KR910001918A - 반도체 조립장치 - Google Patents

반도체 조립장치 Download PDF

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Publication number
KR910001918A
KR910001918A KR1019900007176A KR900007176A KR910001918A KR 910001918 A KR910001918 A KR 910001918A KR 1019900007176 A KR1019900007176 A KR 1019900007176A KR 900007176 A KR900007176 A KR 900007176A KR 910001918 A KR910001918 A KR 910001918A
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KR
South Korea
Prior art keywords
carrying
semiconductor assembly
unit
processing unit
assembly device
Prior art date
Application number
KR1019900007176A
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English (en)
Other versions
KR940003584B1 (ko
Inventor
히로시 후지모도
슈이찌 오오사까
히사모 마즈다
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR910001918A publication Critical patent/KR910001918A/ko
Application granted granted Critical
Publication of KR940003584B1 publication Critical patent/KR940003584B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

내용 없음

Description

반도체 조립장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 관한 반도체 조립 장치를 표시하는 사시도.
제2도는 실시예의 주요부를 표시하는 사시도.

Claims (3)

  1. 미가공품을 반입하는 반입부와, 상기 반입부에 의하여 반입된 미가공품에 소정의 가공을 실시하는 가공부와, 상기 가공부에서 가공이 실시된 가공필 품을 반출하는 반출부와를 구비함과 아울러 상기 가공부는 상기 반입부 및 상기 반출부로부터 자재로히 분리하여 설치된 것을 특징으로 하는 반도체 조립장치.
  2. 제1항에 있어서, 상기 가공부는, 와이어 본딩을 행하는 반도체 조립장치.
  3. 제1항에 있어서, 상기 가공부는, 다이본딩을 행하는 반도체 조립장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900007176A 1989-06-22 1990-05-19 반도체 조립장치 KR940003584B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-158173 1989-06-22
JP1158173A JPH0671016B2 (ja) 1989-06-22 1989-06-22 半導体組立装置

Publications (2)

Publication Number Publication Date
KR910001918A true KR910001918A (ko) 1991-01-31
KR940003584B1 KR940003584B1 (ko) 1994-04-25

Family

ID=15665870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900007176A KR940003584B1 (ko) 1989-06-22 1990-05-19 반도체 조립장치

Country Status (2)

Country Link
JP (1) JPH0671016B2 (ko)
KR (1) KR940003584B1 (ko)

Also Published As

Publication number Publication date
JPH0324738A (ja) 1991-02-01
JPH0671016B2 (ja) 1994-09-07
KR940003584B1 (ko) 1994-04-25

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