DE68921406D1 - Anordnung zur flüssigkeitskühlung mit niedriger mechanischer belastung. - Google Patents

Anordnung zur flüssigkeitskühlung mit niedriger mechanischer belastung.

Info

Publication number
DE68921406D1
DE68921406D1 DE68921406T DE68921406T DE68921406D1 DE 68921406 D1 DE68921406 D1 DE 68921406D1 DE 68921406 T DE68921406 T DE 68921406T DE 68921406 T DE68921406 T DE 68921406T DE 68921406 D1 DE68921406 D1 DE 68921406D1
Authority
DE
Germany
Prior art keywords
liquid cooling
mechanical load
cooling arrangement
low mechanical
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921406T
Other languages
English (en)
Other versions
DE68921406T2 (de
Inventor
Jerry Tustaniwskyj
James Rogneby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Publication of DE68921406D1 publication Critical patent/DE68921406D1/de
Application granted granted Critical
Publication of DE68921406T2 publication Critical patent/DE68921406T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE68921406T 1988-04-18 1989-03-29 Anordnung zur flüssigkeitskühlung mit niedriger mechanischer belastung. Expired - Fee Related DE68921406T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/182,393 US4809134A (en) 1988-04-18 1988-04-18 Low stress liquid cooling assembly
PCT/US1989/001288 WO1989010630A1 (en) 1988-04-18 1989-03-29 Low stress liquid cooling assembly

Publications (2)

Publication Number Publication Date
DE68921406D1 true DE68921406D1 (de) 1995-04-06
DE68921406T2 DE68921406T2 (de) 1995-06-29

Family

ID=22668268

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921406T Expired - Fee Related DE68921406T2 (de) 1988-04-18 1989-03-29 Anordnung zur flüssigkeitskühlung mit niedriger mechanischer belastung.

Country Status (6)

Country Link
US (1) US4809134A (de)
EP (1) EP0364566B1 (de)
JP (1) JP2607964B2 (de)
KR (1) KR0124413B1 (de)
DE (1) DE68921406T2 (de)
WO (1) WO1989010630A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
US5929518A (en) * 1997-07-20 1999-07-27 Motorola, Inc. Circuit board and method
JP3315649B2 (ja) 1998-08-11 2002-08-19 富士通株式会社 電子機器
US6700396B1 (en) 2001-05-16 2004-03-02 Ltx Corporation Integrated micromachine relay for automated test equipment applications
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7508676B1 (en) * 2008-04-11 2009-03-24 International Business Machines Corporation Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2813529A1 (de) * 1978-03-29 1979-10-04 Siemens Ag Anordnung zur beidseitigen kuehlung von halbleiterbauelementen
US4226281A (en) * 1979-06-11 1980-10-07 International Business Machines Corporation Thermal conduction module
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
DE3688962T2 (de) * 1985-10-04 1993-12-09 Fujitsu Ltd Kühlsystem für eine elektronische Schaltungsanordnung.
JPS62290161A (ja) * 1986-06-09 1987-12-17 Hitachi Ltd 電子装置の冷却装置
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly

Also Published As

Publication number Publication date
EP0364566B1 (de) 1995-03-01
WO1989010630A1 (en) 1989-11-02
JPH02504207A (ja) 1990-11-29
EP0364566A1 (de) 1990-04-25
KR900701041A (ko) 1990-08-17
JP2607964B2 (ja) 1997-05-07
KR0124413B1 (ko) 1997-12-11
US4809134A (en) 1989-02-28
DE68921406T2 (de) 1995-06-29

Similar Documents

Publication Publication Date Title
DE68921406D1 (de) Anordnung zur flüssigkeitskühlung mit niedriger mechanischer belastung.
FI894095A (fi) Vaermare foer anvaendning i mikrovaogsugnar.
DE68924477D1 (de) Gleitkommaeinheit mit gleichzeitiger Multiplikation und Addition.
DE68920216D1 (de) Karte für integrierten Schaltkreis mit geringem Stromverbrauch.
DE68907130D1 (de) Integriertes triebwerk mit mehrfachfunktion.
NO861674L (no) Roerskjoet for kryogene fluider.
DE68927888D1 (de) Schalter mit Anzeiger
DE3886384D1 (de) Selbstausrichtende anordnung für flüssigkeitskühlung.
DE68907089D1 (de) Leiterplatten mit niedriger dielektrizitaetskonstante.
DE68907613D1 (de) Anordnung mit bandsperrfiltern.
TR25439A (tr) AKIM-TASIYAN SüPER-ILETKEN MOD/SüPER-ILETKEN MOD OLMAYAN BAGLANTILAR KULANAN ALCAK HARARET DERECELI SOGUTUCU CIHAZ.
KR900007064U (ko) 냉장고의 가습 장치
DE69000803D1 (de) Stromquelle mit niedrigem temperaturkoeffizient.
DE68916584D1 (de) Supraleitendes Magnetsystem mit supraleitenden Zylindern.
DE59007707D1 (de) Verbundanordnung mit leiterplatte.
DE3851819D1 (de) Hoch-TC-Supraleitende Einheiten mit geringem Oberflächenwiderstand.
DE3682415D1 (de) Widerstand und elektronische anordnung mit demselben.
DE3675898D1 (de) Silikon-hydraulikfluessigkeit mit reduzierter loeslichkeit in luft.
DE3676947D1 (de) Schaltung mit fet in schwimmender anordnung mit mehrfachen funktionen.
DE69012507D1 (de) Freigabeschaltung mit integrierter thermischer Abschaltung.
DE69009956D1 (de) Behälter mit Verbindungseinheit.
DE59003134D1 (de) Wärmespeicher mit expansionsausnehmungen.
DE68907497D1 (de) Elektro-optische anordnung.
DE68913926D1 (de) Elektronisches System mit mehreren abnehmbaren Einheiten.
DE68902913D1 (de) Fluessigkeitskompressor.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee