KR890700696A - 구리 및 구리-함유 합금의 엣칭 - Google Patents
구리 및 구리-함유 합금의 엣칭Info
- Publication number
- KR890700696A KR890700696A KR1019880701600A KR880701600A KR890700696A KR 890700696 A KR890700696 A KR 890700696A KR 1019880701600 A KR1019880701600 A KR 1019880701600A KR 880701600 A KR880701600 A KR 880701600A KR 890700696 A KR890700696 A KR 890700696A
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- etching
- containing alloys
- alloys
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 2
- 229910052802 copper Inorganic materials 0.000 title 2
- 239000010949 copper Substances 0.000 title 2
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/058,066 US4859281A (en) | 1987-06-04 | 1987-06-04 | Etching of copper and copper bearing alloys |
PCT/US1988/001803 WO1988009829A1 (en) | 1987-06-04 | 1988-05-27 | Etching of copper and copper bearing alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
KR890700696A true KR890700696A (ko) | 1989-04-26 |
Family
ID=22014449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880701600A KR890700696A (ko) | 1987-06-04 | 1988-12-05 | 구리 및 구리-함유 합금의 엣칭 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4859281A (ko) |
EP (1) | EP0315677A4 (ko) |
JP (1) | JPH01503470A (ko) |
KR (1) | KR890700696A (ko) |
WO (1) | WO1988009829A1 (ko) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06287774A (ja) * | 1993-04-05 | 1994-10-11 | Metsuku Kk | 銅および銅合金の表面処理剤 |
US5630950A (en) * | 1993-07-09 | 1997-05-20 | Enthone-Omi, Inc. | Copper brightening process and bath |
US5431776A (en) * | 1993-09-08 | 1995-07-11 | Phibro-Tech, Inc. | Copper etchant solution additives |
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
JP3284057B2 (ja) * | 1996-06-27 | 2002-05-20 | ワイケイケイ株式会社 | スライドファスナー又はそのチェーンの製造方法 |
US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US6806206B2 (en) * | 2001-03-29 | 2004-10-19 | Sony Corporation | Etching method and etching liquid |
US6506062B1 (en) | 2001-08-01 | 2003-01-14 | Visteon Global Technologies, Inc. | Circuit board having an integrated circuit board connector and method of making the same |
DE10302596A1 (de) * | 2002-01-24 | 2003-08-28 | Shipley Company Marlborough | Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse |
US6841263B2 (en) * | 2002-05-03 | 2005-01-11 | The John Hopkins University | Method of adhering a solid polymer to a substrate and resulting article |
US6784107B1 (en) | 2003-03-18 | 2004-08-31 | Hui Chen | Method for planarizing a copper interconnect structure |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
US7591956B2 (en) * | 2006-05-03 | 2009-09-22 | OMG Electronic Chemicals, Inc. | Method and composition for selectively stripping nickel from a substrate |
WO2008061258A2 (en) * | 2006-11-17 | 2008-05-22 | Sachem, Inc. | Selective metal wet etch composition and process |
US8303832B2 (en) * | 2009-08-17 | 2012-11-06 | Palo Alto Research Center Incorporated | Solid inks for masks for printed circuit boards and other electronic devices |
US8211617B2 (en) | 2009-08-17 | 2012-07-03 | Palo Alto Research Center Incorporated | Solid inks for printed masks |
US8524540B2 (en) * | 2011-02-01 | 2013-09-03 | Nilesh Kapadia | Adhesion promoting composition for metal leadframes |
KR101924384B1 (ko) * | 2012-12-28 | 2018-12-03 | 동우 화인켐 주식회사 | 구리계 금속막의 식각액 조성물 |
KR101527117B1 (ko) | 2013-06-27 | 2015-06-09 | 삼성디스플레이 주식회사 | 식각액 조성물, 이를 이용한 금속 배선 제조 방법 및 박막 트랜지스터 기판 제조방법 |
US10501854B2 (en) | 2015-07-06 | 2019-12-10 | James Weifu Lee | Localized excess protons and methods of making and using same |
