KR910019066A - 금 전도체 조성물 - Google Patents
금 전도체 조성물 Download PDFInfo
- Publication number
- KR910019066A KR910019066A KR1019910005787A KR910005787A KR910019066A KR 910019066 A KR910019066 A KR 910019066A KR 1019910005787 A KR1019910005787 A KR 1019910005787A KR 910005787 A KR910005787 A KR 910005787A KR 910019066 A KR910019066 A KR 910019066A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- weight
- weight percent
- fine particles
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Ceramic Products (AREA)
- Conductive Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Non-Insulated Conductors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (6)
- 무기 고체의 총량에 기초하여, (a) 입장의 90중량%이상이 2이하의 종횡비(aspect ratio)를 가지는 금 금속미분 입자 75내지 95중량%, (b) 카드륨 보로실리케이트 유리 미분입자 0.5내지 10중량% (c) CuO, ZnO, MgO, CoO, NiO, FeO, MnO 및 이들의 혼합물로 이루어지는 군으로부터 선택되는 스피넬 형성 2가 금속 산화물 미분 입자 0.1 내지 5중량%, (d) 팔라듐, 백금 및 로듐으로 이루어지는 군으로부터 선택되는 금속 미분 입자 0.1 내지 1.0중량% 및 (e) 상기 (a) 내지 (d)의 모든 미분 입자가 분산되어 있는 유기 매질로 이루어짐을 특징으로 하는 금 전도체 조성물.
- 제1항에 있어서, 유기 매질이 에틸 셀룰로오스, 폴리부틸 메타크릴레이트, 폴리-α-메틸 스티렌 또는 폴리 (에틸렌 비닐 아세테이트)로 이루어지는 군으로부터 선택되는 수지 2내지 20중량% 및 지방족 알코올, 이들 알코올로 에스테르, 글리콜 에테르, 테르핀 및 디알킬 프탈레이트로 이루어지는 군으로부터 선택되는 유기액체 98내지 80중량%로 이루어짐을 특징으로 하는 조성물.
- 제1항에 있어서, 금 금속 80 내지 88중량%로 이루어짐을 특징으로 하는 조성물.
- 제1항에 있어서, 카드뮴 보로실리케이트 유리가 CdO 68.8중량%, B2O318.6중량%, SiO29.5중량% 및 Al2O33.1중량%로 이루어짐을 특징으로 하는 조성물.
- 제1항에 있어서, 스테닐 형성 2가 금속산화물 0.1 내지 1중량%로 이루어짐을 특징으로 하는 조성물.
- (a) 제1항 기재 전도체 조성물을 건조시키고, (b) 이 건조된 조성물을 800 내지 950℃범위의 온도에서 소성시키는 것으로 이루어지는 방법에 의해 형성된 금 금속화물 (a gold metalization).※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US508769 | 1983-06-29 | ||
US50876990A | 1990-04-12 | 1990-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910019066A true KR910019066A (ko) | 1991-11-30 |
KR970004545B1 KR970004545B1 (ko) | 1997-03-28 |
Family
ID=24023999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910005787A KR970004545B1 (ko) | 1990-04-12 | 1991-04-11 | 금 전도체 조성물 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0451771B1 (ko) |
JP (1) | JP3053454B2 (ko) |
KR (1) | KR970004545B1 (ko) |
CA (1) | CA2040125A1 (ko) |
DE (1) | DE69115100T2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5439852A (en) * | 1994-08-01 | 1995-08-08 | E. I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film conductor composition |
US5698015A (en) * | 1995-05-19 | 1997-12-16 | Nikko Company | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste |
US7611645B2 (en) | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350618A (en) * | 1979-11-16 | 1982-09-21 | Electro Materials Corp. Of America | Thick film conductors for use in microelectronic packaging |
US4793946A (en) * | 1986-10-06 | 1988-12-27 | Engelhard Corporation | Thin print etchable gold conductor composition |
-
1991
- 1991-04-09 EP EP91105565A patent/EP0451771B1/en not_active Expired - Lifetime
- 1991-04-09 DE DE69115100T patent/DE69115100T2/de not_active Expired - Fee Related
- 1991-04-10 CA CA002040125A patent/CA2040125A1/en not_active Abandoned
- 1991-04-11 JP JP3105154A patent/JP3053454B2/ja not_active Expired - Fee Related
- 1991-04-11 KR KR1019910005787A patent/KR970004545B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0451771B1 (en) | 1995-12-06 |
DE69115100T2 (de) | 1996-05-15 |
CA2040125A1 (en) | 1991-10-13 |
JP3053454B2 (ja) | 2000-06-19 |
KR970004545B1 (ko) | 1997-03-28 |
DE69115100D1 (de) | 1996-01-18 |
JPH04230907A (ja) | 1992-08-19 |
EP0451771A1 (en) | 1991-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |