KR910015905A - Lsi 냉각장치 및 컴퓨터 냉각장치 - Google Patents

Lsi 냉각장치 및 컴퓨터 냉각장치 Download PDF

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KR910015905A
KR910015905A KR1019910002257A KR910002257A KR910015905A KR 910015905 A KR910015905 A KR 910015905A KR 1019910002257 A KR1019910002257 A KR 1019910002257A KR 910002257 A KR910002257 A KR 910002257A KR 910015905 A KR910015905 A KR 910015905A
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South Korea
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lsi
thin wire
heat sink
cooling
cooling device
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KR1019910002257A
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English (en)
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KR940007379B1 (ko
Inventor
도시오 하다다
히또시 마쯔시마
요시히로 곤도우
히로시 이노우에
간지 오오쯔가
유우지 시라이
다까오 오오바
아끼라 야마기와
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미다 가쓰시게
가부시기가이샤 히다찌 세이사꾸쇼
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Publication of KR910015905A publication Critical patent/KR910015905A/ko
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음

Description

LSI 냉각장치 및 컴퓨터 냉각장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예를 나타내며, 컴퓨터에 적용한 경우의 실장 상태를 나타낸 사시도, 제2도, 제3도는 각각 냉각공기의 흐름을 나타낸 보드부의 종단면도.

Claims (9)

  1. LSI에 부착된 히트싱크에 유체를 흘려 LSI를 냉각하는 LSI 냉각장치에 있어서, 전기 히트싱크가 세선핀군으로 이루어지는것으로, 이 세선의 직경을 레이놀드수가 40 이하가 되는 범위에 설정되어 있는 것을 특징으로 하는 LSI 냉각장치.
  2. LSI에 부착된 히트싱크에 공기를 흘려 LSI를 냉각하는 LSI 냉각장치에 있어서, 상기 히트싱크가, LSI에 부착된 열확산판과 이 열 확산판에 접합되어 코루게이트 상으로 절곡된 세선핀군으로 이루어지는 것으로, 이 세선의 대표길이를 0.6㎜이하로 한 것을 특징으로 하는 LSI 냉각장치.
  3. LSI에 부착된 히트싱크에 유체를 흘려 LSI를 냉각하는 LSI 냉각장치에 있어서, 전기 히트싱크가, LSI에 대하여 대략 수직방향으로 형성된 다수의 세선핀군으로이루어지는 것으로, 이 세선핀의 상기 LSI에 평행한 유체의 흐름 방향에 대해서 경사지도록 배열되어 있는 것을 특징으로 하는 LSI 냉각장치.
  4. 제1항에 있어서, 상기 세선핀군이 대략 평행상으로 형성되어 있는 것으로, 일정한 간격을 가지고 폭이 넓은 부분을 설치하고 있는 LSI 냉각장치.
  5. LSI에 부착된 히트싱크에 유체를 흘려 LSI를 냉각하는 LSI 냉각장치에 있어서, 전기 히트싱크가 지주와 이 지주에 접합되어 코루게이트상으로 절곡된 세선핀군으로 이루어진 것을 특징으로 하는 LSI 냉각장치.
  6. 제1항에 있어서, 상기 세선핀의 단면형상이, 원형, 타원형, 구형 혹은 이들의 복합체인 LSI 냉각장치.
  7. 제 5 항에 있어서, 상기 세선핀군이 연속된 긴 세선을 절곡함으로서 구성되어 있는 LSI 냉각장치.
  8. 히트싱크를 구비한 LSI 패키지등을 부착한 기판을 탑재하고, 공기 송풍수단에 의하여 공기를 송풍하여 상기 LSI 패키지등의 냉각을 행하는 컴퓨터 냉각장치에 있어서, 상기 히트싱크가 세선핀군으로 이루어지는 것으로 그 세선의 지름, 상기 공기의 송풍량, 공기의 통로를 레이놀드수가 40 이하가 되는 범위로 설정한 것을 특징으로 하는 컴퓨터 냉각장치.
  9. 제8항에 있어서, 상기 공기의 통로는, 주류와 바이패스류로 분리하는 가이드판을 갖는 것으로, 상기 주류를 상기 가이드판에 설치한 스릿에 의하여 상기 LSI 패키지에 상부로부터 충돌시키도록 유도함과 동시에 그 이외의 부품을 상기 바이패스류에 의하여 냉각하도록 구성되어 있는 컴퓨터 냉각장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910002257A 1990-02-28 1991-02-11 Lsi 냉각장치 및 컴퓨터 냉각장치 KR940007379B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2045413A JP2544497B2 (ja) 1990-02-28 1990-02-28 コンピュ―タ冷却装置
JP90-45413 1990-02-28

Publications (2)

Publication Number Publication Date
KR910015905A true KR910015905A (ko) 1991-09-30
KR940007379B1 KR940007379B1 (ko) 1994-08-16

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US (1) US5195576A (ko)
JP (1) JP2544497B2 (ko)
KR (1) KR940007379B1 (ko)
DE (1) DE4106437C2 (ko)

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DE4106437C2 (de) 1995-05-18
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US5195576A (en) 1993-03-23
JP2544497B2 (ja) 1996-10-16
JPH03250652A (ja) 1991-11-08

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