KR890017031A - 코온 및 페이스접합을 가진 공구의 또 공구홀더의 부착장치의 장착을 위한, 특히 기울기있는, 특히 7/24 경사를 가진 쌩크를 가진 공구의 자동 혹은 수동교환을 위한, 장치 - Google Patents
코온 및 페이스접합을 가진 공구의 또 공구홀더의 부착장치의 장착을 위한, 특히 기울기있는, 특히 7/24 경사를 가진 쌩크를 가진 공구의 자동 혹은 수동교환을 위한, 장치 Download PDFInfo
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- KR890017031A KR890017031A KR1019880011084A KR880011084A KR890017031A KR 890017031 A KR890017031 A KR 890017031A KR 1019880011084 A KR1019880011084 A KR 1019880011084A KR 880011084 A KR880011084 A KR 880011084A KR 890017031 A KR890017031 A KR 890017031A
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명에 따른 장치의 측면단면도로, 두 절반단면을 따라, 상부에서는 최종 조절전의 부착장치를, 바닥부분에서는 조절후 스핀들에 고착된 부착장치를 보여주고 있는 도면, 제 2 도와 제 3 도는 본 발명에 따른 장치에 의해 공구홀더(삽입-홀더)를 장착함을 보여주는 측면도.
Claims (9)
- 코온 및 페이스 맞춤(cone and face application)하는, 특히, 기울기 있는 쌩크, 특히 7/24 경사를 가진 쌩크를 가진 자동 혹은 수동교환공구를 가진 머신닝 및 터닝 센터용의 부착장치 공구홀더 및 공구의 장착을 위한 장치로, 기본적으로 스핀들내로의 유입을 위한 코온(1)과, 코온(1)에 중심을 두고, 스핀들의 면에 정하기 위한 플랜지를 구비한 전방부품(2)과, 코온(1)과 전방부품(2)의 조립을 위한 노브(3)로 구성된 장치에 있어서, 조립노브(assebly knod)(3)가 코온(1)과 전방부품(2)사이의 조절가능하고, 변형되지 않는 중간연결장치(4)상에 작용함을 특징으로 하는 장치.
- 제 1 항에 있어서, 코온(1)과 전방부품(2)사이의 조절가능하고, 변형되지 않는 중간연결장치(4)가 전방부품(2)을 수용하기 위해 구멍(6)의 바닥에 구비된 구멍에 장착되고, 노브(3)의 나사와 정합하도록된 암나사(7)를 가진 중간부품(5)과, 큰 직경을 가진 부분을 측부반대노부(3)상의 부품(5)의 암나사(7)속으로 들어가고, 작은 직경을 가진 부분은 전방부품(2)의 배면의 중앙암나사(9)속으로 들어가는 서로 다른 피치를 가진 턱있는 볼트(8)와, 중간부품(5)과 전방부품(2)의 대향면들사이에 장작되고 벨리빌리 와샤(belleville washers)혹은 압축스프링의 스택형태의 탄성 유니트(11)와, 하우징(6)의 요홈(13)내에서 안내되고 전방부품(2)의 중심 실린더와 일체로된 키이(12)와, 전방부품(2)내의 볼트(8)의 해당단부를 잠그기 위한 넛트(14)와, 볼트(8)의 반대단부속으로 나사박음되는 잠금노브(3)를 위한 넛트(15)로 구성되어 있음을 특징으로 하는 장치.
- 제 2 항에 있어서, 중간부품(5)이, 노브(3)를 향한 그의 단부에, 특정의 랜치에 의해 조작할 수 있도록 가로방향 요홈(16)을 구비하며, 전방부품(2)을 향한 그의 단부에는, 일정한 간격으로, 방사상의 구멍(18)을 구비한 플랜지(17)를 가지고 있고, 코온(1)은 전술한 방사상구멍(18)의 높이에서 전술한 방사상구멍(18)중 하나에 삽입되어질 파지로드(holding rod)의 통과를 위한 적어도 하나의 구멍(19)을 구비함을 특징으로 하는 장치.
- 제 2 항에 있어서, 볼트(8)가 축방향의 관통구멍을 구비하고 있고, 전방부품(2)속으로 나사박힘되어 들어갈 단부에, 육각중공부형태의 육각조작구멍(20)을 구비하고 있고, 넛트(14)와 (15)는 각기. 역시 육각중공부형태의 육각조정구멍(21)과 (22)을 구비하고 있으며, 넛트(15)의 육각부(22)는 노브(3)의 구멍(23)을 통하여 조작될 수 있고, 넛트(14)의 육각부(21)는 전방부품(2)으로부터의 공구수용을 위한 기울기있는 구멍(24)을 통하여 조절될 수 있음을 특징으로 하는 장치.
