JPH0418434U - - Google Patents

Info

Publication number
JPH0418434U
JPH0418434U JP1990058570U JP5857090U JPH0418434U JP H0418434 U JPH0418434 U JP H0418434U JP 1990058570 U JP1990058570 U JP 1990058570U JP 5857090 U JP5857090 U JP 5857090U JP H0418434 U JPH0418434 U JP H0418434U
Authority
JP
Japan
Prior art keywords
substrate
processing liquid
discharging
nozzles
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990058570U
Other languages
Japanese (ja)
Other versions
JPH0720914Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990058570U priority Critical patent/JPH0720914Y2/en
Publication of JPH0418434U publication Critical patent/JPH0418434U/ja
Application granted granted Critical
Publication of JPH0720914Y2 publication Critical patent/JPH0720914Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す表面処理装置
の斜視図、第2図は処理液吐出ノズルの断面図、
第3図は2つ割り状に形成した一方のノズルを内
面より見た図で、第2図の−線矢視断面図、
第4図〜第5図はそれぞれ処理液吐出ノズルの配
置例を示す要部拡大図、第6図は第2の考案に係
る実施例装置の概要図、第7図はその実施例装置
の動作説明図、第8図は従来例を示す平面図であ
る。 W……基板、4……吐出口、10……処理液吐
出ノズル、11……処理液、20……コンベア、
b……基板の横幅。
FIG. 1 is a perspective view of a surface treatment apparatus showing an embodiment of the present invention, FIG. 2 is a sectional view of a treatment liquid discharge nozzle,
Fig. 3 is a view of one of the nozzles formed in two halves, seen from the inside, and a sectional view taken along the - line in Fig. 2;
4 and 5 are enlarged views of main parts showing examples of arrangement of processing liquid discharge nozzles, FIG. 6 is a schematic diagram of an embodiment of the device according to the second invention, and FIG. 7 is an operation of the embodiment of the device. The explanatory diagram, FIG. 8, is a plan view showing a conventional example. W...substrate, 4...discharge port, 10...processing liquid discharge nozzle, 11...processing liquid, 20...conveyor,
b... Width of the board.

Claims (1)

【実用新案登録請求の範囲】 1 基板を水平搬送するコンベアと、基板の表面
に処理液を吐出する処理液吐出ノズルを具備して
成る基板の表面処理装置において、 コンベアの両側端部上方に少なくとも一組以上
の処理液吐出ノズルを基板の横幅以上の間隔をあ
けて配置し、 処理液吐出ノズルの吐出口をスリツト状に開口
して基板の搬送方向と平行をなすように交互に配
置し、 基板の搬送方向と交差する方向へ処理液をカー
テン状に傾斜させて吐出するように構成したこと
を特徴とする基板の表面処理装置。 2 基板を水平搬送するコンベアと、基板の表面
に処理液を吐出する処理液吐出ノズルを具備して
成る基板の表面処理装置において、 コンベアの上方に、基板の搬送方向に基板の長
さ以上の間隔をあけて、処理液吐出ノズルを配置
し、 処理液吐出ノズルの吐出口を基板の横幅以上の
長さにスリツト状に開口し、各処理液吐出ノズル
から吐出する処理液を互いに対向する方向に傾斜
させ、 コンベアの搬送方向を正逆転させ、基板を各処
理液吐出ノズル間を往復動させながら、基板の表
面処理を行うように構成したことを特徴とする基
板の表面処理装置。
[Claims for Utility Model Registration] 1. In a substrate surface treatment apparatus comprising a conveyor for horizontally conveying a substrate and a treatment liquid discharge nozzle for discharging a treatment liquid onto the surface of the substrate, at least One or more sets of processing liquid discharge nozzles are arranged at intervals equal to or larger than the width of the substrate, and the discharge ports of the processing liquid discharge nozzles are opened in the form of slits and are arranged alternately parallel to the conveying direction of the substrate, 1. A surface processing apparatus for a substrate, characterized in that the processing liquid is discharged in a curtain-like manner at an angle in a direction intersecting the conveying direction of the substrate. 2. In a substrate surface treatment apparatus comprising a conveyor for horizontally conveying a substrate and a treatment liquid discharging nozzle for discharging a treatment liquid onto the surface of the substrate, a Processing liquid discharging nozzles are arranged at intervals, and the discharging ports of the processing liquid discharging nozzles are opened in a slit shape with a length longer than the width of the substrate, and the processing liquid discharged from each processing liquid discharging nozzle is directed in opposite directions. What is claimed is: 1. A substrate surface treatment apparatus, characterized in that the surface treatment of a substrate is performed while the conveyor is tilted forward and backward, and the substrate is reciprocated between treatment liquid discharge nozzles.
JP1990058570U 1990-06-01 1990-06-01 Substrate surface treatment equipment Expired - Lifetime JPH0720914Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990058570U JPH0720914Y2 (en) 1990-06-01 1990-06-01 Substrate surface treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990058570U JPH0720914Y2 (en) 1990-06-01 1990-06-01 Substrate surface treatment equipment

Publications (2)

Publication Number Publication Date
JPH0418434U true JPH0418434U (en) 1992-02-17
JPH0720914Y2 JPH0720914Y2 (en) 1995-05-15

Family

ID=31584304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990058570U Expired - Lifetime JPH0720914Y2 (en) 1990-06-01 1990-06-01 Substrate surface treatment equipment

Country Status (1)

Country Link
JP (1) JPH0720914Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196859A (en) * 1992-12-24 1994-07-15 Tokyo Kakoki Kk Chemical treatment apparatus and electrodeposition apparatus
JP2002239485A (en) * 2000-12-15 2002-08-27 Shibaura Mechatronics Corp Apparatus and method for cleaning substrate
WO2003100842A1 (en) * 2002-05-23 2003-12-04 Sumitomo Precision Products Co., Ltd Conveying type substrate treating device
JP2008219043A (en) * 2001-07-05 2008-09-18 Tokyo Electron Ltd Solution treatment apparatus and solution treatment method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196859A (en) * 1992-12-24 1994-07-15 Tokyo Kakoki Kk Chemical treatment apparatus and electrodeposition apparatus
JP2002239485A (en) * 2000-12-15 2002-08-27 Shibaura Mechatronics Corp Apparatus and method for cleaning substrate
JP4602567B2 (en) * 2000-12-15 2010-12-22 芝浦メカトロニクス株式会社 Substrate cleaning device
JP2008219043A (en) * 2001-07-05 2008-09-18 Tokyo Electron Ltd Solution treatment apparatus and solution treatment method
JP4643684B2 (en) * 2001-07-05 2011-03-02 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
WO2003100842A1 (en) * 2002-05-23 2003-12-04 Sumitomo Precision Products Co., Ltd Conveying type substrate treating device

Also Published As

Publication number Publication date
JPH0720914Y2 (en) 1995-05-15

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