KR102433337B1 (ko) * | 2015-07-23 | 2022-08-17 | 동우 화인켐 주식회사 | 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법 |
EP3518631A1 (en) | 2018-01-29 | 2019-07-31 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Anisotropic etching using highly branched polymers |
EP3745832B1 (en) | 2019-05-27 | 2023-05-03 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Anisotropic etching using photopolymerizable compound |
CN114807942B (zh) * | 2022-03-07 | 2024-02-13 | 上海富柏化工有限公司 | 一种过硫酸钠微蚀添加剂及其应用 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE657099A (ko) * | 1963-12-30 | |||
NL154561B (nl) * | 1965-04-27 | 1977-09-15 | Lancy Lab | Werkwijze voor het verwijderen van koper(i)oxyde en koper(ii)oxyde van een voorwerp met een oppervlak van koper of een koperlegering, werkwijze voor het bereiden van een hiervoor toe te passen beitsvloeistof en de door toepassing van deze beitswerkwijze verkregen voorwerpen. |
US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
JPS502382B1 (ko) * | 1967-03-31 | 1975-01-25 | ||
US3597290A (en) * | 1968-03-25 | 1971-08-03 | Mitsubishi Edogawa Kagaku Kk | Method for chemically dissolving metal |
US3668131A (en) * | 1968-08-09 | 1972-06-06 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
BE758162A (fr) * | 1969-10-28 | 1971-04-01 | Fmc Corp | Stabilisation de solutions acidifiees d'eau |
JPS5221460B1 (ko) * | 1971-04-26 | 1977-06-10 | ||
JPS5120972B1 (ko) * | 1971-05-13 | 1976-06-29 | ||
JPS5037159B2 (ko) * | 1973-02-21 | 1975-12-01 | ||
JPS5332341B2 (ko) * | 1973-03-27 | 1978-09-07 | ||
JPS50145342A (ko) * | 1974-05-15 | 1975-11-21 | ||
SE400575B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for betning av koppar och dess legeringar |
SE400581B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for kemisk polering av koppar och dess legeringar |
IT1099126B (it) * | 1978-09-21 | 1985-09-18 | Ates Componenti Elettron | Bagno per la deposizione mediante elettroforesi di un rivestimento isolante su un corpo semiconduttore |
US4233113A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant |
US4236957A (en) * | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
US4384979A (en) * | 1980-10-31 | 1983-05-24 | Atlantic Richfield Company | Corrosion inhibitor |
JPS57134563A (en) * | 1981-02-12 | 1982-08-19 | Nippon Peroxide Co Ltd | Etching agent for electroless plated thin nickel film |
JPS58197277A (ja) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | 金属の化学的溶解処理液 |
US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
US4437928A (en) * | 1983-08-22 | 1984-03-20 | Dart Industries Inc. | Dissolution of metals utilizing a glycol ether |
US4510018A (en) * | 1984-02-21 | 1985-04-09 | The Lea Manufacturing Company | Solution and process for treating copper and copper alloys |
JPS60190582A (ja) * | 1984-03-12 | 1985-09-28 | Canon Electronics Inc | リン青銅合金の化学研摩液 |
US4686059A (en) * | 1986-02-12 | 1987-08-11 | First Brands Corporation | Antimony tartrate corrosion inhibitive composition for coolant systems |
-
1987
- 1987-06-04 US US07/058,066 patent/US4859281A/en not_active Expired - Lifetime
-
1988
- 1988-05-27 EP EP19880905317 patent/EP0315677A4/en not_active Withdrawn
- 1988-05-27 WO PCT/US1988/001803 patent/WO1988009829A1/en not_active Application Discontinuation
- 1988-05-27 JP JP63504962A patent/JPH01503470A/ja active Pending
- 1988-12-05 KR KR1019880701600A patent/KR890700696A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH01503470A (ja) | 1989-11-22 |
EP0315677A1 (en) | 1989-05-17 |
EP0315677A4 (en) | 1989-10-11 |
US4859281A (en) | 1989-08-22 |
WO1988009829A1 (en) | 1988-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |