KR900008995B1 - 고주파 반도체 소자용 세라믹 패키지 - Google Patents

고주파 반도체 소자용 세라믹 패키지 Download PDF

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Publication number
KR900008995B1
KR900008995B1 KR1019870014139A KR870014139A KR900008995B1 KR 900008995 B1 KR900008995 B1 KR 900008995B1 KR 1019870014139 A KR1019870014139 A KR 1019870014139A KR 870014139 A KR870014139 A KR 870014139A KR 900008995 B1 KR900008995 B1 KR 900008995B1
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KR
South Korea
Prior art keywords
ceramic
base
package
conductors
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870014139A
Other languages
English (en)
Korean (ko)
Other versions
KR880008441A (ko
Inventor
에스. 파이 윌리암
엠. 어리 제임스
제이. 네거스 켈빈
Original Assignee
페어차일드 세미콘덕터 코포레이션
죤 웹
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 페어차일드 세미콘덕터 코포레이션, 죤 웹 filed Critical 페어차일드 세미콘덕터 코포레이션
Publication of KR880008441A publication Critical patent/KR880008441A/ko
Application granted granted Critical
Publication of KR900008995B1 publication Critical patent/KR900008995B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Casings For Electric Apparatus (AREA)
  • Microwave Amplifiers (AREA)
  • Wire Bonding (AREA)
KR1019870014139A 1986-12-19 1987-12-11 고주파 반도체 소자용 세라믹 패키지 Expired KR900008995B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US94449986A 1986-12-19 1986-12-19
US944,499 1986-12-19
US944499 1992-09-14

Publications (2)

Publication Number Publication Date
KR880008441A KR880008441A (ko) 1988-08-31
KR900008995B1 true KR900008995B1 (ko) 1990-12-17

Family

ID=25481524

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870014139A Expired KR900008995B1 (ko) 1986-12-19 1987-12-11 고주파 반도체 소자용 세라믹 패키지

Country Status (3)

Country Link
EP (1) EP0272188A3 (https=)
JP (1) JPS63192262A (https=)
KR (1) KR900008995B1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0331289A3 (en) * 1988-02-26 1991-04-03 Hitachi, Ltd. Semiconductor device with impedance matching means
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US4994902A (en) * 1988-11-30 1991-02-19 Hitachi, Ltd. Semiconductor devices and electronic system incorporating them
EP0375461A3 (en) * 1988-12-23 1991-07-03 Kabushiki Kaisha Toshiba Semiconductor device being packaged
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
EP0459179B1 (de) * 1990-05-28 1995-04-05 Siemens Aktiengesellschaft IC-Gehäuse, bestehend aus drei beschichteten dielektrischen Platten
US7602050B2 (en) * 2005-07-18 2009-10-13 Qualcomm Incorporated Integrated circuit packaging
CN112018066B (zh) * 2020-07-27 2022-09-20 中国电子科技集团公司第十三研究所 基于htcc的高频垂直互联结构及封装结构
CN114256188A (zh) * 2020-09-22 2022-03-29 华为技术有限公司 封装基板、封装结构、电子设备及制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1305115A (fr) * 1960-11-10 1962-09-28 Rca Corp Microélément de circuit électronique et ses modes de réalisation
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package
JPS564595B2 (https=) * 1972-04-28 1981-01-30
US3908185A (en) * 1974-03-06 1975-09-23 Rca Corp High frequency semiconductor device having improved metallized patterns
JPS5640674A (en) * 1979-09-11 1981-04-16 Fujimoto Seiyaku Kk Novel cyclic urethane compound and its preparation
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation

Also Published As

Publication number Publication date
EP0272188A2 (en) 1988-06-22
JPS63192262A (ja) 1988-08-09
KR880008441A (ko) 1988-08-31
JPH0322060B2 (https=) 1991-03-26
EP0272188A3 (en) 1988-10-26

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