KR900012333A - 플라즈마를 이용한 유기물질의 제거방법 - Google Patents
플라즈마를 이용한 유기물질의 제거방법Info
- Publication number
- KR900012333A KR900012333A KR1019900000240A KR900000240A KR900012333A KR 900012333 A KR900012333 A KR 900012333A KR 1019900000240 A KR1019900000240 A KR 1019900000240A KR 900000240 A KR900000240 A KR 900000240A KR 900012333 A KR900012333 A KR 900012333A
- Authority
- KR
- South Korea
- Prior art keywords
- plasma
- organic substances
- removing organic
- substances
- organic
- Prior art date
Links
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-003303 | 1989-01-10 | ||
JP1003303A JP2890432B2 (ja) | 1989-01-10 | 1989-01-10 | 有機物の灰化方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900012333A true KR900012333A (ko) | 1990-08-03 |
KR940001646B1 KR940001646B1 (ko) | 1994-02-28 |
Family
ID=11553594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900000240A KR940001646B1 (ko) | 1989-01-10 | 1990-01-10 | 플라즈마를 이용한 유기물질의 제거방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4983254A (ko) |
EP (1) | EP0379301B1 (ko) |
JP (1) | JP2890432B2 (ko) |
KR (1) | KR940001646B1 (ko) |
DE (1) | DE69023355D1 (ko) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0777211B2 (ja) * | 1987-08-19 | 1995-08-16 | 富士通株式会社 | アッシング方法 |
US5226056A (en) * | 1989-01-10 | 1993-07-06 | Nihon Shinku Gijutsu Kabushiki Kaisha | Plasma ashing method and apparatus therefor |
US5178989A (en) * | 1989-07-21 | 1993-01-12 | Board Of Regents, The University Of Texas System | Pattern forming and transferring processes |
EP0809283A3 (en) | 1989-08-28 | 1998-02-25 | Hitachi, Ltd. | Method of treating wafers |
US5228052A (en) * | 1991-09-11 | 1993-07-13 | Nihon Shinku Gijutsu Kabushiki Kaisha | Plasma ashing apparatus |
DE4132559A1 (de) * | 1991-09-30 | 1993-04-08 | Siemens Ag | Verfahren zur in-situ-reinigung von abscheidekammern durch plasmaaetzen |
DE4202158C1 (ko) * | 1992-01-27 | 1993-07-22 | Siemens Ag, 8000 Muenchen, De | |
DE4202651A1 (de) * | 1992-01-30 | 1993-08-05 | Fraunhofer Ges Forschung | Verfahren zur trockenentwicklung einer siliziumhaltigen ultraviolett- und/oder elektronenstrahlempfindlichen lackschicht |
KR100293830B1 (ko) * | 1992-06-22 | 2001-09-17 | 리차드 에이치. 로브그렌 | 플라즈마 처리 쳄버내의 잔류물 제거를 위한 플라즈마 정결방법 |
US5387289A (en) * | 1992-09-22 | 1995-02-07 | Genus, Inc. | Film uniformity by selective pressure gradient control |
JP3231426B2 (ja) * | 1992-10-28 | 2001-11-19 | 富士通株式会社 | 水素プラズマダウンフロー処理方法及び水素プラズマダウンフロー処理装置 |
US5445679A (en) * | 1992-12-23 | 1995-08-29 | Memc Electronic Materials, Inc. | Cleaning of polycrystalline silicon for charging into a Czochralski growing process |
DE4308990A1 (de) * | 1993-03-20 | 1994-09-22 | Bosch Gmbh Robert | Ätzverfahren und Vorrichtung zur Reinigung von Halbleiterelementen, insbesondere Leistungsdioden |
JPH06285868A (ja) * | 1993-03-30 | 1994-10-11 | Bridgestone Corp | 加硫金型の清浄方法 |
JP2804700B2 (ja) * | 1993-03-31 | 1998-09-30 | 富士通株式会社 | 半導体装置の製造装置及び半導体装置の製造方法 |
JP3288490B2 (ja) * | 1993-07-09 | 2002-06-04 | 富士通株式会社 | 半導体装置の製造方法及び半導体装置の製造装置 |
EP0692140A1 (en) * | 1994-02-03 | 1996-01-17 | Applied Materials, Inc. | Stripping, passivation and corrosion inhibition of semiconductor substrates |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
JP3438109B2 (ja) * | 1994-08-12 | 2003-08-18 | 富士通株式会社 | プラズマ処理装置及びプラズマ処理方法 |
JPH08186098A (ja) * | 1994-12-27 | 1996-07-16 | Ryoden Semiconductor Syst Eng Kk | 感光性樹脂の除去方法および除去装置 |
US5671116A (en) * | 1995-03-10 | 1997-09-23 | Lam Research Corporation | Multilayered electrostatic chuck and method of manufacture thereof |
US5753567A (en) * | 1995-08-28 | 1998-05-19 | Memc Electronic Materials, Inc. | Cleaning of metallic contaminants from the surface of polycrystalline silicon with a halogen gas or plasma |
US5835333A (en) * | 1995-10-30 | 1998-11-10 | Lam Research Corporation | Negative offset bipolar electrostatic chucks |
US5693147A (en) * | 1995-11-03 | 1997-12-02 | Motorola, Inc. | Method for cleaning a process chamber |
US5780359A (en) * | 1995-12-11 | 1998-07-14 | Applied Materials, Inc. | Polymer removal from top surfaces and sidewalls of a semiconductor wafer |
US5614026A (en) * | 1996-03-29 | 1997-03-25 | Lam Research Corporation | Showerhead for uniform distribution of process gas |
US5812361A (en) * | 1996-03-29 | 1998-09-22 | Lam Research Corporation | Dynamic feedback electrostatic wafer chuck |
US5998305A (en) * | 1996-03-29 | 1999-12-07 | Praxair Technology, Inc. | Removal of carbon from substrate surfaces |
JPH09270421A (ja) | 1996-04-01 | 1997-10-14 | Mitsubishi Electric Corp | 表面処理装置および表面処理方法 |
US6015761A (en) * | 1996-06-26 | 2000-01-18 | Applied Materials, Inc. | Microwave-activated etching of dielectric layers |
US5925577A (en) * | 1997-02-19 | 1999-07-20 | Vlsi Technology, Inc. | Method for forming via contact hole in a semiconductor device |
US7001848B1 (en) * | 1997-11-26 | 2006-02-21 | Texas Instruments Incorporated | Hydrogen plasma photoresist strip and polymeric residue cleanup process for oxygen-sensitive materials |
US6080680A (en) * | 1997-12-19 | 2000-06-27 | Lam Research Corporation | Method and composition for dry etching in semiconductor fabrication |
EP0940846A1 (en) * | 1998-03-06 | 1999-09-08 | Interuniversitair Micro-Elektronica Centrum Vzw | Method for stripping ion implanted photoresist layer |
US6387819B1 (en) * | 1998-04-29 | 2002-05-14 | Applied Materials, Inc. | Method for etching low K dielectric layers |
US6410417B1 (en) * | 1998-11-05 | 2002-06-25 | Promos Technologies, Inc. | Method of forming tungsten interconnect and vias without tungsten loss during wet stripping of photoresist polymer |
US6599829B2 (en) * | 1998-11-25 | 2003-07-29 | Texas Instruments Incorporated | Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization |
US6242350B1 (en) | 1999-03-18 | 2001-06-05 | Taiwan Semiconductor Manufacturing Company | Post gate etch cleaning process for self-aligned gate mosfets |
US6610168B1 (en) * | 1999-08-12 | 2003-08-26 | Sipec Corporation | Resist film removal apparatus and resist film removal method |
US20050022839A1 (en) * | 1999-10-20 | 2005-02-03 | Savas Stephen E. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US6805139B1 (en) | 1999-10-20 | 2004-10-19 | Mattson Technology, Inc. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US6440874B1 (en) * | 2000-03-24 | 2002-08-27 | Advanced Micro Devices, Inc. | High throughput plasma resist strip process for temperature sensitive applications |
US6440864B1 (en) | 2000-06-30 | 2002-08-27 | Applied Materials Inc. | Substrate cleaning process |
US6692903B2 (en) | 2000-12-13 | 2004-02-17 | Applied Materials, Inc | Substrate cleaning apparatus and method |
CN1461493A (zh) * | 2000-12-18 | 2003-12-10 | 住友精密工业株式会社 | 清洗方法和腐蚀方法 |
JP2006019414A (ja) * | 2004-06-30 | 2006-01-19 | Canon Inc | プラズマ処理装置 |
US20070193602A1 (en) * | 2004-07-12 | 2007-08-23 | Savas Stephen E | Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing |
US20070123049A1 (en) * | 2005-11-17 | 2007-05-31 | Kao-Su Huang | Semiconductor process and method for removing condensed gaseous etchant residues on wafer |
JP4946321B2 (ja) * | 2006-09-29 | 2012-06-06 | 富士通セミコンダクター株式会社 | 基板処理装置及び基板処理方法 |
US20080296258A1 (en) * | 2007-02-08 | 2008-12-04 | Elliott David J | Plenum reactor system |
TWI576938B (zh) | 2012-08-17 | 2017-04-01 | 斯克林集團公司 | 基板處理裝置及基板處理方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699689A (en) * | 1985-05-17 | 1987-10-13 | Emergent Technologies Corporation | Method and apparatus for dry processing of substrates |
US4749440A (en) * | 1985-08-28 | 1988-06-07 | Fsi Corporation | Gaseous process and apparatus for removing films from substrates |
JPS62213126A (ja) * | 1986-03-13 | 1987-09-19 | Fujitsu Ltd | マイクロ波プラズマ処理装置 |
EP0328350B1 (en) * | 1988-02-09 | 1999-04-28 | Fujitsu Limited | Dry etching with hydrogen bromide or bromine |
US4961820A (en) * | 1988-06-09 | 1990-10-09 | Fujitsu Limited | Ashing method for removing an organic film on a substance of a semiconductor device under fabrication |
JPH02174120A (ja) * | 1988-12-27 | 1990-07-05 | Toshiba Corp | 有機高分子膜の除去方法 |
-
1989
- 1989-01-10 JP JP1003303A patent/JP2890432B2/ja not_active Expired - Lifetime
-
1990
- 1990-01-04 US US07/460,798 patent/US4983254A/en not_active Expired - Lifetime
- 1990-01-10 KR KR1019900000240A patent/KR940001646B1/ko not_active IP Right Cessation
- 1990-01-10 EP EP90300282A patent/EP0379301B1/en not_active Expired - Lifetime
- 1990-01-10 DE DE69023355T patent/DE69023355D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2890432B2 (ja) | 1999-05-17 |
KR940001646B1 (ko) | 1994-02-28 |
EP0379301B1 (en) | 1995-11-08 |
DE69023355D1 (de) | 1995-12-14 |
US4983254A (en) | 1991-01-08 |
JPH02183528A (ja) | 1990-07-18 |
EP0379301A1 (en) | 1990-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
AMND | Amendment | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |
|
G160 | Decision to publish patent application | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090225 Year of fee payment: 16 |
|
EXPY | Expiration of term |