Hamatani | Device for sampling inspection |
US4301958A (en) * | 1978-08-24 | 1981-11-24 | Fujitsu Limited | Arrangement for automatically fabricating and bonding semiconductor devices |
JPS594035A (ja) * | 1982-06-30 | 1984-01-10 | Toshiba Corp | ワイヤボンデイング装置 |
GB8303770D0 (en) * | 1983-02-11 | 1983-03-16 | Flour Milling & Baking Researc | Apparatus for sampling similar laminar articles |
US4696104A (en) * | 1985-06-07 | 1987-09-29 | Vanzetti Systems, Inc. | Method and apparatus for placing and electrically connecting components on a printed circuit board |
JPS63229836A (ja) * | 1987-03-19 | 1988-09-26 | Nikon Corp | ウエハ検査装置 |
US4801234A (en) * | 1987-05-15 | 1989-01-31 | Daymarc Corporation | Vacuum pick and place mechanism for integrated circuit test handler |
JP2605726B2 (ja) * | 1987-08-18 | 1997-04-30 | ソニー株式会社 | 半導体装置の組立システム |
-
1989
- 1989-07-07 JP JP1174174A patent/JPH0340439A/ja active Pending
-
1990
- 1990-01-04 US US07/461,070 patent/US4982728A/en not_active Expired - Lifetime
- 1990-06-11 KR KR1019900008515A patent/KR940006576B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0340439A (ja) | 1991-02-21 |
KR940006576B1 (ko) | 1994-07-22 |
US4982728A (en) | 1991-01-08 |
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