DE69006622D1 - Vorrichtung zum Plasmaverfahren. - Google Patents

Vorrichtung zum Plasmaverfahren.

Info

Publication number
DE69006622D1
DE69006622D1 DE90107369T DE69006622T DE69006622D1 DE 69006622 D1 DE69006622 D1 DE 69006622D1 DE 90107369 T DE90107369 T DE 90107369T DE 69006622 T DE69006622 T DE 69006622T DE 69006622 D1 DE69006622 D1 DE 69006622D1
Authority
DE
Germany
Prior art keywords
plasma process
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE90107369T
Other languages
English (en)
Other versions
DE69006622T2 (de
Inventor
Hiroshi Kojima
Yoshifumi Tahara
Izumi Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69006622D1 publication Critical patent/DE69006622D1/de
Application granted granted Critical
Publication of DE69006622T2 publication Critical patent/DE69006622T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • ing And Chemical Polishing (AREA)
DE69006622T 1989-04-18 1990-04-18 Vorrichtung zum Plasmaverfahren. Expired - Lifetime DE69006622T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9906889 1989-04-18

Publications (2)

Publication Number Publication Date
DE69006622D1 true DE69006622D1 (de) 1994-03-24
DE69006622T2 DE69006622T2 (de) 1994-07-14

Family

ID=14237510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69006622T Expired - Lifetime DE69006622T2 (de) 1989-04-18 1990-04-18 Vorrichtung zum Plasmaverfahren.

Country Status (4)

Country Link
US (1) US5858258A (de)
EP (1) EP0393637B1 (de)
KR (1) KR0156244B1 (de)
DE (1) DE69006622T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1322556C (zh) * 2001-02-15 2007-06-20 东京毅力科创株式会社 被处理件的处理方法及处理装置
JP4115155B2 (ja) 2002-04-11 2008-07-09 東京エレクトロン株式会社 プラズマ処理装置の真空処理室内部品の帯電抑制方法
JP4294976B2 (ja) * 2003-02-27 2009-07-15 東京エレクトロン株式会社 基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491173A (en) * 1982-05-28 1985-01-01 Temptronic Corporation Rotatable inspection table
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
US4534816A (en) * 1984-06-22 1985-08-13 International Business Machines Corporation Single wafer plasma etch reactor
US4863561A (en) * 1986-12-09 1989-09-05 Texas Instruments Incorporated Method and apparatus for cleaning integrated circuit wafers
JPS63204726A (ja) * 1987-02-20 1988-08-24 Anelva Corp 真空処理装置
US4915777A (en) * 1987-07-16 1990-04-10 Texas Instruments Incorporated Method for etching tungsten
US4998979A (en) * 1988-06-06 1991-03-12 Canon Kabushiki Kaisha Method for washing deposition film-forming device
JPH0276223A (ja) * 1988-08-05 1990-03-15 Siemens Ag 金属接触の製造方法と装置

Also Published As

Publication number Publication date
US5858258A (en) 1999-01-12
EP0393637A1 (de) 1990-10-24
KR0156244B1 (ko) 1998-12-01
DE69006622T2 (de) 1994-07-14
KR900017120A (ko) 1990-11-15
EP0393637B1 (de) 1994-02-16

Similar Documents

Publication Publication Date Title
DE69002251D1 (de) Vorrichtung zum brechen von tabletten.
DE68910372D1 (de) Vorrichtung zum Vakuumformen.
DE69103377D1 (de) Vorrichtung zum synchronisierten Schneiden.
DE69417441D1 (de) Vorrichtung zum herstellen von verbindungen
DE59008476D1 (de) Vorrichtung zum Überführen flacher Gegenstände.
DE59007782D1 (de) Vorrichtung zum Erhitzen von Gasen.
DE59104603D1 (de) Vorrichtung zum Verlagern von Patienten.
DE69007903D1 (de) Vorrichtung zum Verpacken.
DE68910381D1 (de) Vorrichtung zum Herstellen von Rohren.
DE59003423D1 (de) Vorrichtung zum Injizieren von Flüssigkeiten.
DE69109287D1 (de) Vorrichtung zum unterscheiden von münzen.
DE68920911D1 (de) Vorrichtung zum Auftragen mehrerer Flüssigkeiten.
DE59000515D1 (de) Vorrichtung zum entschlammen von baedern.
DE69007727D1 (de) Vorrichtung zum Bearbeiten nichtkreisförmiger Werkstücke.
DE69108838D1 (de) Vorrichtung zum Ätzen von Plättchen.
DE69015479D1 (de) Vorrichtung zum Reinigen von Webstühlen.
DE69203669D1 (de) Vorrichtung zum herstellen von halbleitern.
DE59007202D1 (de) Vorrichtung zum Klemmen von Schläuchen.
DE69000834D1 (de) Vorrichtung zum drehen von dosendeckeln.
DE59300775D1 (de) Vorrichtung zum Verbinden zylindrischer Bauteile.
DE69300681D1 (de) Vorrichtung zum Zubereiten von Getränken.
DE3860528D1 (de) Vorrichtung zum aufnehmen von stueckguetern.
DE59002539D1 (de) Vorrichtung zum Auslegen von Druckereiprodukten.
DE69101517D1 (de) Vorrichtung zum gleichzeitigen Positionieren von mehreren Schraubverbindungselementen.
DE69101265D1 (de) Vorrichtung zum Erwärmen von Werkstücken.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition