KR900001833B1 - 수지봉합형 반도체장치 - Google Patents

수지봉합형 반도체장치 Download PDF

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Publication number
KR900001833B1
KR900001833B1 KR1019860004702A KR860004702A KR900001833B1 KR 900001833 B1 KR900001833 B1 KR 900001833B1 KR 1019860004702 A KR1019860004702 A KR 1019860004702A KR 860004702 A KR860004702 A KR 860004702A KR 900001833 B1 KR900001833 B1 KR 900001833B1
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KR
South Korea
Prior art keywords
resin
heat sink
mold layer
semiconductor device
resin mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860004702A
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English (en)
Korean (ko)
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KR870000753A (ko
Inventor
도시히로 가토오
Original Assignee
가부시끼가이샤 도오시바
와타리 스기이찌로
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도오시바, 와타리 스기이찌로 filed Critical 가부시끼가이샤 도오시바
Publication of KR870000753A publication Critical patent/KR870000753A/ko
Application granted granted Critical
Publication of KR900001833B1 publication Critical patent/KR900001833B1/ko
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019860004702A 1985-06-20 1986-06-13 수지봉합형 반도체장치 Expired KR900001833B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60-134658 1985-06-20
JP134658 1985-06-20
JP60134658A JPS61292346A (ja) 1985-06-20 1985-06-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
KR870000753A KR870000753A (ko) 1987-02-20
KR900001833B1 true KR900001833B1 (ko) 1990-03-24

Family

ID=15133527

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004702A Expired KR900001833B1 (ko) 1985-06-20 1986-06-13 수지봉합형 반도체장치

Country Status (2)

Country Link
JP (1) JPS61292346A (cg-RX-API-DMAC7.html)
KR (1) KR900001833B1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503029B2 (ja) * 1987-10-06 1996-06-05 沖電気工業株式会社 薄型構造の半導体装置の製造方法
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post

Also Published As

Publication number Publication date
JPS61292346A (ja) 1986-12-23
KR870000753A (ko) 1987-02-20
JPH0363822B2 (cg-RX-API-DMAC7.html) 1991-10-02

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