KR890011022A - 웨이퍼 공급장치 - Google Patents

웨이퍼 공급장치 Download PDF

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Publication number
KR890011022A
KR890011022A KR1019880017684A KR880017684A KR890011022A KR 890011022 A KR890011022 A KR 890011022A KR 1019880017684 A KR1019880017684 A KR 1019880017684A KR 880017684 A KR880017684 A KR 880017684A KR 890011022 A KR890011022 A KR 890011022A
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KR
South Korea
Prior art keywords
ring
supply
pushing
holder
door column
Prior art date
Application number
KR1019880017684A
Other languages
English (en)
Other versions
KR920009715B1 (ko
Inventor
시게루 후께
노부도 야마자끼
가즈오 수기우라
Original Assignee
야스모 다께시
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 야스모 다께시, 가부시끼가이샤 신가와 filed Critical 야스모 다께시
Publication of KR890011022A publication Critical patent/KR890011022A/ko
Application granted granted Critical
Publication of KR920009715B1 publication Critical patent/KR920009715B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y10S156/931—Peeling away backing
    • Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y10T29/49824—Disassembling by applying force to elastically deform work part or connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

내용 없음

Description

웨이퍼 공급장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 일실시예를 도시하는 평면도.
제 2 도는 제 1 도의 정면도.
제 3 도는 제 1 도의 좌측면도.

Claims (2)

  1. 펠렛이 점착된 웨이퍼시이트를 부착한 공급링과, 펠렛픽업장치의 XY테이블에 부착되고, 상기 웨이퍼시이트를 상기 공급링의 내경보다 작은 외경을 갖는 원통부상면에 의해 지지하여 얹어두는 링홀더와, 이 링홀더 위쪽에 설치되고, 상기 공급링 부분을 가압하는 둥근고리형상의 가압링과, 이 가압링에 의해 상기 공급링을 상기 링홀더의 원통부를 따라 밀어내리게하는 밀어내리기 수단과, 상기 공급링을 상기 밀어내리기 수단으로 밀어내린 후에 상기 가압링을 상기 링홀더에 굳게 결속하는 고결수단을 구비한 웨이퍼 공급장치.
  2. 펠렛이 점착된 웨이퍼시이트를 부착한 공급링과, 이 공급링을 적층하는 형으로 수납하는 엘리베이터매가진과, 이 엘리베이터 메가진에서 일정거리 떨어져 배치된 펠렛픽업장치와, 이 펠렛직업장치의 XY테이블에 부착되고, 상기 웨이퍼시이트를 상기 공급링의 내경보다 작은 외경을 갖는 원통부 상면에 의해 지지하여 얹어두는 링홀더와, 상기 엘리베이터매가진과 상기 링홀더와의 중간에서 상기 링홀더 위쪽으로 왕복이동 가능하고, 또 상하이동가능한 문모양 컬럼과, 이 문모양 컬럼에 설치되고 상기 공급링을 유지하는 안내부재와, 상기 공급링 부분을 가압하는 둥근고리형상의 가압링과, 상기 문모양 컬럼에 설치되고, 상기 안내부재에 유지된 공급링 위쪽에 사이 가압링을 유지하는 매달기 부재와, 상기 문모양 컴럼을 밀어내리고, 상기 가압링에 의해 상기 공급링을 상기 링홀더의 원통부를 따라 밀어내리게 하는 문모양 컬럼의 상하구동 수단과, 상기 문모양 컬럼에 설치되고, 상기 공급링을 상기 밀어내리기 수단으로 밀어내린 후에 상기 가압링을 상기 링홀더에 굳게 결속하는 고결수단과, 상기 엘리베이터매가진에서 상기 문모양 컬럼에 설치된 안내부재에, 또 그 반대로 상기 공급링을 체크하여 옮겨 얹도록 왕복이동가능하게 설치된 옮겨 얹기 수단과를 구비한 웨이퍼 공급장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880017684A 1987-12-28 1988-12-28 웨이퍼 공급장치 KR920009715B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-332619 1987-12-28
JP87-332619 1987-12-28
JP33261987A JPH069219B2 (ja) 1987-12-28 1987-12-28 ウエハー供給装置

Publications (2)

Publication Number Publication Date
KR890011022A true KR890011022A (ko) 1989-08-12
KR920009715B1 KR920009715B1 (ko) 1992-10-22

Family

ID=18256972

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880017684A KR920009715B1 (ko) 1987-12-28 1988-12-28 웨이퍼 공급장치

Country Status (3)

Country Link
US (1) US4936944A (ko)
JP (1) JPH069219B2 (ko)
KR (1) KR920009715B1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
US6132161A (en) * 1997-10-21 2000-10-17 Industrial Technology Research Institute Chip supplying apparatus performing stable blue-film-expansion operation
CA2544910C (en) * 2005-04-25 2013-07-09 Railpower Technologies Corp. Multiple prime power source locomotive control
JP6820000B2 (ja) * 2016-11-17 2021-01-27 ヒューグル開発株式会社 ウエハ拡張装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3537603A (en) * 1967-07-27 1970-11-03 Transitron Electronic Corp Method of separating dice formed from a wafer
JPS60110135A (ja) * 1983-11-18 1985-06-15 Shinkawa Ltd ペレットピックアップ装置

Also Published As

Publication number Publication date
US4936944A (en) 1990-06-26
JPH01173737A (ja) 1989-07-10
KR920009715B1 (ko) 1992-10-22
JPH069219B2 (ja) 1994-02-02

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