KR900019108A - Magnetron sputtering device - Google Patents

Magnetron sputtering device

Info

Publication number
KR900019108A
KR900019108A KR1019900007247A KR900007247A KR900019108A KR 900019108 A KR900019108 A KR 900019108A KR 1019900007247 A KR1019900007247 A KR 1019900007247A KR 900007247 A KR900007247 A KR 900007247A KR 900019108 A KR900019108 A KR 900019108A
Authority
KR
South Korea
Prior art keywords
magnetron sputtering
sputtering device
magnetron
sputtering
Prior art date
Application number
KR1019900007247A
Other languages
Korean (ko)
Other versions
KR0168840B1 (en
Inventor
엘.앤더슨 로버트
씨.헬머 죤
Original Assignee
배리안 어소시에이츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배리안 어소시에이츠 인코포레이티드 filed Critical 배리안 어소시에이츠 인코포레이티드
Publication of KR900019108A publication Critical patent/KR900019108A/en
Application granted granted Critical
Publication of KR0168840B1 publication Critical patent/KR0168840B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J25/00—Transit-time tubes, e.g. klystrons, travelling-wave tubes, magnetrons
    • H01J25/50—Magnetrons, i.e. tubes with a magnet system producing an H-field crossing the E-field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1019900007247A 1989-05-22 1990-05-21 Sputtering apparatus of magnetron KR0168840B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/355,713 US4995958A (en) 1989-05-22 1989-05-22 Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
US355,713 1989-05-22

Publications (2)

Publication Number Publication Date
KR900019108A true KR900019108A (en) 1990-12-24
KR0168840B1 KR0168840B1 (en) 1999-01-15

Family

ID=23398527

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900007247A KR0168840B1 (en) 1989-05-22 1990-05-21 Sputtering apparatus of magnetron

Country Status (6)

Country Link
US (1) US4995958A (en)
EP (1) EP0399710B1 (en)
JP (1) JP3069576B2 (en)
KR (1) KR0168840B1 (en)
CA (1) CA2017206C (en)
DE (1) DE69007538T2 (en)

