KR910004064A - 도전성 가열기 - Google Patents

도전성 가열기 Download PDF

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Publication number
KR910004064A
KR910004064A KR1019900010799A KR900010799A KR910004064A KR 910004064 A KR910004064 A KR 910004064A KR 1019900010799 A KR1019900010799 A KR 1019900010799A KR 900010799 A KR900010799 A KR 900010799A KR 910004064 A KR910004064 A KR 910004064A
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KR
South Korea
Prior art keywords
resin
fine
coating
particle powder
conductive
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KR1019900010799A
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English (en)
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KR0181499B1 (ko
Inventor
다까시 오오따
Original Assignee
다까시 오오따
후지이 히로까즈
후지이긴조꾸 가꼬오 가부시끼가이샤
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Application filed by 다까시 오오따, 후지이 히로까즈, 후지이긴조꾸 가꼬오 가부시끼가이샤 filed Critical 다까시 오오따
Publication of KR910004064A publication Critical patent/KR910004064A/ko
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Publication of KR0181499B1 publication Critical patent/KR0181499B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H05B3/36—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
    • H05B3/38—Powder conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/06—Treatment with inorganic compounds
    • C09C3/066—Treatment or coating resulting in a free metal containing surface-region
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C01P2004/34—Spheres hollow
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Surface Heating Bodies (AREA)
  • Secondary Cells (AREA)

Abstract

내용 없음.

Description

도전성 가열기
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 수지대 도전성 분말의 비에 관계한 저항을 나타내는 그래프,
제2도는 6V에서 본 발명의 방열 온도와 전기 저항 사이의 관계를 나타내는 그래프.

Claims (8)

  1. 미세 도전성 입자 분말이 미세 중공구면의 유리 입자 또는 내열 수지로 이루어져 있으며, 상기 입자가 금속으로 도금되어 있고, 상기 분말이 0.2∼0.9g/㎤의 체적 두께인 미세 도전성 입자 분말.
  2. 제1항에 있어서, 상기 미세 중공 구면의 분말이 4∼35㎛의 크기인 미세 도전성 입자 분말.
  3. 제1항 또는 제2항에 있어서, 도금층의 두께가 0.03∼0.8㎛인 미세 도전성 입자 분말.
  4. 제1,2 또는 3항에 있어서의 미세 도전성 입자 분말 및 합성 수지 결합제로 이루어진 발열 도전성 코팅 또는 페이스트.
  5. 제4항에 있어서, 상기 합성 수지 결합제가 미세 도전성 입자 분말의 25∼360중량부대 100중량부의 비율로 함유된 발열 도전성 코팅 또는 페이스트.
  6. 제4항에 있어서, 상기 합성 수지 결합제가 실리콘 수지, 우레탄수지, 에폭시수지, 폴리아미드수지, 폴리에스테르수지, 폴리이미드수지, 폴리올레핀수지, 폴리폴톤수지, 폴리에테르에테르 케톤수지, 폴리페닐렌 설파이드수지 및 폴리티타노카르보실탄수지로 이루어지는 군으로부터 선택된 최소한 하나의 수지인 발열 도전성 코팅 또는 페이스트.
  7. 제4,5 또는 6항에 있어서의 코팅 또는 페이스트로 바람직한 형태의 고체 또는 고체면을 코팅시키고 또는 침수시킴에 의해서 얻어진 도전성 가열기.
  8. 제4,5 또는 6항에 있어서의 코팅 또는 페이스트로 바람직한 형태의 고체 또는 고체면을 코팅시키고 또는 침수시키며 70∼350℃의 온도에서 코팅 또는 페이스트를 경화시킴에 의해서 이루어진 제7항에서의 도전성 가열기를 산출하기 위한 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900010799A 1989-07-17 1990-07-16 미세 도전성 입자 분말, 발열성 도전성 도료 또는 페이스트, 도전성 가열체, 및 그 제조 방법 KR0181499B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-182419 1989-07-17
JP182419/89 1989-07-17
JP1182419A JP2849405B2 (ja) 1989-07-17 1989-07-17 導電性発熱体

Publications (2)

Publication Number Publication Date
KR910004064A true KR910004064A (ko) 1991-02-28
KR0181499B1 KR0181499B1 (ko) 1999-05-15

Family

ID=16117957

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010799A KR0181499B1 (ko) 1989-07-17 1990-07-16 미세 도전성 입자 분말, 발열성 도전성 도료 또는 페이스트, 도전성 가열체, 및 그 제조 방법

Country Status (6)

Country Link
EP (1) EP0409099B1 (ko)
JP (1) JP2849405B2 (ko)
KR (1) KR0181499B1 (ko)
CA (1) CA2021291C (ko)
DE (1) DE69029174T2 (ko)
NO (1) NO303160B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2811611B2 (ja) * 1990-08-09 1998-10-15 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー フルオロカーボン塗料組成物
US5762830A (en) * 1995-10-23 1998-06-09 Hoechst Celanese Corporation Electronically and thermally conducting compositions for actuators
US6209457B1 (en) 1998-08-13 2001-04-03 Technology Commercialization Corp. Method and preformed composition for controlled localized heating of a base material using an exothermic reaction
KR20010016784A (ko) * 1999-08-03 2001-03-05 최병대 광택 및 반사 특성이 우수한 도금 미소 유리구슬, 그 제조방법
EP1284278B1 (de) 2001-08-14 2013-01-23 Benecke-Kaliko AG Wässrige Beschichtungszusammensetzung für die Herstellung elektrisch leitfähiger Beschichtungen auf Textilien
EP1544258A1 (en) * 2003-12-17 2005-06-22 Tarkett SAS Electrically conductive floor coverings
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
JP5215950B2 (ja) * 2009-06-26 2013-06-19 日本オクラロ株式会社 電子機器および電気的接続方法
DE102010060904A1 (de) 2010-11-30 2012-05-31 Benecke-Kaliko Ag Polymermischung
JP6639823B2 (ja) * 2015-01-13 2020-02-05 三菱マテリアル電子化成株式会社 銀被覆樹脂粒子及びその製造方法並びにそれを用いた導電性ペースト
DE102015207814A1 (de) 2015-04-28 2016-11-03 Benecke-Kaliko Ag Elektrisch leitfähige Materialzusammensetzung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (ja) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The 導電性材料
US4624865A (en) * 1984-05-21 1986-11-25 Carolina Solvents, Inc. Electrically conductive microballoons and compositions incorporating same
JPS61152775A (ja) * 1984-12-27 1986-07-11 Toshiba Corp 導電性塗料
JPS62153146A (ja) * 1985-12-26 1987-07-08 Asaoka Kk 金属被膜を有するシラスバル−ンの製造方法
DE3606653A1 (de) * 1986-02-28 1987-09-03 Mankiewicz Gebr & Co Zielobjekt

Also Published As

Publication number Publication date
DE69029174T2 (de) 1997-06-12
DE69029174D1 (de) 1997-01-02
CA2021291A1 (en) 1991-01-18
CA2021291C (en) 2000-02-01
NO903151L (no) 1991-01-18
EP0409099B1 (en) 1996-11-20
NO903151D0 (no) 1990-07-13
EP0409099A3 (en) 1991-06-05
KR0181499B1 (ko) 1999-05-15
NO303160B1 (no) 1998-06-02
EP0409099A2 (en) 1991-01-23
JPH0347878A (ja) 1991-02-28
JP2849405B2 (ja) 1999-01-20

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