KR890009521A - Automatic soldering method and device - Google Patents

Automatic soldering method and device Download PDF

Info

Publication number
KR890009521A
KR890009521A KR1019870015357A KR870015357A KR890009521A KR 890009521 A KR890009521 A KR 890009521A KR 1019870015357 A KR1019870015357 A KR 1019870015357A KR 870015357 A KR870015357 A KR 870015357A KR 890009521 A KR890009521 A KR 890009521A
Authority
KR
South Korea
Prior art keywords
molten solder
small nozzles
substrate
predetermined angle
automatic soldering
Prior art date
Application number
KR1019870015357A
Other languages
Korean (ko)
Other versions
KR920006677B1 (en
Inventor
센이치 요코다
Original Assignee
센이치 요코다
요코다 기카이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 센이치 요코다, 요코다 기카이 가부시기가이샤 filed Critical 센이치 요코다
Publication of KR890009521A publication Critical patent/KR890009521A/en
Application granted granted Critical
Publication of KR920006677B1 publication Critical patent/KR920006677B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음No content

Description

자동 납땜 방법 및 장치Automatic soldering method and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1도 내지 제 9도는 본 발명의 도시도.1 to 9 are illustrations of the present invention.

제 2도 자동납땜장치의 요부사시도.2 is a perspective view of an automatic soldering apparatus.

제 2도 자동납땜장치 전체를 나타내는 평면도.2 is a plan view showing the entire automatic soldering apparatus.

제 3도 복수의 소형노즐의 평면도.3 is a plan view of a plurality of small nozzles.

Claims (4)

기판의 반송방향에 대하여 각각 소정각도로 경사한 복수의 소형 노즐에서 용융땜납을 분출시키고, 각각의 이 소형노즐에서 분출하는 복수의 용융땜납웨이브에 의하여 상기 기판의 반송방향과 직각방향의 용융땜납의 흐름을 발생시키면서 납땜하는 것을 특징으로 하는 자동납땜 방법.The molten solder is ejected from a plurality of small nozzles inclined at a predetermined angle with respect to the conveying direction of the substrate, and the molten solder in the direction perpendicular to the conveying direction of the substrate is formed by a plurality of molten solder waves ejected from each of the small nozzles. Automatic soldering method characterized in that the soldering while generating a flow. 제 1 항에 있어서 상기 소정각도는 약 45°인 것을 특징으로 하는 자동납땜 방법.2. The method of claim 1 wherein the predetermined angle is about 45 degrees. 기판의 반송방향에 대하여 각각 소정각도로 경사한 복수의 소형 노즐을 마련하고, 각각의 이 소형노즐의 길이방향의 일단부가 인접하는 이 소형노즐의 길이방향의 다른 일단부와 오버랩하도록 이 소형노즐을 배열하고, 이 복수의 소형노즐의 하방에서 상방을 향해서 용융땜납을 분출시키고 상기 기판의 반송방향에 대하여 상기 소정각도로 경사한 복수의 용융땜납웨이브가 형성되도록 구성한 것을 특징으로 하는 자동납땜장치.A plurality of small nozzles inclined at predetermined angles with respect to the conveying direction of the substrate are provided, and the small nozzles are arranged so that one end of each of the small nozzles in the longitudinal direction overlaps the other one end of the small nozzle adjacent thereto in the longitudinal direction. And a plurality of molten solder waves inclined at a predetermined angle with respect to the conveying direction of the substrate, in which molten solder is blown upwards from below the plurality of small nozzles. 제 3항에 있어서, 상기 소정각도는 약 45°인 것을 특징으로 하는 자동납땜장치.4. The automatic soldering apparatus of claim 3, wherein the predetermined angle is about 45 degrees. ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019870015357A 1987-12-14 1987-12-30 Method and device for automatic soldering KR920006677B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62315837A JPH01157764A (en) 1987-12-14 1987-12-14 Method and device for automatic soldering
JP62-315837 1987-12-16

Publications (2)

Publication Number Publication Date
KR890009521A true KR890009521A (en) 1989-08-02
KR920006677B1 KR920006677B1 (en) 1992-08-14

Family

ID=18070171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870015357A KR920006677B1 (en) 1987-12-14 1987-12-30 Method and device for automatic soldering

Country Status (2)

Country Link
JP (1) JPH01157764A (en)
KR (1) KR920006677B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547377B2 (en) * 1999-11-01 2004-07-28 松下電器産業株式会社 Solder jet device and soldering method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858795A (en) * 1981-10-03 1983-04-07 石井　銀弥 Soldering device
JP2549618B2 (en) * 1985-05-18 1996-10-30 株式会社東芝 Jet soldering device
JPH0168163U (en) * 1987-10-22 1989-05-02

Also Published As

Publication number Publication date
JPH01157764A (en) 1989-06-21
KR920006677B1 (en) 1992-08-14
JPH0469510B2 (en) 1992-11-06

Similar Documents

Publication Publication Date Title
DE69316242D1 (en) SOLDERING NOZZLE WITH GAS JET KNIFE
IT8022777A0 (en) DEVICE FOR THE NON-DISTRIBUTIVE DISASSEMBLY OF A MODEL ELECTRONIC COMPONENT SOLDERED BY MEANS OF A PLURALITY OF CONNECTION TERMINALS ON A SUBSTRATE.
BR8300105A (en) APPLIANCE AND METHOD FOR APPLYING WELDING MATERIAL ON METALLIC SURFACES
US6510978B1 (en) Solder jet machine and soldering method
ES2056339T3 (en) DEVICE FOR THE EXCHANGE OF MATTER BETWEEN A HOT GAS STREAM AND A LIQUID.
KR830001702A (en) Stainless steel automatic tapping screw manufacturing equipment
KR930004013A (en) Height detection jig and soldering device for classifying solder wave surface
DE69107088T2 (en) JET FLOW DEVICE FOR INJECTING GASES INTO A METAL MELT.
EP0119272A4 (en) Method and device for soldering printed board.
KR890009521A (en) Automatic soldering method and device
KR920010801A (en) Bonding device
MY104879A (en) An automatic soldering method and the apparatus thereof
KR830005961A (en) Apparatus for welding pipe to tube sheet by continuous welding
MY120844A (en) Jet solder feeding device and soldering method
KR880014358A (en) Environmental wind tunnel test device
KR900017711A (en) Carrierless Automatic Soldering Equipment
JP2803663B2 (en) Nozzle structure of automatic soldering equipment
SU482263A1 (en) Wave soldering and soldering device
KR890012895A (en) Fiber optic wire drawing furnace
KR900017710A (en) Automatic soldering equipment
KR900017709A (en) Automatic soldering equipment
KR900006061A (en) Automatic Soldering Method and Device
JPH0418434U (en)
JPS57115970A (en) Soldering method
KR880004729A (en) Equipment for cleaning and drying electronic printed circuits

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee