KR910008672B1 - Structure for mounting ic chip for timepiece - Google Patents

Abstract

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Description

IC chip mounting structure for timepiece

1 is a plan view of one embodiment of the present invention.

2 and 3 are cross-sectional views of FIG. 1.

4-12 are cross-sectional and plan views of another embodiment of the present invention.

13 to 16 are plan views showing embodiments of the IC chip fixing position identifying means of the present invention.

* Explanation of symbols for main parts of the drawings

1: board 2: circuit board

3: circuit block cover 4, 41, 42, 43: IC chip

5: Crystal Unit 6: Coil Block

The present invention relates to a mounting structure of an IC chip for a timepiece.

Japanese Patent Application Nos. 59-13834, 56-50544 and 59-120884 are described for mounting structures of IC chips for timepieces.

In the above prior art, the wiring pattern and the IC chip terminal are connected by gold wire, welding, and soldering, and furthermore, the casting medium is used for the purpose of reinforcing the connecting portion.

The conventional mounting method required a process of connecting the wiring pattern and the IC chip terminal by gold wire, welding, and soldering, and a process of casting the wiring pattern and the IC chip terminal by connecting them.

Moreover, defects from these processes could not be repaired.

IC chips and boards are very expensive compared to other parts, and the cost of circuit breakage depends on how the mounting process is combined.

The object of the present invention is to solve the above problems and simplify the mounting process to reduce the cost and to repair the defects easily occurring in the mounting process.

(1) A mounting structure of an IC chip for a timepiece includes: an IC chip having a plurality of terminals, a substrate having wires formed on opposite sides of the terminals, a frame composed of an insulating member for mounting by stratification of the IC chip and the substrate, And a pressing member for obtaining electrical conductivity between the electric wire and the IC chip by pressing the elastic part, which is the place where the IC chip and the substrate are supported between the flame and the pressing member.

(2) The structure for mounting an IC chip for a timepiece according to the above (1), wherein a protrusion is formed on at least one of the IC chip and the wiring pattern.

(3) The mounting structure according to (1) above, wherein the IC chip has a fixed direction identification means.

(4) The IC chip mounting structure for a timepiece according to (1), wherein the guide portion for adjusting the planar position of the IC chip is provided on at least one of the insulating member and the flame.

(5) The structure for mounting an IC chip for a timepiece according to the above (1), wherein one part of the wire is flexible.

(6) The mounting structure of an IC chip for a timepiece according to the above (1), wherein the flame is formed of a metal member having an insulating layer.

(7) The mounting structure of an IC chip for a timepiece according to the above (1), wherein wiring patterns facing each of a plurality of IC chip terminals are formed in the frame.

The flame introduced in the present invention means a plate, a support member, a plate member.

1 is a plan view of one embodiment of the present invention, Figures 2 and 3 are cross-sectional views therein, (1) a plate made of artificial resin and a flame, (2) is an insulating member and the plate (1) On the opposite side of the plate (1) to form an electric wire, (3) a circuit block cover and pressing member having an elastic substrate, (4) an IC chip, which is an output terminal for a stepping motor composed of gold bumps A reset terminal, a crystal unit terminal, a V _DD , V _ss terminal, a test terminal, a non-wire terminal, and a test terminal (4τ) for finding an IC monomer.

(5) is a crystal unit, (6) is a well known coil block of a stepping motor consisting of a rotor, a stator and a coil block.

Denoted at 7 is a battery, and at 8 is a battery connection (-) which is pressed against the cathode ray of the battery 7.

Furthermore, output terminals for stepping motors, (2a) and (2b) patterns, gate patterns (2c), drain patterns (2d), V _DD patterns (2e), Vss patterns (2f), and reset patterns are opposed to terminals respectively. (2g), test terminals 2h and 2i, and wiring terminals 2j are formed on the circuit board 2 (the surface of the foil is finished).

One part of these forms is manufactured to protrude from the positioning groove 2k of the IC chip.

The positioning hole 2k of the IC chip keeps the sides in four directions flat by releasing from four corners of the IC chip, thereby preventing a plane displacement between the terminal of the IC chip 4 and each shape.

Next, the end position of the IC chip is pressed by the spring 3a provided in the circuit block cover 3.

Since the plate 1 is made of artificial resin, it is slightly flexible to accommodate the variation in the bump height (as shown by the broken line, the recess is formed in the plate 1 to increase flexibility and reliable conductivity).

