KR900021154U - 반도체칩의 핀절곡장치(individual roller) - Google Patents
반도체칩의 핀절곡장치(individual roller)Info
- Publication number
- KR900021154U KR900021154U KR2019890006520U KR890006520U KR900021154U KR 900021154 U KR900021154 U KR 900021154U KR 2019890006520 U KR2019890006520 U KR 2019890006520U KR 890006520 U KR890006520 U KR 890006520U KR 900021154 U KR900021154 U KR 900021154U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- bending device
- pin bending
- individual roller
- roller
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890006520U KR920001986Y1 (ko) | 1989-05-19 | 1989-05-19 | 반도체칩의 핀절곡장치(individual roller) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890006520U KR920001986Y1 (ko) | 1989-05-19 | 1989-05-19 | 반도체칩의 핀절곡장치(individual roller) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR900021154U true KR900021154U (ko) | 1990-12-14 |
| KR920001986Y1 KR920001986Y1 (ko) | 1992-03-26 |
Family
ID=19286214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019890006520U KR920001986Y1 (ko) | 1989-05-19 | 1989-05-19 | 반도체칩의 핀절곡장치(individual roller) |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR920001986Y1 (ko) |
-
1989
- 1989-05-19 KR KR2019890006520U patent/KR920001986Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR920001986Y1 (ko) | 1992-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR900012345A (ko) | 집적 회로 칩 | |
| KR910008793A (ko) | 반도체장치 및 그 제조방법 | |
| FR2625043B1 (fr) | Dispositif semi-conducteur | |
| KR900012359A (ko) | 집적회로 칩 | |
| KR890012388A (ko) | Mis형 반도체 집적회로장치 | |
| DE69026972D1 (de) | Halbleiterlaservorrichtung | |
| DE69033794D1 (de) | Halbleiteranordnung | |
| DE69031609D1 (de) | Halbleiteranordnung | |
| DE69026226D1 (de) | Integrierte Halbleiterschaltung | |
| DE69029226D1 (de) | Halbleiteranordnung | |
| KR900014991U (ko) | 반도체 패키지(package) | |
| KR890005864A (ko) | 반도체 장치 | |
| KR890004438A (ko) | 반도체 장치 | |
| DE69025825D1 (de) | Halbleiteranordnung | |
| DE69027586D1 (de) | Halbleiteranordnung | |
| KR900021154U (ko) | 반도체칩의 핀절곡장치(individual roller) | |
| KR900019203A (ko) | 반도체 장치와 반도체 장치를 사용한 전자장치 | |
| DE68929131D1 (de) | LSI-Halbleiteranordnung | |
| DE69031944D1 (de) | Integrierte halbleiterschaltung | |
| KR900012356A (ko) | 반도체장치 | |
| KR880701456A (ko) | 반도체 소자 | |
| KR900011234U (ko) | 반도체 아이시 (ic) 핀의 절곡장치 | |
| KR900019258A (ko) | 반도체장치 | |
| KR910013564A (ko) | 반도체장치 | |
| KR910005447A (ko) | 웨이퍼 스캐일(scale) 집적회로 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20030107 Year of fee payment: 12 |
|
| LAPS | Lapse due to unpaid annual fee |