JP2002239485A - Apparatus and method for cleaning substrate - Google Patents

Apparatus and method for cleaning substrate

Info

Publication number
JP2002239485A
JP2002239485A JP2001003798A JP2001003798A JP2002239485A JP 2002239485 A JP2002239485 A JP 2002239485A JP 2001003798 A JP2001003798 A JP 2001003798A JP 2001003798 A JP2001003798 A JP 2001003798A JP 2002239485 A JP2002239485 A JP 2002239485A
Authority
JP
Japan
Prior art keywords
substrate
cleaning
brush
liquid
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001003798A
Other languages
Japanese (ja)
Other versions
JP4602567B2 (en
Inventor
Hiroko Ishikawa
寛子 石川
Akinori Iso
明典 磯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2001003798A priority Critical patent/JP4602567B2/en
Publication of JP2002239485A publication Critical patent/JP2002239485A/en
Application granted granted Critical
Publication of JP4602567B2 publication Critical patent/JP4602567B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus in which a cleaning liquid supplied to a substrate is prevented from staying particularly on the top surface of the substrate. SOLUTION: This substrate cleaning apparatus is provided with a conveying mechanism 2 for conveying the substrate 1 to the prescribed direction, cleaning means 21, 22 each of which has the upper cleaning brush 23 and the lower cleaning brush 24 disposed oppositely in the vertical direction for cleaning the top and under surfaces of the substrate 1 conveyed by the mechanism 2 by the brushes 23 and 24 and a nozzle body 41 disposed on the upstream or/and downstream sides of the means 21, 22 for supplying liquid to at lest the top surface of the substrate 1 to be cleaned by the means 21, 22 at the prescribed angle of inclination with respect to the direction intersecting the substrate conveying direction.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は対向して配設され
た上部洗浄部材と下部洗浄部材との間に基板を送り込ん
で洗浄する基板の洗浄装置及び洗浄方法に関する。
[0001] 1. Field of the Invention [0002] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate by sending a substrate between an upper cleaning member and a lower cleaning member disposed opposite to each other.

【0002】[0002]

【従来の技術】たとえば、液晶表示装置や半導体装置の
製造工程においては、基板としての液晶用ガラス基板や
半導体ウエハを高い清浄度で洗浄することが要求される
工程がある。
2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device or a semiconductor device, there is a process that requires cleaning a glass substrate for a liquid crystal or a semiconductor wafer as a substrate with high cleanliness.

【0003】このような基板を洗浄する方式としては、
洗浄液中に複数枚の基板を浸漬するデイップ方式や基板
に向けて洗浄液を噴射して一枚づつ洗浄する枚葉方式が
あり、最近では高い清浄度が得られるとともに、コスト
的に有利な枚葉方式が採用されることが多くなってきて
いる。
[0003] As a method for cleaning such a substrate,
There are a dip method in which multiple substrates are immersed in the cleaning liquid, and a single-wafer method in which the cleaning liquid is sprayed toward the substrate to wash one by one. Recently, high cleanliness has been obtained and cost-effective single-wafer processing The scheme is increasingly adopted.

【0004】枚葉方式の1つとして洗浄部材としてのロ
−ル状の洗浄ブラシを用いたブラシ洗浄装置が知られて
いる。このブラシ洗浄装置は基板を搬送機構によって所
定方向に搬送するとともに、その搬送途中に、上記被洗
浄基板の上面と下面とに接触しながら回転駆動される、
上部洗浄ブラシと下部洗浄ブラシとを対向させて配置し
たブラシ洗浄部を設け、基板の板面に洗浄液を供給しな
がら各洗浄ブラシを回転駆動することで、上記基板に付
着した微粒子を洗浄除去するようにしている。
A brush cleaning apparatus using a roll-shaped cleaning brush as a cleaning member is known as one of the single-wafer systems. The brush cleaning device transports the substrate in a predetermined direction by a transport mechanism, and is rotated while contacting the upper and lower surfaces of the substrate to be cleaned during the transport.
A brush cleaning unit is provided in which an upper cleaning brush and a lower cleaning brush are arranged to face each other, and the cleaning brushes are rotated while supplying a cleaning liquid to the plate surface of the substrate, thereby cleaning and removing fine particles attached to the substrate. Like that.