Thus, as the mounting process, the IC chip is immersed in a predetermined direction (this direction can be found by the test terminal 4τ, and the arrow 2n is indicated on the circuit board opposite the test terminal 4τ), and the circuit block The cover 3 is configured to facilitate mounting.

Failure of the mounting process is not critical because it does not have thermal pressurization and wire coupling.

In case of failure, the circuit block cover 3 is peeled off so that the IC chip 4 or the circuit board 2 can be replaced.

Therefore, repairability is improved.

The crystal unit 5 guides the planar position with the recess 1b of the plate and presses the terminal of the elastic portion 3b of the circuit block cover 3 through the plate 1 and the circuit board 2 to conduct conductivity. Get

4-9 illustrate another embodiment of the present invention.

In FIG. 4, the recess 1a is provided at approximately the same position as each bump of the plate 1.

Since there is a deviation in the height of the gold bump, it is manufactured so that a portion is slightly deflected to accommodate the height deviation (in the base surface relationship of the plateless 1a, the void s and the bump play h are h > S is good and furthermore, in the base surface relationship of the IC chip 4, the surface of the plate notch 1e and the space t have a good t> s).

This improves the conductivity of the pattern and the bumps.

The IC chip has a structure in which a block portion 3b is provided in the circuit block cover 3 and the block portion is pressed by the elasticity of the circuit block cover 3.

The IC chip 4 is manufactured to protrude from the top surface of the circuit board 2.

This prevents the displacement of the projections 4a which are raised in the plane from the protrusions 4α remaining on the edge surface of the IC chip during patterning and chipping.

5 is provided at the top of each pattern where the junctions 2τ are formed on the circuit board 2, respectively.

Due to the deflection of the junction 2, a method of using the variation in the bump height is shown in FIG.

FIG. 6 shows a structure in which the IC chip 4 is not provided with gold bumps, but a dowel 2m (located opposite each IC chip terminal) is provided at the top edge of the pattern.

The same effect can be obtained from the formation of the dialer 2n (FIG. 9) by etching part of the pattern in addition to the formation of the dial.

7 shows that the planar position of the IC chip is formed in the plate 1 by providing a plurality of protrusions 1d.

That is, the method of connecting the IC chip terminal and the pattern is constructed in accordance with the above method.

Instead of the board (1), it is possible to use a circuit sheet composed of artificial resin.

FIG. 8 shows a structure in which a pattern of a circuit board is formed in a reverse direction compared to the above embodiment, and the planar position of the IC chip 4 is formed by a pattern having the same potential as V _DD or having no potential electrically. .

The holes 2r form the junction of the pattern 2q.

Furthermore, it consists of a projection (half-breaking in multiple positions) provided in a part of the circuit board 2 having insulation in the planar guide of the IC chip indicated by a broken line or a flame composed of a space between the plate, the bearing, the plate and the bearing ( Bonding can be realized by protrusions provided on the same potential or insulator as V _DD ).

Although the above embodiment has been described from the gold bumps, the same effect can be obtained from the solder bumps.

Gilding is carried out in the pattern of the circuit board, thereby improving conductivity.

The plate 1 is also good as a reinforcing member, for example a metal member that is harmonized and is furthermore a material formed by an insulating layer between the plate and the IC chip.

In the present invention, the wiring pattern is formed on the circuit board, but the same effect can be obtained by printing from the formation of the wiring pattern on the opposite surface as compared with the IC chip on the plate surface.

Furthermore, it is possible to manufacture a circuit boardless structure by providing the guide of the IC chip on the plate as shown in FIG.

10 is a plan view showing another embodiment of the present invention.

11 is a sectional view from there.

(1) is made of artificial resin, and the recess 1 including the IC chip 4 is provided with a recess 1a made of artificial resin and including the IC chip 4.

(2) is a circuit board for forming a wiring pattern on the opposite side of the board (1), and is mounted on the board (1).

Reference numeral 3 denotes a circuit block cover which is not only loaded on the top surface of the circuit board 2 but also has elasticity.

(4) is an IC chip, and an output terminal for a stepping motor composed of its bump, a reset terminal, a crystal unit terminal, a V _DD terminal, a V _ss terminal, a wiring for detection test terminal, time rate adjustment data, etc. as a circuit block. Terminal and test terminals for detection by the IC chip monomer (4k, 4l, 4w).

