JPH0418434U - - Google Patents
Info
- Publication number
- JPH0418434U JPH0418434U JP1990058570U JP5857090U JPH0418434U JP H0418434 U JPH0418434 U JP H0418434U JP 1990058570 U JP1990058570 U JP 1990058570U JP 5857090 U JP5857090 U JP 5857090U JP H0418434 U JPH0418434 U JP H0418434U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- processing liquid
- discharging
- nozzles
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims 7
- 238000010586 diagram Methods 0.000 description 2
Description
第1図は本考案の一実施例を示す表面処理装置
の斜視図、第2図は処理液吐出ノズルの断面図、
第3図は2つ割り状に形成した一方のノズルを内
面より見た図で、第2図の−線矢視断面図、
第4図〜第5図はそれぞれ処理液吐出ノズルの配
置例を示す要部拡大図、第6図は第2の考案に係
る実施例装置の概要図、第7図はその実施例装置
の動作説明図、第8図は従来例を示す平面図であ
る。
W……基板、4……吐出口、10……処理液吐
出ノズル、11……処理液、20……コンベア、
b……基板の横幅。
FIG. 1 is a perspective view of a surface treatment apparatus showing an embodiment of the present invention, FIG. 2 is a sectional view of a treatment liquid discharge nozzle,
Fig. 3 is a view of one of the nozzles formed in two halves, seen from the inside, and a sectional view taken along the - line in Fig. 2;
4 and 5 are enlarged views of main parts showing examples of arrangement of processing liquid discharge nozzles, FIG. 6 is a schematic diagram of an embodiment of the device according to the second invention, and FIG. 7 is an operation of the embodiment of the device. The explanatory diagram, FIG. 8, is a plan view showing a conventional example. W...substrate, 4...discharge port, 10...processing liquid discharge nozzle, 11...processing liquid, 20...conveyor,
b... Width of the board.
Claims (1)
に処理液を吐出する処理液吐出ノズルを具備して
成る基板の表面処理装置において、 コンベアの両側端部上方に少なくとも一組以上
の処理液吐出ノズルを基板の横幅以上の間隔をあ
けて配置し、 処理液吐出ノズルの吐出口をスリツト状に開口
して基板の搬送方向と平行をなすように交互に配
置し、 基板の搬送方向と交差する方向へ処理液をカー
テン状に傾斜させて吐出するように構成したこと
を特徴とする基板の表面処理装置。 2 基板を水平搬送するコンベアと、基板の表面
に処理液を吐出する処理液吐出ノズルを具備して
成る基板の表面処理装置において、 コンベアの上方に、基板の搬送方向に基板の長
さ以上の間隔をあけて、処理液吐出ノズルを配置
し、 処理液吐出ノズルの吐出口を基板の横幅以上の
長さにスリツト状に開口し、各処理液吐出ノズル
から吐出する処理液を互いに対向する方向に傾斜
させ、 コンベアの搬送方向を正逆転させ、基板を各処
理液吐出ノズル間を往復動させながら、基板の表
面処理を行うように構成したことを特徴とする基
板の表面処理装置。[Claims for Utility Model Registration] 1. In a substrate surface treatment apparatus comprising a conveyor for horizontally conveying a substrate and a treatment liquid discharge nozzle for discharging a treatment liquid onto the surface of the substrate, at least One or more sets of processing liquid discharge nozzles are arranged at intervals equal to or larger than the width of the substrate, and the discharge ports of the processing liquid discharge nozzles are opened in the form of slits and are arranged alternately parallel to the conveying direction of the substrate, 1. A surface processing apparatus for a substrate, characterized in that the processing liquid is discharged in a curtain-like manner at an angle in a direction intersecting the conveying direction of the substrate. 2. In a substrate surface treatment apparatus comprising a conveyor for horizontally conveying a substrate and a treatment liquid discharging nozzle for discharging a treatment liquid onto the surface of the substrate, a Processing liquid discharging nozzles are arranged at intervals, and the discharging ports of the processing liquid discharging nozzles are opened in a slit shape with a length longer than the width of the substrate, and the processing liquid discharged from each processing liquid discharging nozzle is directed in opposite directions. What is claimed is: 1. A substrate surface treatment apparatus, characterized in that the surface treatment of a substrate is performed while the conveyor is tilted forward and backward, and the substrate is reciprocated between treatment liquid discharge nozzles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990058570U JPH0720914Y2 (en) | 1990-06-01 | 1990-06-01 | Substrate surface treatment equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990058570U JPH0720914Y2 (en) | 1990-06-01 | 1990-06-01 | Substrate surface treatment equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0418434U true JPH0418434U (en) | 1992-02-17 |
JPH0720914Y2 JPH0720914Y2 (en) | 1995-05-15 |
Family
ID=31584304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990058570U Expired - Lifetime JPH0720914Y2 (en) | 1990-06-01 | 1990-06-01 | Substrate surface treatment equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720914Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196859A (en) * | 1992-12-24 | 1994-07-15 | Tokyo Kakoki Kk | Chemical treatment apparatus and electrodeposition apparatus |
JP2002239485A (en) * | 2000-12-15 | 2002-08-27 | Shibaura Mechatronics Corp | Apparatus and method for cleaning substrate |
WO2003100842A1 (en) * | 2002-05-23 | 2003-12-04 | Sumitomo Precision Products Co., Ltd | Conveying type substrate treating device |
JP2008219043A (en) * | 2001-07-05 | 2008-09-18 | Tokyo Electron Ltd | Solution treatment apparatus and solution treatment method |
-
1990
- 1990-06-01 JP JP1990058570U patent/JPH0720914Y2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06196859A (en) * | 1992-12-24 | 1994-07-15 | Tokyo Kakoki Kk | Chemical treatment apparatus and electrodeposition apparatus |
JP2002239485A (en) * | 2000-12-15 | 2002-08-27 | Shibaura Mechatronics Corp | Apparatus and method for cleaning substrate |
JP4602567B2 (en) * | 2000-12-15 | 2010-12-22 | 芝浦メカトロニクス株式会社 | Substrate cleaning device |
JP2008219043A (en) * | 2001-07-05 | 2008-09-18 | Tokyo Electron Ltd | Solution treatment apparatus and solution treatment method |
JP4643684B2 (en) * | 2001-07-05 | 2011-03-02 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
WO2003100842A1 (en) * | 2002-05-23 | 2003-12-04 | Sumitomo Precision Products Co., Ltd | Conveying type substrate treating device |
Also Published As
Publication number | Publication date |
---|---|
JPH0720914Y2 (en) | 1995-05-15 |
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