KR910000349A - 전자장을 차폐하는 합성수지재료 - Google Patents

전자장을 차폐하는 합성수지재료 Download PDF

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Publication number
KR910000349A
KR910000349A KR1019890009014A KR890009014A KR910000349A KR 910000349 A KR910000349 A KR 910000349A KR 1019890009014 A KR1019890009014 A KR 1019890009014A KR 890009014 A KR890009014 A KR 890009014A KR 910000349 A KR910000349 A KR 910000349A
Authority
KR
South Korea
Prior art keywords
fillers
polymer
molding
shielding electromagnetic
particles
Prior art date
Application number
KR1019890009014A
Other languages
English (en)
Inventor
회늘 한스
크레스 게르하르트
Original Assignee
방에르트, 바르츠
바스프 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 방에르트, 바르츠, 바스프 악티엔게젤샤프트 filed Critical 방에르트, 바르츠
Publication of KR910000349A publication Critical patent/KR910000349A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00—Shielding characterised by the composition of the materials
    • G21F1/02—Selection of uniform shielding materials
    • G21F1/10—Organic substances; Dispersions in organic carriers
    • G21F1/103—Dispersions in organic carriers
    • G21F1/106—Dispersions in organic carriers metallic dispersions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음

Description

전자장을 차폐하는 합성수지재료
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 성형재료내에 불균일하게 분포되어 있는 충진재들을 함유하는 것을 특징으로 하는, 도전성이거나, 또는 전자파 방사선을 차폐하는 충진재들을 함유하는 성형물.
  2. 도전성이거나 또는 전자파 방사선을 차폐하는 충진재들을 함유하는 성형물의 제조방법에 있어서, 중합체A의 입자체들과 충진재를 함유하는 그밖의 중합체B의 입자체들을 적절한 양으로 혼합하고 그 혼합물을 직접 가공하여 원하는 성형물을 제조하는 것을 특징으로 하는 성형물의 제조방법.
  3. 혼합물이 원하는 양의 충진재들을 함유할 정도의 양으로 중합체A의 입자체들과 충진재들을 함유하는 중합체 그밖의 중합체B의 입자체들을 혼합하고 그 혼합물을 원하는 성형물이 산출되도록 직접 가공하여 얻어진 것이며 불균일하게 분포된 충진재들을 함유하는 것을 특징으로 하는, 도전성이거나 또는 전자파 방사선을 차폐하는 충전재들을 함유하는 성형물.
    ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR1019890009014A 1988-06-29 1989-06-29 전자장을 차폐하는 합성수지재료 KR910000349A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3821886A DE3821886A1 (de) 1988-06-29 1988-06-29 Gegen elektromagnetische felder abschirmende kunstharzmasse
DEP3821886.0 1988-06-29

Publications (1)

Publication Number Publication Date
KR910000349A true KR910000349A (ko) 1991-01-29

Family

ID=6357492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890009014A KR910000349A (ko) 1988-06-29 1989-06-29 전자장을 차폐하는 합성수지재료

Country Status (4)

Country Link
EP (1) EP0348794A1 (ko)
JP (1) JPH0253862A (ko)
KR (1) KR910000349A (ko)
DE (1) DE3821886A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8916223U1 (de) * 1989-05-24 1995-09-21 Dingler, Gerhard, 72221 Haiterbach Bauelement
DE4016953A1 (de) * 1990-05-25 1991-11-28 Itt Ind Gmbh Deutsche Elektronisches bauelement mit abschirmung gegen elektromagnetische stoerstrahlung und verfahren zur herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0002108B1 (en) * 1977-11-14 1982-07-21 Imperial Chemical Industries Plc Decorative acrylic sheets and articles formed therefrom
US4467060A (en) * 1983-01-24 1984-08-21 The B. F. Goodrich Company Heterogeneous rubber having low air diffusion
US4826912A (en) * 1987-07-29 1989-05-02 Armstrong World Industries, Inc. Charge dissipative floor tiles

Also Published As

Publication number Publication date
EP0348794A1 (de) 1990-01-03
JPH0253862A (ja) 1990-02-22
DE3821886A1 (de) 1990-02-08

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid