KR880014667A - 수지사출에 의한 반도체 장치 피복방법 및 주형 - Google Patents

수지사출에 의한 반도체 장치 피복방법 및 주형 Download PDF

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Publication number
KR880014667A
KR880014667A KR1019880005249A KR880005249A KR880014667A KR 880014667 A KR880014667 A KR 880014667A KR 1019880005249 A KR1019880005249 A KR 1019880005249A KR 880005249 A KR880005249 A KR 880005249A KR 880014667 A KR880014667 A KR 880014667A
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KR
South Korea
Prior art keywords
cavity
coating
semiconductor device
mold cavity
injection
Prior art date
Application number
KR1019880005249A
Other languages
English (en)
Inventor
벨르렝 루씨앙
니즈보어 씨조르
Original Assignee
이반 밀러 레르너
엔.브이.필립스 글로 아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이반 밀러 레르너, 엔.브이.필립스 글로 아이람펜파브리켄 filed Critical 이반 밀러 레르너
Publication of KR880014667A publication Critical patent/KR880014667A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

수지사출에 의한 반도체 장치 피복방법 및 주형
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 방법을 실행하는 주형의 단면도, 제2도는 제1도에 도시된 주형의 중앙부분의 세부에 대한 평면도.

Claims (3)

  1. 금속도체의 단부는 주형공동으로부터 돌출되어 있고, 반도체 장치를 포함한 주형공동내에 수지를 사출함으로써 전기 접속된 금속 도체를 가진 상기 반도체 장치의 피복방법에 있어서, 주형공동과 이 공동까지 이르는 사출 채널은 수지사출이 있기 이전에 통기성 벽을 통해 주형공동안으로 연결된 진공 덕트에 의해 들어온 공기를 소개하고 또한 이 소개작용을 적어도 주형공동 안으로의 수지사출 작용시간 동안 지속된다는 것을 특징으로 하는 반도체 장치의 피복방법.
  2. 제1항에 있어서, 사출구가 통기성 벽에 인접한 위치에 있는 주형공동 안으로 돌출해 있으며 또한 사출흐름의 방향은 상기 공동을 둘러싼 통기성 벽의 표면에 거의 수직한다는 것을 특징으로 하고 상기 방법을 수행하는 주형.
  3. 제2항에 있어서, 상기 공동에 인접한 통기성 벽의 표면은 금속도체의 단부가 돌출하여 있는 평면에 위치하며 또한 사출구는 두 인접 금속도체 사이에 있는 상기 평면에 돌출하여 있다는 것을 특징으로 하는 주형.
    ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019880005249A 1987-05-06 1988-05-06 수지사출에 의한 반도체 장치 피복방법 및 주형 KR880014667A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8706395 1987-05-06
FR8706395A FR2615037B1 (fr) 1987-05-06 1987-05-06 Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine

Publications (1)

Publication Number Publication Date
KR880014667A true KR880014667A (ko) 1988-12-24

Family

ID=9350841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005249A KR880014667A (ko) 1987-05-06 1988-05-06 수지사출에 의한 반도체 장치 피복방법 및 주형

Country Status (4)

Country Link
EP (1) EP0293954A1 (ko)
JP (1) JPS63299349A (ko)
KR (1) KR880014667A (ko)
FR (1) FR2615037B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2846773B2 (ja) * 1992-09-01 1999-01-13 三菱電機株式会社 半導体装置の樹脂封止装置及び樹脂封止方法
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP3214197B2 (ja) * 1993-11-17 2001-10-02 トヨタ自動車株式会社 ガスケット製造方法およびガスケット製造装置
DE4340864C2 (de) * 1993-12-01 1996-08-01 Telefunken Microelectron Vorrichtung und Verfahren zum Herstellen von optoelektronischen Bauelementen
JP3956335B2 (ja) * 2000-03-06 2007-08-08 シャープ株式会社 樹脂注型用金型を用いた半導体装置の製造方法
US11318642B2 (en) 2019-12-20 2022-05-03 Eaton Intelligent Power Limited Permeable wall encapsulation mold

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1462622A (en) * 1973-02-20 1977-01-26 Clearex Plastics Ltd Vacuum moulding
GB2123334A (en) * 1982-07-14 1984-02-01 Coolmation Limited Mould cooling means
IE56790B1 (en) * 1983-06-29 1991-12-18 Motorola Inc Electronic device method using a leadframe with an integral mold vent means
DE3424742C1 (de) * 1984-07-05 1985-11-14 SKF GmbH, 8720 Schweinfurt Spritz- oder Gießform zur Herstellung eines Kunststoff-Taschenkäfigs für Radial-Zylinderrollenlager und Taschenkäfig, der in dieser Form hergestellt ist
JPS6185829A (ja) * 1984-10-03 1986-05-01 Michio Osada 半導体素子のトランスフア樹脂モ−ルド成形方法
JPS61117842A (ja) * 1984-11-14 1986-06-05 Hitachi Micro Comput Eng Ltd 成形装置

Also Published As

Publication number Publication date
FR2615037A1 (fr) 1988-11-10
EP0293954A1 (fr) 1988-12-07
FR2615037B1 (fr) 1990-04-27
JPS63299349A (ja) 1988-12-06

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