KR900701041A - 저응력 액체냉각장치 - Google Patents

저응력 액체냉각장치

Info

Publication number
KR900701041A
KR900701041A KR1019890702274A KR890702274A KR900701041A KR 900701041 A KR900701041 A KR 900701041A KR 1019890702274 A KR1019890702274 A KR 1019890702274A KR 890702274 A KR890702274 A KR 890702274A KR 900701041 A KR900701041 A KR 900701041A
Authority
KR
South Korea
Prior art keywords
cooling device
liquid cooling
low stress
stress liquid
low
Prior art date
Application number
KR1019890702274A
Other languages
English (en)
Other versions
KR0124413B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR900701041A publication Critical patent/KR900701041A/ko
Application granted granted Critical
Publication of KR0124413B1 publication Critical patent/KR0124413B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1019890702274A 1988-04-18 1989-03-29 저응력액체냉각장치 KR0124413B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/182,393 US4809134A (en) 1988-04-18 1988-04-18 Low stress liquid cooling assembly
US182,393 1988-04-18
PCT/US1989/001288 WO1989010630A1 (en) 1988-04-18 1989-03-29 Low stress liquid cooling assembly

Publications (2)

Publication Number Publication Date
KR900701041A true KR900701041A (ko) 1990-08-17
KR0124413B1 KR0124413B1 (ko) 1997-12-11

Family

ID=22668268

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890702274A KR0124413B1 (ko) 1988-04-18 1989-03-29 저응력액체냉각장치

Country Status (6)

Country Link
US (1) US4809134A (ko)
EP (1) EP0364566B1 (ko)
JP (1) JP2607964B2 (ko)
KR (1) KR0124413B1 (ko)
DE (1) DE68921406T2 (ko)
WO (1) WO1989010630A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0341950B1 (en) * 1988-05-09 1994-09-14 Nec Corporation Flat cooling structure of integrated circuit
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
US5929518A (en) * 1997-07-20 1999-07-27 Motorola, Inc. Circuit board and method
JP3315649B2 (ja) 1998-08-11 2002-08-19 富士通株式会社 電子機器
US6700396B1 (en) 2001-05-16 2004-03-02 Ltx Corporation Integrated micromachine relay for automated test equipment applications
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7508676B1 (en) * 2008-04-11 2009-03-24 International Business Machines Corporation Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
EP4025024A1 (en) * 2021-01-04 2022-07-06 Aptiv Technologies Limited Cooling device and method of manufacturing the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2813529A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Anordnung zur beidseitigen kuehlung von halbleiterbauelementen
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
DE3688962T2 (de) * 1985-10-04 1993-12-09 Fujitsu Ltd Kühlsystem für eine elektronische Schaltungsanordnung.
JPS62290161A (ja) * 1986-06-09 1987-12-17 Hitachi Ltd 電子装置の冷却装置
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly

Also Published As

Publication number Publication date
EP0364566B1 (en) 1995-03-01
KR0124413B1 (ko) 1997-12-11
DE68921406T2 (de) 1995-06-29
WO1989010630A1 (en) 1989-11-02
JPH02504207A (ja) 1990-11-29
US4809134A (en) 1989-02-28
DE68921406D1 (de) 1995-04-06
JP2607964B2 (ja) 1997-05-07
EP0364566A1 (en) 1990-04-25

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Legal Events

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Payment date: 20070718

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