KR910020500A - 광경화성 조성물 - Google Patents

광경화성 조성물 Download PDF

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Publication number
KR910020500A
KR910020500A KR1019910003352A KR910003352A KR910020500A KR 910020500 A KR910020500 A KR 910020500A KR 1019910003352 A KR1019910003352 A KR 1019910003352A KR 910003352 A KR910003352 A KR 910003352A KR 910020500 A KR910020500 A KR 910020500A
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KR
South Korea
Prior art keywords
meth
acrylate
component
acrylates
weight
Prior art date
Application number
KR1019910003352A
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English (en)
Inventor
마리 야마자끼
다까유끼 가와노
리헤이 나가세
Original Assignee
요시우라 이사무
소마루 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요시우라 이사무, 소마루 가부시끼가이샤 filed Critical 요시우라 이사무
Publication of KR910020500A publication Critical patent/KR910020500A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

광경화성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 중합 가능한 예비중합체로 구성된 성분(a), (메타)아크릴산과 비스페놀의 디글리시딜에테르(디글리시딜에테르/(메타)아크릴산의 몰비는 1 : 1이상)를 반응시켜 수득한 생성물로 구성된 성분(b), 반응성 희석제로 구성된 성분(c) 및 중합 개시제로 구성된 성분(d)로 이루어지며, 성분 (a)∼(c)의 전체량에 기초한 성분(a)∼(d)의 양이 다음과 같은 광경화성 조성물, 성분(a) : 5∼60중량%, 성분 (b) : 5∼70중량%, 성분 (c) : 10∼90중량%, 성분 (d) : 0.2∼20중량%.
  2. 제1항에 있어서, 상기 중합 가능한 예비중합체가 불포화폴리에스테르, 에폭시(메타)아크릴레이트, 우레탄(메타) 아크릴레이트 및 올리고 에스테르(메타) 아크릴레이트로 구성된 군에서 선택된 적어도 하나인 조성물.
  3. 제1항에 있어서, 상기 성분(b)의 생성물이(메타)아크릴산 1몰당 디글리시딜에테르 1.2∼5몰을 사용함으로써 수득되는 조성물.
  4. 제1항에 있어서, 상기 반응성 희석제가 트리메틸올프로판 트리(메타)아크릴레이트, 펜타에리트리톨 테트라(메타) 아크릴레이트, 디펜타에리트리톨 헥사(메타) 아크릴레이트, 1 6-헥산디올 디(메타) 아크릴레이트, 트리에틸렌글리콜 디(메타)아크릴레이트, 네오펜틸글리콜 디(메타) 아크릴레이트, 폴리에틸렌글리콜 디(메타) 아크릴레이트, 히드록시피발릭산 네오펜틸글리콜 디(메타) 아크릴레이트, 이염기성 수지산 디글리시딜 에서테를디(메타) 아크릴레이트, 히드록시에틸(메타) 아크릴레이트, 테트라히드로푸르푸릴(메타) 아크릴레이트, 페녹시에틸(메타) 아크릴레이트, 및 디스클로펜테닐(메타) 아크릴레이트로 구성된 군에서 선택된 것인 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910003352A 1989-05-31 1991-02-28 광경화성 조성물 KR910020500A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2143081A JPH0436308A (ja) 1990-05-31 1990-05-31 紫外線硬化性樹脂組成物
JP2-143,081 1990-05-31

Publications (1)

Publication Number Publication Date
KR910020500A true KR910020500A (ko) 1991-12-20

Family

ID=15330473

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910003352A KR910020500A (ko) 1989-05-31 1991-02-28 광경화성 조성물

Country Status (4)

Country Link
EP (1) EP0459608A3 (ko)
JP (1) JPH0436308A (ko)
KR (1) KR910020500A (ko)
CA (1) CA2037077A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334654A (en) * 1993-05-03 1994-08-02 Air Products And Chemicals, Inc. Flexibilized polyepoxide resins
DE19852720A1 (de) * 1998-11-16 2000-05-18 Fischer Artur Werke Gmbh Zweikomponentenmasse für chemische Befestigungen
JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板
JP2003105061A (ja) * 2001-09-27 2003-04-09 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに穴詰プリント配線（基）板の製造方法及び穴詰プリント配線（基）板
CN1331974C (zh) * 2005-12-02 2007-08-15 西安瑞联近代电子材料有限责任公司 平板显示器用紫外光固化胶制备方法
CN104212396A (zh) * 2014-09-10 2014-12-17 湖南柯盛新材料有限公司 一种用于饰面大理石板材修补的光固化树脂组合物及其制备使用方法
CN110804397A (zh) * 2019-11-27 2020-02-18 上海金門量子科技有限公司 一种液态光学透明胶及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
JPS5798521A (en) * 1980-12-12 1982-06-18 Ube Ind Ltd Photo-curable composition
DE3620254C2 (de) * 1985-06-18 1994-05-05 Canon Kk Durch Strahlen mit wirksamer Energie härtbare Harzmischung
JPH0639518B2 (ja) * 1986-04-28 1994-05-25 東京応化工業株式会社 耐熱性感光性樹脂組成物
ES2040793T3 (es) * 1987-09-16 1993-11-01 Canon Kabushiki Kaisha Compuesto de resina curable con radiaciones de energia activa conteniendo resina epoxi semiesterificada como componente.

Also Published As

Publication number Publication date
EP0459608A3 (en) 1993-01-20
EP0459608A2 (en) 1991-12-04
CA2037077A1 (en) 1991-12-01
JPH0436308A (ja) 1992-02-06

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