【0005】このようなブラシ洗浄装置においては、基
板に付着した微粒子を良好に洗浄除去するため、洗浄ブ
ラシの周速度を基板の搬送速度と異なる速度、通常は速
い速度に設定したり、上下一対の洗浄ブラシの一方を基
板の搬送方向に対して逆方向に回転するなどのことが行
われる。
In such a brush cleaning apparatus, the peripheral speed of the cleaning brush is set to a speed different from the transport speed of the substrate, usually to a high speed, or a pair of upper and lower portions is provided in order to clean and remove fine particles adhering to the substrate. For example, one of the cleaning brushes is rotated in a direction opposite to the transport direction of the substrate.

【0006】また、基板の洗浄度合を高めるために、一
対のブラシ洗浄部を基板の搬送方向に対して所定間隔で
設けるなどのことも行われている。その場合も、各ブラ
シ洗浄部に搬送される基板の板面に洗浄液を供給し、基
板が乾いた状態で洗浄ブラシによってブラッシングされ
ることがないようにしている。
Further, in order to increase the degree of cleaning of the substrate, a pair of brush cleaning sections are provided at a predetermined interval in the substrate transport direction. Also in this case, the cleaning liquid is supplied to the plate surface of the substrate conveyed to each brush cleaning unit so that the substrate is not brushed by the cleaning brush in a dry state.

【0007】[0007]

【発明が解決しようとする課題】ところで、従来、洗浄
液はブラシ洗浄部に送り込まれる基板の板面に対してほ
ぼ垂直に供給されていた。そのため、基板の上面には、
上部洗浄ブラシによって基板から除去されたパーティク
ルを含んだ洗浄液が滞留し易く、それによって洗浄液に
含まれたパーティクルが基板の上面に再付着するという
ことがあった。
Conventionally, the cleaning liquid has been supplied almost perpendicularly to the surface of the substrate fed into the brush cleaning section. Therefore, on the upper surface of the substrate,
The cleaning liquid containing the particles removed from the substrate by the upper cleaning brush tends to stay, which may cause the particles contained in the cleaning liquid to adhere to the upper surface of the substrate.

【0008】とくに、上部洗浄ブラシを基板の搬送方向
に対して逆方向に回転させた場合、基板の上面に供給さ
れた洗浄液は上部洗浄ブラシによって基板の搬送方向と
逆方向に戻されるため、その洗浄液に含まれたパーティ
クルが基板の上面に再付着す易くなるということがあ
る。
In particular, when the upper cleaning brush is rotated in the direction opposite to the substrate transport direction, the cleaning liquid supplied to the upper surface of the substrate is returned by the upper cleaning brush in the direction opposite to the substrate transport direction. In some cases, particles included in the cleaning liquid may easily adhere to the upper surface of the substrate.

【0009】さらに、最近では基板が大型化する傾向に
ある。そのため、基板は搬送方向と交差する方向の幅寸
法が大きくなり、基板の上面に供給された洗浄液がその
上面から流出し難くなるため、基板の上面にパーティク
ルが再付着し易くなるということがある。
Further, recently, the size of substrates has been increasing. For this reason, the width of the substrate in the direction intersecting with the transport direction is increased, and the cleaning liquid supplied to the upper surface of the substrate is less likely to flow out from the upper surface, so that particles may easily adhere to the upper surface of the substrate. .

【0010】この発明は、基板の上面に供給された洗浄
液が基板の上面に滞留し難いようにすることで、基板を
高い清浄度で洗浄できるようにした洗浄装置及び洗浄方
法を提供することにある。
[0010] The present invention provides a cleaning apparatus and a cleaning method capable of cleaning a substrate with a high degree of cleanliness by preventing a cleaning liquid supplied to the upper surface of the substrate from remaining on the upper surface of the substrate. is there.

【0011】[0011]

【課題を解決するための手段】請求項1の発明は、基板
を所定方向に搬送する搬送機構と、上下方向に対向して
配置された上部洗浄部材と下部洗浄部材とを有し、これ
ら洗浄部材によって上記搬送機構が搬送する基板の上面
と下面とを洗浄する洗浄手段と、この洗浄手段の上流側
あるいは下流側の少なくとも一方に配置され洗浄手段に
よって洗浄される基板の上面と下面のうちの少なくとも
上面にこの基板の搬送方向と交差する方向に対し所定の
角度で液体を供給する液体供給手段とを具備したことを
特徴とする基板の洗浄装置にある。
According to a first aspect of the present invention, there is provided a transport mechanism for transporting a substrate in a predetermined direction, and an upper cleaning member and a lower cleaning member which are vertically opposed to each other. Cleaning means for cleaning an upper surface and a lower surface of the substrate transported by the transport mechanism by a member; and a cleaning means disposed on at least one of an upstream side and a downstream side of the cleaning means and being cleaned by the cleaning means. A substrate cleaning apparatus, comprising: a liquid supply means for supplying a liquid at a predetermined angle to at least an upper surface of the substrate with respect to a direction intersecting with the substrate transport direction.

【0012】請求項2の発明は、基板を所定方向に搬送
する搬送機構と、上下方向に対向して配置された上部洗
浄手段と下部洗浄手段とを有するとともに上記搬送機構
によって搬送される基板の搬送方向に対して所定の間隔
で配置され、上記搬送機構が搬送する基板の上面と下面
とをそれぞれ洗浄する一対の洗浄手段と、これら一対の
洗浄手段の間に配置され洗浄手段によって洗浄される基
板の上面と下面のうちの少なくとも上面にこの基板の搬
送方向と交差する方向に対し所定の角度で液体を供給す
る液体供給手段とを具備したことを特徴とする基板の洗
浄装置にある。
According to a second aspect of the present invention, there is provided a transport mechanism for transporting a substrate in a predetermined direction, an upper cleaning means and a lower cleaning means disposed vertically opposed to each other, and the substrate transported by the transport mechanism. A pair of cleaning means disposed at predetermined intervals in the transport direction and cleaning the upper and lower surfaces of the substrate transported by the transport mechanism, respectively, and disposed between the pair of cleaning means and cleaned by the cleaning means; A substrate cleaning apparatus, comprising: a liquid supply unit that supplies a liquid at a predetermined angle to a direction intersecting a transport direction of the substrate on at least an upper surface of the upper surface and the lower surface of the substrate.

【0013】請求項3の発明は、上記上部洗浄部材と下
部洗浄部材は、それぞれ洗浄ブラシであることを特徴と
する請求項1又は請求項2記載の基板の洗浄装置にあ
る。
According to a third aspect of the present invention, there is provided the apparatus for cleaning a substrate according to the first or second aspect, wherein the upper cleaning member and the lower cleaning member are each a cleaning brush.

【0014】請求項4の発明は、上記上部洗浄部材は、
基板の搬送方向とがY区方向に回転駆動されることを特
徴とする請求項1記載の基板の洗浄装置にある。
According to a fourth aspect of the present invention, the upper cleaning member comprises:
2. The apparatus for cleaning a substrate according to claim 1, wherein the transport direction of the substrate is rotationally driven in the Y section direction.

【0015】請求項5の発明は、対向して配置された上
部洗浄部材と下部洗浄部材との間に基板を送り込み、こ
の基板の上面と下面とを上記各洗浄部材によって洗浄す
る基板の洗浄方法において、上記上部洗浄部材と下部洗
浄部材との間に送り込まれる基板の上面と下面のうちの
少なくとも上面に、この基板の送り方向と交差する方向
に対し所定の傾斜角度で液体を供給することを特徴とす
る基板の洗浄方法にある。
According to a fifth aspect of the present invention, there is provided a method of cleaning a substrate, wherein a substrate is sent between an upper cleaning member and a lower cleaning member which are arranged to face each other, and the upper and lower surfaces of the substrate are cleaned by the respective cleaning members. In at least the upper surface and the lower surface of the substrate fed between the upper cleaning member and the lower cleaning member, supplying the liquid at a predetermined inclination angle with respect to a direction intersecting with the substrate feeding direction. The present invention is characterized by a method of cleaning a substrate.

