KR910005375A - 집적회로의 와이어 본딩장치 - Google Patents
집적회로의 와이어 본딩장치 Download PDFInfo
- Publication number
- KR910005375A KR910005375A KR1019890011683A KR890011683A KR910005375A KR 910005375 A KR910005375 A KR 910005375A KR 1019890011683 A KR1019890011683 A KR 1019890011683A KR 890011683 A KR890011683 A KR 890011683A KR 910005375 A KR910005375 A KR 910005375A
- Authority
- KR
- South Korea
- Prior art keywords
- wire bonding
- integrated circuit
- lead frame
- unit
- bonding device
- Prior art date
Links
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Optical Transform (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3A도는 본 발명에 따른 제1도의 감지부 회로구성도.
제3B도는 광섬유 센서의 구조도.
Claims (1)
- 리드 프레임을 상승시켜 투입하는 입력 엘리베이타(1)와, 투입된 상기 리드 프레임을 와이어 본딩하는 와이어 본딩부(2)와, 상기 와이어 본딩부(2)상의 리드 프레임을 감지하는 감지부(3)와, 상기 감지신호에 의해 출력 엘리베이타(5)를 동작시킬 수 있는 구동부(4)로 이루어진 집적회로의 와이어 본딩장치에 있어서, 상기 감지부(3)가 리드 프레임의 유무상태에 따라 직류전압을 출력하는 광섬유 센서(10)와, 상기 광섬유 센서(10)로부터 접속되어 일정한 전압을 출력하는 전압안정기(11)와, 상기 전압안정기(11)의 출력을 지연시키는 NOT 게이트 G1및 G2로 이루어진 것을 특징으로 하는 집적회로의 와이어 본딩장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890011683A KR920010693B1 (ko) | 1989-08-17 | 1989-08-17 | 집적회로의 와이어 본딩장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890011683A KR920010693B1 (ko) | 1989-08-17 | 1989-08-17 | 집적회로의 와이어 본딩장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910005375A true KR910005375A (ko) | 1991-03-30 |
KR920010693B1 KR920010693B1 (ko) | 1992-12-12 |
Family
ID=19288981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890011683A KR920010693B1 (ko) | 1989-08-17 | 1989-08-17 | 집적회로의 와이어 본딩장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR920010693B1 (ko) |
-
1989
- 1989-08-17 KR KR1019890011683A patent/KR920010693B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920010693B1 (ko) | 1992-12-12 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20021120 Year of fee payment: 11 |
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LAPS | Lapse due to unpaid annual fee |