KR910006458A - Micro Surface Treatment - Google Patents
Micro Surface Treatment Download PDFInfo
- Publication number
- KR910006458A KR910006458A KR1019900009639A KR900009639A KR910006458A KR 910006458 A KR910006458 A KR 910006458A KR 1019900009639 A KR1019900009639 A KR 1019900009639A KR 900009639 A KR900009639 A KR 900009639A KR 910006458 A KR910006458 A KR 910006458A
- Authority
- KR
- South Korea
- Prior art keywords
- agent
- microfabricated
- weight
- surface treatment
- treating agent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
Claims (9)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP163230 | 1989-06-26 | ||
JP16323089 | 1989-06-26 | ||
JP1246860A JP2852355B2 (en) | 1989-06-26 | 1989-09-21 | Fine processing surface treatment agent |
JP246860/1989 | 1989-09-21 | ||
JP1-246860 | 1989-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910006458A true KR910006458A (en) | 1991-04-29 |
KR950014734B1 KR950014734B1 (en) | 1995-12-14 |
Family
ID=15769801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900009639A KR950014734B1 (en) | 1989-06-26 | 1990-06-26 | Surface treatment agent for fine surface treatment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2852355B2 (en) |
KR (1) | KR950014734B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100439859B1 (en) * | 2001-12-21 | 2004-07-12 | 동부전자 주식회사 | Method for making a photo-resist pattern for fabricating a semiconductor device |
KR20170058691A (en) | 2015-11-19 | 2017-05-29 | 솔브레인 주식회사 | Composition for etching and manufacturing method of semiconductor device using the same |
US10414978B2 (en) | 2016-12-14 | 2019-09-17 | Samsung Electronics Co., Ltd. | Etching composition and method for fabricating semiconductor device by using the same |
US11091696B2 (en) | 2018-09-07 | 2021-08-17 | Samsung Electronics Co., Ltd. | Etching composition and method for manufacturing semiconductor device using the same |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3309392B2 (en) * | 1993-02-04 | 2002-07-29 | ダイキン工業株式会社 | Wet etching composition for semiconductor with excellent wettability |
KR0147659B1 (en) * | 1995-08-18 | 1998-08-17 | 김광호 | Cleaning solution for semiconductor device and cleaning method using the same |
JP3188843B2 (en) * | 1996-08-28 | 2001-07-16 | ステラケミファ株式会社 | Fine processing surface treatment agent and fine processing surface treatment method |
DE19805525C2 (en) * | 1998-02-11 | 2002-06-13 | Sez Semiconduct Equip Zubehoer | Process for wet-etching semiconductor wafers to produce a defined edge region by under-etching |
US6797194B1 (en) | 1998-02-27 | 2004-09-28 | Stella Chemifa Kabushiki Kaisha | Surface treating for micromachining and method for surface treatment |
JP4485302B2 (en) * | 2004-09-17 | 2010-06-23 | 株式会社半導体エネルギー研究所 | Method for manufacturing transmissive display device |
JP4485303B2 (en) * | 2004-09-17 | 2010-06-23 | 株式会社半導体エネルギー研究所 | Method for manufacturing transmissive display device |
JP2008124135A (en) * | 2006-11-09 | 2008-05-29 | Stella Chemifa Corp | Micromachining treatment agent, and micromachining treatment method using it |
KR100891255B1 (en) * | 2007-01-05 | 2009-04-01 | 주식회사 하이닉스반도체 | Etchant Compositon for Preventing Leaning of Capacitor and Method for Manufacturing Capacitor Using the Same |
JP2012193074A (en) * | 2011-03-16 | 2012-10-11 | Seiko Epson Corp | Separation method and separation apparatus |
JP2012201554A (en) * | 2011-03-25 | 2012-10-22 | Seiko Epson Corp | Method and apparatus for separation |
JP6433730B2 (en) | 2014-09-08 | 2018-12-05 | 東芝メモリ株式会社 | Semiconductor device manufacturing method and semiconductor manufacturing apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839111A (en) * | 1973-08-20 | 1974-10-01 | Rca Corp | Method of etching silicon oxide to produce a tapered edge thereon |
JPS5893238A (en) * | 1981-11-30 | 1983-06-02 | Daikin Ind Ltd | Composition for etching |
JPH0239859B2 (en) * | 1982-08-13 | 1990-09-07 | Tokyo Ohka Kogyo Co Ltd | SHIRIKOONKEIJUSHIHIMAKUYOETSUCHINGUEKI |
JPS61207586A (en) * | 1985-03-12 | 1986-09-13 | Morita Kagaku Kogyo Kk | Etching solution for silicon dioxide film |
-
1989
- 1989-09-21 JP JP1246860A patent/JP2852355B2/en not_active Expired - Lifetime
-
1990
- 1990-06-26 KR KR1019900009639A patent/KR950014734B1/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100439859B1 (en) * | 2001-12-21 | 2004-07-12 | 동부전자 주식회사 | Method for making a photo-resist pattern for fabricating a semiconductor device |
KR20170058691A (en) | 2015-11-19 | 2017-05-29 | 솔브레인 주식회사 | Composition for etching and manufacturing method of semiconductor device using the same |
US10414978B2 (en) | 2016-12-14 | 2019-09-17 | Samsung Electronics Co., Ltd. | Etching composition and method for fabricating semiconductor device by using the same |
US10793775B2 (en) | 2016-12-14 | 2020-10-06 | Samsung Electronics Co., Ltd. | Etching composition and method for fabricating semiconductor device by using the same |
US11198815B2 (en) | 2016-12-14 | 2021-12-14 | Samsung Electronics Co., Ltd. | Etching composition and method for fabricating semiconductor device by using the same |
US11091696B2 (en) | 2018-09-07 | 2021-08-17 | Samsung Electronics Co., Ltd. | Etching composition and method for manufacturing semiconductor device using the same |
Also Published As
Publication number | Publication date |
---|---|
JPH03179737A (en) | 1991-08-05 |
KR950014734B1 (en) | 1995-12-14 |
JP2852355B2 (en) | 1999-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20091110 Year of fee payment: 15 |
|
EXPY | Expiration of term |