KR910015378A - 돌출 저부를 구비하는 성형 포트 - Google Patents

돌출 저부를 구비하는 성형 포트 Download PDF

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Publication number
KR910015378A
KR910015378A KR1019900018561A KR900018561A KR910015378A KR 910015378 A KR910015378 A KR 910015378A KR 1019900018561 A KR1019900018561 A KR 1019900018561A KR 900018561 A KR900018561 A KR 900018561A KR 910015378 A KR910015378 A KR 910015378A
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KR
South Korea
Prior art keywords
port
opening
encapsulating
fluidized
encapsulation material
Prior art date
Application number
KR1019900018561A
Other languages
English (en)
Other versions
KR0173978B1 (ko
Inventor
베어드 존
Original Assignee
빈센트 죠셉 로너
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 죠셉 로너, 모토로라 인코포레이티드 filed Critical 빈센트 죠셉 로너
Publication of KR910015378A publication Critical patent/KR910015378A/ko
Application granted granted Critical
Publication of KR0173978B1 publication Critical patent/KR0173978B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/581—Devices for influencing the material flow, e.g. "torpedo constructions" or mixing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

돌출 저부를 구비하는 성형 포트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 주형 조립체의 평면도, 제2도는 제1도의 주형 조립체 일부의 평면도, 제3도는 제2도의 성형 포트의 돌출 저부의 등각도.

Claims (3)

  1. 각각의 포트가 런너에 의해 적어도 하나의 주형 공동에 접속된 다수의 포트를 가지는 반도체 장치의 캡슐화 하기 위한 멀티 포트 주형 조립체에 있어서, 상기 각각의 포트는 런너를 향하는 개구를 갖는 저부를 포함하고, 상기 저부는 플런저에 의해 상기 포트의 저부에 밀어 넣어지는 성형 물질에 전단 작용을 일으키는 외형을 하고있으며, 상기 외형은 성형 물질에 의한 개구의 폐쇄를 방지하는 역할을 하는 것을 특징으로 하는 멀티 포트 주형조립체.
  2. 반도체 장치를 캡슐화 하기 위한 장치에 있어서, 캡슐화 물질을 수용하기 위한 적어도 하나의 포트를 포함하고, 상기 포트는 저부 및 유체화된 캡슐화 물질이 상기 포트에서 배출될 수 있도록 포트의 저부 근처에 유출구와, 정점 및 캡슐화 물질을 수용하기 위해 상기 정점에 있는 개구부와 캡슐화 물질을 상기 포트의 저부를 향하여 압축하기 위한 플런저를 구비하고, 상기 포트의 저부는 캡슐화 물질을 유체화 시키고 상기 유출구 밖으로 배출시키기 위해 캡슐화 물질에 전단작용을 일으키도록 저부로부터 뻗어 있는 적어도 하나의 돌출부를 구비하는 것을 특징으로 하는 장치.
  3. 주형 조립체에서 사용되고, 정점과 저부를 가지며 상기 저부는 유체화된 캡슐화 물질을 외부로 유출시키기 위한 개구부와 그곳에서 뻗어 있는 원형 돌출부 및 상기 돌출부를 가로지르는 슬로트를 갖는 성형 포트에 있어서, 상기 슬로트는 유체화된 캡슐화 물질만이 상기 개구부에 도달할 수 있도록 상기 개구부로부터 떨어져 정렬되어 있고, 상기 포트의 저부로부터 상기 원형 돌출부 내부로 뻗어 있는 원추 형태의 돌출부를 구비하는 것을 특징으로 하는 성형 포트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900018561A 1990-02-13 1990-11-16 형성 저부를 구비하는 성형 포트 KR0173978B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/479,501 US5123826A (en) 1990-02-13 1990-02-13 Molding pot having configured bottom
US479,501 1990-02-13

Publications (2)

Publication Number Publication Date
KR910015378A true KR910015378A (ko) 1991-09-30
KR0173978B1 KR0173978B1 (ko) 1999-04-01

Family

ID=23904287

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900018561A KR0173978B1 (ko) 1990-02-13 1990-11-16 형성 저부를 구비하는 성형 포트

Country Status (8)

Country Link
US (1) US5123826A (ko)
EP (1) EP0447037B1 (ko)
JP (1) JPH0790572B2 (ko)
KR (1) KR0173978B1 (ko)
CN (1) CN1036257C (ko)
DE (1) DE69104244T2 (ko)
MY (1) MY104598A (ko)
PH (1) PH27572A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US6200504B1 (en) 1994-05-09 2001-03-13 Fico B.V. Method for encapsulating with plastic a lead frame with chips
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design
JP2701766B2 (ja) * 1995-01-27 1998-01-21 日本電気株式会社 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置
JPH08300397A (ja) * 1995-05-01 1996-11-19 Motorola Inc 封止材料をモールドキャビティに転送するための装置および方法
JP3483994B2 (ja) * 1995-08-31 2004-01-06 ローム株式会社 樹脂パッケージ型半導体装置の成形用金型装置、および半導体装置の樹脂パッケージング方法
US6015280A (en) * 1997-04-28 2000-01-18 Advanced Micro Devices Apparatus for reducing warping of plastic packages
KR100241175B1 (ko) * 1997-12-16 2000-02-01 윤종용 돌출부가 형성된 컬-블록을 갖는 트랜스퍼 몰딩 장치
US6890355B2 (en) 2001-04-02 2005-05-10 Gary K. Michelson Artificial contoured spinal fusion implants made of a material other than bone
US9349927B2 (en) * 2011-10-18 2016-05-24 Nitto Denko Corporation Encapsulating sheet and optical semiconductor element device
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460964A (en) * 1942-09-29 1949-02-08 Western Electric Co Apparatus for molding
US2471148A (en) * 1948-01-06 1949-05-24 Gen Electric Sprue cutter for transfer molding devices
FR2243072B1 (ko) * 1973-09-10 1978-08-11 Int Basic Economy Corp
JPS59179328A (ja) * 1983-03-31 1984-10-11 Fujitsu Ltd モ−ルド方法
JPS6082316A (ja) * 1983-10-14 1985-05-10 Hitachi Micro Comput Eng Ltd モ−ルド装置
US4708613A (en) * 1985-03-27 1987-11-24 Kabushiki Kaisha Toshiba Plunger for a multi-plunger type resin mold device
JPS61274910A (ja) * 1985-05-31 1986-12-05 Mitsubishi Electric Corp 半導体樹脂封止用金型

Also Published As

Publication number Publication date
EP0447037B1 (en) 1994-09-28
DE69104244D1 (de) 1994-11-03
US5123826A (en) 1992-06-23
JPH0796536A (ja) 1995-04-11
CN1036257C (zh) 1997-10-29
MY104598A (en) 1994-04-30
CN1054030A (zh) 1991-08-28
PH27572A (en) 1993-08-18
DE69104244T2 (de) 1995-04-27
KR0173978B1 (ko) 1999-04-01
EP0447037A1 (en) 1991-09-18
JPH0790572B2 (ja) 1995-10-04

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