- 제 1 항, 제 2 항 및 제 4 항중 어느 한항에 있어서, 볼트(8), 노브(3)가 코온(1)의 등에 중심을 두고 전방부품(2)에 고착된 긴 노브임과, 코온(1)과 전방부품(2)의 수동잠금이 긴 노브를 잠그고 다음 전술한 긴 노브에 넛트를 정합함에 의해 유니트를 잠금을 포함하지 않는 장치.
- 제 1 항 내지 제 5 항중 어느 한항에 있어서, 이 장치가 전방부품의 플랜지의 큰 폭의 요홈(38)내에 내장되는, 테논(38)에 놓이는 점선볼트(32)에 의해 인서트-홀더(29)의 조절을 가능하게 만들고, 원주방향으로 약간 길죽하게된 구형 마아크(spherical marks)(31)를 구비하여, 또 장치내에 장착된 숫모듈요소(30)에 테논(28)과 120℃에서 위치된 구형단부(spherical ends)(27)를 가진 두 볼트를 포함하는 모듈시스템에 의해 고착된 인서터-홀더요소 모듈요소(25,29)를 구비하고 있음을 특징으로 하는 장치.
- 제 1 항 내지 제 5 항중 어느 한항에 있어서, 노브(3)의 단부를 수용하기 위한 피스톤(41)이, 움직이게 장착되는 몸체(40)를, 장치의 노브(3)의 높이에 구비하고, 하우징(43)내에서 안내되는 파지볼(42)을 구비하며, 몸체(40)의 요홈(45)에서 안내되는 이동제한볼트(44)를 구비하고 있는 카세트에 그의 전방부품의 플랜지를 지지하게 장착하며, 피스톤(41)은 볼트(46)에 의해 몸체(40)에서 움직일 수 있으며, 이는 카세트(39)와 몸체(40)의 단부상에, 볼트(46)의 머리를 수용하기 위한 접위에 장착되는 플랜지(47)에 의해 이동이 고정되고, 선호적으로 중공의 육각머리를 가진 전술한 보트(46)의 조작을 위한 렌치의 통과를 위한 구멍(48)을 가지며, 카세트(39)와 몸체(40)사이의 회전상태에의 고정은 몸체(40)에 고착되고 플랜지(47)를 통하여 가는 탄성핀(50)에 의해 얻어지며 몸체(40)는 또, 그의 전방부품에서, 스폿페이징(51)을 나타냄을 특징으로 하는 장치.
- 제 1 항 내지 제 5 항중 어느 한항에 있어서, 장치가 그의 코온(1)에 의해 고착카세트(39')에 장착되고, 플랜지에 의해, 전술한 카세트(39')의 전면에 안착하며, 이는 또 노브(3)의 파지부품을 수용하기 위한 하우징을 그의 전면에 나타내는 피스톤(53)이 미끄럼식으로 장착되어 있는 몸체(52)로 구성된 케이스(40)'를 구비하고있고, 또, 한편으로는 몸체(52)의 뒷부분의 스폿먼에서 한 단부에, 다른 한편으로는 피스톤(53)의 배면에 들어가는 볼터(58)의 머리에다 그의 다른 단부에서 안착한 벨리빌리 와샤(57)의 스택에 의해, 몸체(52)의 전방부품의 스폿면(56)에서 외부로 도망갈 수 있도록 있어며 하우징(55)내에서 안내되는 파지볼(holding ball)(54)을 그의 주변에 구비하고 있으며, 몸체(52)는 볼트(49')에 의해 전술한 카세트(39')에 고착된 플랜지(47')에 의해 카세트에 유지되며, 상기 플랜지(47')는 또 회전상태로 고착하기 위한 전술한 몸체(52)의 요홈(60)과 함께 작동하는 탄성핀(59)을 구비하고 있음을 특징으로 하는 장치.