(5) is a crystal unit, (6) is a well-known coil block composed of a permanent magnet and teeth of a stepping motor composed of a step rotor 10 and a rotor stator 11.

Patterns (2a, 2b) corresponding to the stepping motor output terminals (01,02) facing each terminal of the IC chip (4), the gate pattern (2c) and the drain pattern for connecting with the gate or drain terminal of the crystal oscillator (2d), the V _DD pattern 2e, the V _ss pattern 2f, the reset pattern 2g, the test terminal patterns 2b and 2i and the terminal pattern for the wiring 2j are formed on the circuit board 2.

Furthermore, gold foil finish is applied to the surface of each pattern (surface except the contact surface of a circuit board and a thin copper plate).

However, since the test terminals 4k, 4l, 4w are detection terminals by IC chip monomers, the patterns corresponding to the respective test terminals 4k, 4l, 4w are not required.

The planar position of each terminal of the IC chip and the positioning means of the wiring pattern are implemented relatively from the external shape of the IC chip 4, and are located by the wall of the recess 1a of the plate, and the circuit board 2 is formed by the plate ( It is positioned by two dowels formed in 1).

The conductivity of each terminal of the IC chip and the wiring pattern opposite to the terminal is ensured by pressing the base surface of the recess 1a of the plate and by pressing springs 3A and 2 pieces.

In the circuit board 2 as shown in the figure, an insulator is placed between the pressing spring 3a of the circuit block cover 3 and the wiring pattern, thereby preventing a short circuit.

In this embodiment, two pressure springs 2a are described.

However, the present invention is not limited to two, and a plurality of pressure springs can be formed.

For example, four corners of the IC chip can be pressed by four springs, and the same number of terminals and wiring patterns can be pressed by the IC chip to obtain conductivity.

In this case, the height deviation of each terminal can be absorbed by cutting between wiring patterns in the circuit board 2, thereby improving the conductivity.

As mentioned above, the mounting process incorporates the IC chip into the recess 1a of the plate, the circuit block cover 3 is mounted on the circuit board 2, and the plate 1 and the circuit block cover 3 are screwed. It is implemented by being fixed by such.

Thus, the operation check and time adjustment are performed in the form of a complete timepiece.

Thus, packaging is achieved by integrating the parts.

That is, the mounting process is very easy to carry out.

Moreover, no defects in the mounting process are not a problem since heat pressurization and wire bonding are not performed.

If a defect occurs, it can be easily repaired.

In other words, the circuit board is removed to replace defective parts of the IC chip.

12 shows another embodiment of the present invention.

(1) is a plate made of artificial resin, and includes pressure springs (1d, 2 pieces).

(2) is a circuit board, (4) is an IC chip (same as the above embodiment), and (3) is a circuit block cover.

A hole 2k similar in shape to the external shape of the IC chip is provided in the circuit board 2, and is manufactured so as to protrude a wiring pattern opposite each terminal (it is manufactured to extend into the hole).

The IC chip is guided by the holes 2k of the circuit board.

The wiring pattern corresponding to the terminal and each terminal of the IC chip are pressed by the circuit block cover 3 and the pressing spring 1d of the plate for obtaining conductivity.

In the present invention, a wiring pattern is formed on the circuit board.

It is realized by the wiring pattern from the structure without the circuit board formed by printing on the surface of the board 1 (opposite of the IC chip terminals) and providing protrusions on the board to guide the IC chip as shown in FIG.

According to the above embodiment, the conductivity of the IC terminal and the wiring pattern is possible by the leaf spring.

However, it is also possible to use elastic members such as coil springs and rubber.

Moreover, several advantages can be obtained by combining the above embodiments.

13 to 16 are plan views of IC chips showing another embodiment of the fixed direction recognizing means of the IC.

In FIG. 13, the terminal of the IC chip is fixed at the same position as the IC chip terminal of FIG.

Furthermore, the IC chip includes output terminals 4a and 4b for stamping motors, crystal unit terminals 4c and 4d, reset terminals 4g, V _DD terminals 4e and + terminals, and V _ss terminals 4f and-terminals. , Test block 4h, 4i for detecting circuit block, write terminal for adjusting data for writing time, test terminal 4τ for detecting by IC chip monomer (wiring pattern is not required in the opposite position), and The terminals are composed of gold bumps.

The fixed direction of the IC chip 4 can be identified by the test terminal 4τ as mentioned above.

In addition, as indicated by the broken line, there is no need to identify the direction from the side of the active surface when having the surface 4m.

Therefore, the fixing method can be improved.

It is preferable that an identification mark 4m (indicated by a broken line) is provided on the rear surface (opposite side of the active surface) of the IC chip by printing or the like instead of the surface 4m.

If the IC chip has a face 4m and an identification mark 4m, it is not necessary to take the direction identifying means at each terminal position as mentioned above.

The IC chip 41 seen from the active surface in FIG. 14 includes output terminals 41a and 41b, crystal unit terminals 41c and 41d, reset terminal 41e, V _DD terminal 41f, Vss terminal 41g, Test terminals 41h, 41i, 41j of IC chip monomer, circuit block detection test terminals 41k, 41l, logic control terminals 41m, 41n, 41k, 41q, 41r, 41s, and short circuit pattern after service AS terminals 41t, 41u, and 41v for time rate adjustment.

In this case, direction identification is possible at the place where the test terminal 41k is placed.

Moreover, the direction can be identified by the distance difference and, v the length difference between the terminal side of _ss (41g) and the AS terminal (41t) between V _ss terminal (41g) and the AS terminal (41t).

Further, for example, the shape of the test terminal 41j can be made larger than the other terminals as indicated by a thin line.

And the shape of the terminal is a circular shape, although not shown in the figure is preferably manufactured to form a different shape instead of a flat shape.

FIG. 15 shows the structure of each terminal of the IC chip 42 as viewed from the active side.

Since there is no terminal on the side surface 42w as shown in the drawing, direction identification is possible at the side surface 42w.

16 shows an IC chip 43 in which each terminal is located on two sides.

In the IC chip 43, the terminal material is changed, for example, the test terminal 43a is made of solder and the other terminal is made of gold bump so that the direction identification can be made by color tone.

Further, orientation can be identified from the layout plan by the position of the IC chip forming transistor, the resistance position, and the shape of each terminal connection pattern.

The height of the terminals can be changed to other terminals, and protrusions and recesses can be provided on the IC chip rear surface.

One terminal 43a 'may be located inward from the edge rather than the other terminal indicated by a thin line, may be echoed, and may further utilize multiple terminal combinations.

The above means can be combined for orientation identification of each IC chip, thereby improving the reliability.

In the above embodiment, the side where the transistor or the like forming the IC chip is located is manufactured as the active side.

As mentioned above, according to the present invention, the IC chip terminal and the wiring pattern are pressurized to obtain electrical conductivity, thereby eliminating the mounting process by wiring bonding using gold wire, casting, and soldering.

And since there are no by-products, the cleaning process can be omitted.

Moreover, since the IC chip is removed, an easy exchange is possible in the event of a coalescing failure or an IC chip and circuit board failure.

The IC chip direction identifying means is provided in the IC chip so that the circuit board pattern and the IC chip terminal correspond to a predetermined position when the IC chip is incorporated, thereby realizing an assembly which is easy to repair and prevents defects.

Since the contact voltage at the contact portion of the protrusion provided on at least one of the IC chip and the wiring pattern is increased, the conductivity is also increased.

Claims (7)

An IC chip having a plurality of terminals, a substrate having a wiring pattern formed at opposite positions of the terminals, a frame composed of an insulating member for mounting by laminating the IC chip and the substrate, and pressing the elastic part to press the wiring pattern and the IC. And a pressurizing member for obtaining electrical conductivity between chips, wherein the IC chip and the substrate are supported between the flame and the pressurizing member. The mounting structure according to claim 1, wherein the protruding portion is formed in at least one of the IC chip or the wiring pattern. The mounting structure according to claim 1, wherein the IC chip is provided with means having a fixed direction discriminating force. The mounting structure according to claim 1, wherein an IC chip plane position adjusting guide is provided in at least one of the insulating member and the flame. The mounting structure according to claim 1, wherein a part of the wiring pattern is flexible. The mounting structure according to claim 1, wherein the flame is made of a metal member having an insulating layer on the flame. The mounting structure according to claim 1, wherein wiring patterns facing each of a plurality of IC chips are formed in the flame.

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