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US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
US5409590A (en) * 1989-04-17 1995-04-25 Materials Research Corporation Target cooling and support for magnetron sputter coating apparatus
EP0439360A3 (en) * 1990-01-26 1992-01-15 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
EP0439361B1 (en) * 1990-01-26 2003-06-11 Varian Semiconductor Equipment Associates Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
DE4107505A1 (en) * 1991-03-08 1992-09-10 Leybold Ag METHOD FOR OPERATING A SPUTTER, AND DEVICE FOR CARRYING OUT THE METHOD
DE4125110C2 (en) * 1991-07-30 1999-09-09 Leybold Ag Magnetron sputtering cathode for vacuum coating systems
KR950000906B1 (en) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 Sputtering apparatus
US5458759A (en) * 1991-08-02 1995-10-17 Anelva Corporation Magnetron sputtering cathode apparatus
US5194131A (en) * 1991-08-16 1993-03-16 Varian Associates, Inc. Apparatus and method for multiple ring sputtering from a single target
US5188717A (en) * 1991-09-12 1993-02-23 Novellus Systems, Inc. Sweeping method and magnet track apparatus for magnetron sputtering
US5314597A (en) * 1992-03-20 1994-05-24 Varian Associates, Inc. Sputtering apparatus with a magnet array having a geometry for a specified target erosion profile
US5248402A (en) * 1992-07-29 1993-09-28 Cvc Products, Inc. Apple-shaped magnetron for sputtering system
US5417833A (en) * 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
CH690805A5 (en) * 1993-05-04 2001-01-15 Unaxis Balzers Ag Magnetic-assisted atomization and vacuum treatment system herewith.
TW271490B (en) * 1993-05-05 1996-03-01 Varian Associates
US5738767A (en) * 1994-01-11 1998-04-14 Intevac, Inc. Substrate handling and processing system for flat panel displays
US5597459A (en) * 1995-02-08 1997-01-28 Nobler Technologies, Inc. Magnetron cathode sputtering method and apparatus
US5746897A (en) * 1995-07-10 1998-05-05 Cvc Products, Inc. High magnetic flux permanent magnet array apparatus and method for high productivity physical vapor deposition
US5770025A (en) * 1995-08-03 1998-06-23 Nihon Shinku Gijutsu Kabushiki Kaisha Magnetron sputtering apparatus
US5702573A (en) 1996-01-29 1997-12-30 Varian Associates, Inc. Method and apparatus for improved low pressure collimated magnetron sputter deposition of metal films
US5865970A (en) * 1996-02-23 1999-02-02 Permag Corporation Permanent magnet strucure for use in a sputtering magnetron
US5830327A (en) * 1996-10-02 1998-11-03 Intevac, Inc. Methods and apparatus for sputtering with rotating magnet sputter sources
US5685959A (en) * 1996-10-25 1997-11-11 Hmt Technology Corporation Cathode assembly having rotating magnetic-field shunt and method of making magnetic recording media
JPH10195649A (en) * 1996-12-27 1998-07-28 Sony Corp Magnetron sputter device and manufacture of semiconductor device
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
US5876574A (en) * 1997-04-23 1999-03-02 Applied Materials, Inc. Magnet design for a sputtering chamber
US6258217B1 (en) 1999-09-29 2001-07-10 Plasma-Therm, Inc. Rotating magnet array and sputter source
US6402903B1 (en) 2000-02-04 2002-06-11 Steag Hamatech Ag Magnetic array for sputtering system
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
US6585870B1 (en) 2000-04-28 2003-07-01 Honeywell International Inc. Physical vapor deposition targets having crystallographic orientations
JP4371569B2 (en) * 2000-12-25 2009-11-25 信越化学工業株式会社 Magnetron sputtering apparatus and photomask blank manufacturing method using the same
WO2002086186A1 (en) 2001-04-24 2002-10-31 Tosoh Smd, Inc. Target and method of optimizing target profile
KR100439474B1 (en) * 2001-09-12 2004-07-09 삼성전자주식회사 Sputtering apparatus for depositing a film
US7041200B2 (en) * 2002-04-19 2006-05-09 Applied Materials, Inc. Reducing particle generation during sputter deposition
US7297247B2 (en) * 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
US20040262148A1 (en) * 2003-06-23 2004-12-30 Cheng Yuanda Randy Sputter cathode assembly for uniform film deposition
WO2005007920A2 (en) * 2003-07-14 2005-01-27 Tosoh Smd, Inc. Sputtering target assembly having low conductivity backing plate and method of making same
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
US7018515B2 (en) * 2004-03-24 2006-03-28 Applied Materials, Inc. Selectable dual position magnetron
GB0409337D0 (en) * 2004-04-27 2004-06-02 Trikon Technologies Ltd Methods and apparatus for controlling rotating magnetic fields
US20050274610A1 (en) * 2004-05-25 2005-12-15 Victor Company Of Japan, Limited Magnetron sputtering apparatus
US7436992B2 (en) * 2004-07-30 2008-10-14 General Electric Company Methods and apparatus for testing a component
ATE423225T1 (en) * 2004-10-18 2009-03-15 Bekaert Advanced Coatings FLAT END BLOCK AS A SUPPORT FOR A ROTATING SPUTTER TARGET
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US7186319B2 (en) * 2005-01-05 2007-03-06 Applied Materials, Inc. Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
PT1856303E (en) * 2005-03-11 2009-02-27 Bekaert Advanced Coatings Single, right-angled end-block
DE102005019101A1 (en) * 2005-04-25 2006-10-26 Steag Hama Tech Ag Magnetron-driven atomization and sputtering coating process predetermines target atomization condition and modifies magnet array rotation
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US7762114B2 (en) * 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8790499B2 (en) 2005-11-25 2014-07-29 Applied Materials, Inc. Process kit components for titanium sputtering chamber
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
JP4768689B2 (en) * 2006-09-22 2011-09-07 株式会社東芝 Magnetron type sputtering apparatus and method for manufacturing semiconductor device
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
JP2009007637A (en) * 2007-06-28 2009-01-15 Fujitsu Ltd Magnetron sputtering apparatus and method for manufacturing article having thin-film formed thereon
US20090084317A1 (en) * 2007-09-28 2009-04-02 Applied Materials, Inc. Atomic layer deposition chamber and components
US7901552B2 (en) * 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
JP5166531B2 (en) * 2008-06-24 2013-03-21 キヤノンアネルバ株式会社 Magnetic field generator and plasma processing apparatus
US9771647B1 (en) 2008-12-08 2017-09-26 Michael A. Scobey Cathode assemblies and sputtering systems
US8137517B1 (en) 2009-02-10 2012-03-20 Wd Media, Inc. Dual position DC magnetron assembly
JP2010257515A (en) * 2009-04-23 2010-11-11 Showa Denko Kk Magnetron sputtering device, in-line film forming device, method for manufacturing magnetic recording medium, magnetic recording/reproducing device
CN102534529B (en) * 2010-12-24 2015-04-15 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron sputtering source and magnetron sputtering equipment
CN102560395B (en) 2010-12-29 2014-07-16 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetic source, magnetic control sputtering device and magnetic control sputtering method
CN102789938B (en) * 2011-05-18 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 The manufacture method of a kind of magnetron, magnetron and physical deposition room
CN103088306B (en) * 2011-11-03 2014-12-17 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron sputtering source and magnetron sputtering equipment
CN103177918B (en) * 2011-12-26 2016-08-31 北京北方微电子基地设备工艺研究中心有限责任公司 A kind of magnetron and plasma processing device
US8674327B1 (en) 2012-05-10 2014-03-18 WD Media, LLC Systems and methods for uniformly implanting materials on substrates using directed magnetic fields
CN104120390A (en) * 2013-04-24 2014-10-29 北京北方微电子基地设备工艺研究中心有限责任公司 Driving mechanism used for driving magnetron, and magnetron sputtering processing apparatus
CN105088162B (en) * 2015-09-02 2019-03-05 京东方科技集团股份有限公司 A kind of magnetic control plate, magnetic control means and magnetic control sputtering device
CN106609352B (en) * 2015-10-27 2019-04-23 北京北方华创微电子装备有限公司 Sputtering equipment and its operating method
BE1026859B1 (en) 2018-10-22 2020-07-14 Soleras Advanced Coatings Bv Microwave with integrated circuit for monitoring and control
US11479847B2 (en) 2020-10-14 2022-10-25 Alluxa, Inc. Sputtering system with a plurality of cathode assemblies

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
JPS6260866A (en) * 1985-08-02 1987-03-17 Fujitsu Ltd Magnetron sputtering device
JPH0240739B2 (en) * 1986-03-11 1990-09-13 Fujitsu Ltd SUPATSUTASOCHI
JPS63149374A (en) * 1986-12-12 1988-06-22 Fujitsu Ltd Sputtering device

Also Published As

Publication number Publication date
CA2017206A1 (en) 1990-11-22
JP3069576B2 (en) 2000-07-24
DE69007538T2 (en) 1994-07-21
JPH036372A (en) 1991-01-11
KR0168840B1 (en) 1999-01-15
EP0399710A1 (en) 1990-11-28
EP0399710B1 (en) 1994-03-23
US4995958A (en) 1991-02-26
DE69007538D1 (en) 1994-04-28
CA2017206C (en) 2000-04-25

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