- 제 8 항에 있어서, 피스톤(53)이 부품(52)의 하우징에 백 엔드-오브-트레블 어깨(back end-of-travel shoulder)를 보이고 있음을 특징으로 하는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-236891 | 1987-09-21 | ||
JP62236891A JPS6480032A (en) | 1987-09-21 | 1987-09-21 | Semiconductor device and manufacture thereof |
FR88440036.7 | 1988-05-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890017031A true KR890017031A (ko) | 1989-12-14 |
KR0127678B1 KR0127678B1 (ko) | 1998-04-03 |
Family
ID=17007302
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880011804A KR0127678B1 (ko) | 1987-09-21 | 1988-08-31 | 반도체 장치 및 그 제조방법 |
KR1019880011804A KR890005830A (ko) | 1987-09-21 | 1988-09-13 | 반도체 장치 및 그 제조방법 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880011804A KR890005830A (ko) | 1987-09-21 | 1988-09-13 | 반도체 장치 및 그 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5061990A (ko) |
JP (1) | JPS6480032A (ko) |
KR (2) | KR0127678B1 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227664A (en) * | 1988-02-26 | 1993-07-13 | Hitachi, Ltd. | Semiconductor device having particular mounting arrangement |
US5159433A (en) * | 1989-04-20 | 1992-10-27 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device having a particular casing structure |
US5252857A (en) * | 1991-08-05 | 1993-10-12 | International Business Machines Corporation | Stacked DCA memory chips |
JP2634516B2 (ja) * | 1991-10-15 | 1997-07-30 | 三菱電機株式会社 | 反転型icの製造方法、反転型ic、icモジュール |
US5280193A (en) * | 1992-05-04 | 1994-01-18 | Lin Paul T | Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate |
US5270964A (en) * | 1992-05-19 | 1993-12-14 | Sun Microsystems, Inc. | Single in-line memory module |
DE69330450T2 (de) * | 1992-08-05 | 2001-11-08 | Fujitsu Ltd., Kawasaki | Dreidimensionaler Multichipmodul |
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
JPH0679990A (ja) * | 1992-09-04 | 1994-03-22 | Mitsubishi Electric Corp | Icメモリカード |
US5409863A (en) * | 1993-02-19 | 1995-04-25 | Lsi Logic Corporation | Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die |
FR2706222B1 (fr) * | 1993-06-08 | 1995-07-13 | Alcatel Espace | Assemblage haute densité, haute fiabilité de circuits intégrés et son procédé de réalisation. |
JPH0864921A (ja) * | 1994-05-12 | 1996-03-08 | Texas Instr Inc <Ti> | 表面実装形集積回路構造体 |
JPH09214097A (ja) * | 1996-02-06 | 1997-08-15 | Toshiba Corp | プリント回路基板 |
KR100203934B1 (ko) * | 1996-02-17 | 1999-06-15 | 윤종용 | 패턴닝된 리드프레임을 이용한 멀티 칩 패키지 |
KR100192180B1 (ko) * | 1996-03-06 | 1999-06-15 | 김영환 | 멀티-레이어 버텀 리드 패키지 |
US5990549A (en) * | 1998-02-06 | 1999-11-23 | Intel Corporation | Thermal bus bar design for an electronic cartridge |
US7102892B2 (en) * | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
US6713854B1 (en) * | 2000-10-16 | 2004-03-30 | Legacy Electronics, Inc | Electronic circuit module with a carrier having a mounting pad array |
US7337522B2 (en) * | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
KR100897314B1 (ko) * | 2001-03-14 | 2009-05-14 | 레가시 일렉트로닉스, 인크. | 반도체 칩의 3차원 표면 실장 어레이를 갖는 회로 기판을 제조하기 위한 방법 및 장치 |
US7435097B2 (en) * | 2005-01-12 | 2008-10-14 | Legacy Electronics, Inc. | Radial circuit board, system, and methods |
KR100826982B1 (ko) * | 2006-12-29 | 2008-05-02 | 주식회사 하이닉스반도체 | 메모리 모듈 |
JP2012069764A (ja) | 2010-09-24 | 2012-04-05 | On Semiconductor Trading Ltd | 回路装置およびその製造方法 |
TWI647581B (zh) * | 2017-11-22 | 2019-01-11 | 緯創資通股份有限公司 | 電路板以及佈局結構 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4949224A (en) * | 1985-09-20 | 1990-08-14 | Sharp Kabushiki Kaisha | Structure for mounting a semiconductor device |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
-
1987
- 1987-09-21 JP JP62236891A patent/JPS6480032A/ja active Pending
-
1988
- 1988-08-31 KR KR1019880011804A patent/KR0127678B1/ko not_active Application Discontinuation
- 1988-09-13 KR KR1019880011804A patent/KR890005830A/ko not_active IP Right Cessation
- 1988-09-20 US US07/246,749 patent/US5061990A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS6480032A (en) | 1989-03-24 |
KR890005830A (ko) | 1989-05-17 |
KR0127678B1 (ko) | 1998-04-03 |
US5061990A (en) | 1991-10-29 |
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