【0016】この発明によれば、基板の上面に洗浄液
を、この基板の搬送方向に対して交差する方向に対し所
定の傾斜角度で供給するため、基板の上面に供給された
洗浄液は基板の搬送方向と交差する方向の端部から流出
し、上面に溜まり難くくなる。
According to the present invention, since the cleaning liquid is supplied to the upper surface of the substrate at a predetermined inclination angle with respect to a direction intersecting the direction of transport of the substrate, the cleaning liquid supplied to the upper surface of the substrate is transferred to the upper surface of the substrate. It flows out from the end in the direction intersecting the direction, and hardly collects on the upper surface.

【0017】[0017]

【発明の実施の形態】以下、この発明の一実施の形態を
図面を参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0018】図1は洗浄装置を示し、この洗浄装置は液
晶表示装置用のガラス基板などの基板1を矢印Aで示す
方向へ搬送する搬送機構2を有する。この搬送機構2
は、図1と図5に示すように基板1の搬送方向に沿って
複数の下部駆動軸3が所定間隔で配置されている。この
下部駆動軸3の両端部は架台の側板4に軸受5によって
回転自在に支持されている。
FIG. 1 shows a cleaning apparatus, which has a transport mechanism 2 for transporting a substrate 1 such as a glass substrate for a liquid crystal display in a direction indicated by an arrow A. This transport mechanism 2
As shown in FIG. 1 and FIG. 5, a plurality of lower drive shafts 3 are arranged at predetermined intervals along the transport direction of the substrate 1. Both ends of the lower drive shaft 3 are rotatably supported by bearings 5 on side plates 4 of the gantry.

【0019】下部駆動軸3の上方には、この下部駆動軸
3に軸線を平行にして押え軸6が配設されている。この
押え軸6の両端部は、上記側板4に軸受7によって回転
自在に支持されている。
A presser shaft 6 is disposed above the lower drive shaft 3 with its axis parallel to the lower drive shaft 3. Both ends of the holding shaft 6 are rotatably supported by the side plate 4 by bearings 7.

【0020】下部駆動軸3の両端部には上記基板1の幅
方向両端部を係合保持する段部8が形成された搬送ロー
ラ9が設けられ、上記押え軸6の両端部には上記段部8
に係合させた基板1の幅方向両端部の上面を押圧する押
えローラ11が設けられている。押えローラ11には上
記基板1の上面に所定の圧力で圧接するOリング12が
設けられている。
At both ends of the lower drive shaft 3, there are provided conveying rollers 9 having stepped portions 8 for engaging and holding both ends in the width direction of the substrate 1. Part 8
A pressing roller 11 is provided for pressing the upper surfaces of both ends in the width direction of the substrate 1 engaged with the substrate 1. The pressing roller 11 is provided with an O-ring 12 which is pressed against the upper surface of the substrate 1 with a predetermined pressure.

【0021】下部駆動軸3と押え軸6との一端部には互
いに噛合した第1の歯車13が嵌着されている。下部駆
動軸3の他端部には第2の歯車14が嵌着されている。
この第2の歯車14には駆動源15によって回転駆動さ
れる第3の歯車16が噛合している。
A first gear 13 meshed with one end of the lower drive shaft 3 and the holding shaft 6 is fitted to one end. A second gear 14 is fitted to the other end of the lower drive shaft 3.
A third gear 16 that is rotationally driven by a drive source 15 meshes with the second gear 14.

【0022】したがって、上記駆動源15が作動すれ
ば、第3の歯車16を介して第2の歯車14及び噛合し
た一対の第1の歯車13が回転駆動されるから、上記下
部駆動軸3と押え軸6とがそれぞれ基板1を図1に矢印
Aで示す搬送方向に搬送するよう回転駆動されることに
なる。
Therefore, when the drive source 15 is operated, the second gear 14 and the pair of first gears 13 meshed with each other are driven to rotate via the third gear 16, so that the lower drive shaft 3 The pressing shaft 6 is driven to rotate so as to transport the substrate 1 in the transport direction indicated by the arrow A in FIG.

【0023】なお、図示しないが、基板1の搬送方向に
沿って所定間隔で配置された複数の下部駆動軸3の端部
にはそれぞれプーリが嵌着され、隣り合う下部駆動軸3
のプーリにはタイミングベルトが張設されている。それ
によって、1つの下部駆動軸3が回転駆動されること
で、他の下部駆動軸3も回転駆動されるとともに、その
下部駆動軸3の回転が噛合した一対の第1の歯車13を
介して押え軸6にも伝達されるようになっている。
Although not shown, pulleys are respectively fitted to the ends of a plurality of lower drive shafts 3 arranged at a predetermined interval along the transport direction of the substrate 1, and the lower drive shafts 3 adjacent to each other are attached.
A timing belt is stretched over the pulley. As a result, one lower drive shaft 3 is driven to rotate, whereby the other lower drive shaft 3 is also driven to rotate, and via a pair of first gears 13 meshed with the rotation of the lower drive shaft 3. The force is also transmitted to the presser shaft 6.

【0024】図1に示すように、上記搬送機構2によっ
て搬送される基板1の搬送路には、第1の洗浄手段21
と第2の洗浄手段22とが基板1の搬送方向に対して所
定間隔で配設されている。
As shown in FIG. 1, a first cleaning means 21 is provided in the transport path of the substrate 1 transported by the transport mechanism 2.
And the second cleaning means 22 are arranged at predetermined intervals in the transport direction of the substrate 1.

【0025】各洗浄手段21,22は図4に示すように
上下方向に対向して配設された洗浄部材としての上部洗
浄ブラシ23と下部洗浄ブラシ24を有する。各洗浄ブ
ラシ23,24は、上記側板4に軸受27によって回転
自在に支持された駆動軸25を有し、各駆動軸25の外
周面には所定の長さのブラシ毛26が設けられている。
As shown in FIG. 4, each of the cleaning means 21 and 22 has an upper cleaning brush 23 and a lower cleaning brush 24 as cleaning members disposed so as to face each other in the vertical direction. Each of the cleaning brushes 23 and 24 has a drive shaft 25 rotatably supported by the side plate 4 by a bearing 27, and a brush bristle 26 of a predetermined length is provided on an outer peripheral surface of each drive shaft 25. .

【0026】各洗浄ブラシ23,24の一対の駆動軸2
5は、図4に示すようにこれらのブラシ毛26の間に基
板1がないときに、互いのブラシ毛26が接触する間隔
で配設されている。
A pair of drive shafts 2 of each cleaning brush 23, 24
5 are arranged at intervals such that the brush bristles 26 are in contact with each other when the substrate 1 does not exist between the brush bristles 26 as shown in FIG.

【0027】一対の駆動軸25の一端部には第3の歯車
31が嵌着されている。一対の第3の歯車31間には上
記側板4に回転自在に支持された支軸32に嵌着された
中間歯車33が噛合している。下側の駆動軸25の他端
部には第4の歯車34が嵌着されている。この第4の歯
車34には第2の駆動源35によって回転駆動される第
5の歯車36が噛合している。
A third gear 31 is fitted to one end of the pair of drive shafts 25. An intermediate gear 33 fitted on a support shaft 32 rotatably supported by the side plate 4 meshes between the pair of third gears 31. A fourth gear 34 is fitted to the other end of the lower drive shaft 25. A fifth gear 36, which is rotationally driven by a second drive source 35, meshes with the fourth gear 34.

【0028】それによって、上記第2の駆動源35が作
動すると、上部洗浄ブラシ23と下部洗浄ブラシ24と
が基板1の搬送方向に対して異なる方向に回転駆動され
るようになっている。
Thus, when the second drive source 35 operates, the upper cleaning brush 23 and the lower cleaning brush 24 are driven to rotate in different directions with respect to the transport direction of the substrate 1.

【0029】この実施の形態では、図1に矢印で示すよ
うに第1の洗浄手段21の上部洗浄ブラシ23と下部洗
浄ブラシ24はともに反時計方向に回転駆動され、第2
の洗浄手段22の上部洗浄ブラシ23と下部洗浄ブラシ
24はともに時計方向に回転駆動されるようになってい
る。つまり、第1の洗浄手段21の下部洗浄ブラシ24
と、第2の洗浄手段22の上部洗浄ブラシ23は、基板
1の搬送方向と逆方向に回転駆動されるようになってい
る。
In this embodiment, both the upper cleaning brush 23 and the lower cleaning brush 24 of the first cleaning means 21 are rotated counterclockwise as shown by arrows in FIG.
The upper cleaning brush 23 and the lower cleaning brush 24 of the cleaning means 22 are driven to rotate clockwise. That is, the lower cleaning brush 24 of the first cleaning unit 21
Then, the upper cleaning brush 23 of the second cleaning means 22 is driven to rotate in the direction opposite to the transport direction of the substrate 1.

【0030】なお、第1の洗浄手段21の上流側と、第
2の洗浄手段22の下流側には、図1に示すように搬送
される基板1を支持するための支持ローラ37が回転自
在に配設されている。
A support roller 37 for supporting the conveyed substrate 1 is rotatable on the upstream side of the first cleaning means 21 and on the downstream side of the second cleaning means 22, as shown in FIG. It is arranged in.

【0031】図1乃至図3に示すように、上記第1の洗
浄手段21と第2の洗浄手段22との間には、基板1の
上面と下面とに向けて洗浄液Lを供給する液体供給手段
としての複数のノズル体41(図2と図3は上面側のノ
ズル体42のみを図示している。)が基板1の搬送方向
と交差する幅方向に沿って所定間隔で配設されている。
複数のノズル体41は、図2に鎖線で示すように洗浄液
Lの供給管42に所定間隔で設けられている。
As shown in FIGS. 1 to 3, between the first cleaning means 21 and the second cleaning means 22, a liquid supply for supplying a cleaning liquid L toward the upper surface and the lower surface of the substrate 1 is provided. A plurality of nozzle bodies 41 as means (FIGS. 2 and 3 show only the nozzle body 42 on the upper surface side) are arranged at predetermined intervals along a width direction intersecting the transport direction of the substrate 1. I have.
The plurality of nozzle bodies 41 are provided at predetermined intervals in the supply pipe 42 of the cleaning liquid L as shown by a chain line in FIG.

【0032】上記ノズル体41は、図3に示すように洗
浄液Lを角度αの拡がり角度で扇状に噴射する構造にな
っていて、扇状に拡がる方向を基板1の搬送方向に沿わ
せているとともに、図2に示すように基板1の板面と噴
射方向の中心線Oとがなす噴射角度θを所定角度に傾斜
させている。
As shown in FIG. 3, the nozzle body 41 has a structure in which the cleaning liquid L is jetted in a fan shape at a spread angle of the angle α, and the fan-shaped spread direction is set along the transport direction of the substrate 1. As shown in FIG. 2, the ejection angle θ formed by the plate surface of the substrate 1 and the center line O of the ejection direction is inclined at a predetermined angle.

【0033】つまり、ノズル体41は、噴射方向を基板
1の搬送方向と交差する幅方向に対して上記噴射角度θ
で傾斜させている。上記噴射角度θは、20〜80度、
好ましくは30〜70度の範囲がよい。傾斜角度θは、
基板1の板面に到達した洗浄液Lが図2に矢印Bで示す
基板1の幅方向一端に向かって所定の速度で確実に流動
する範囲がよい。なお、上記拡がり角度αは20〜12
0度、好ましくは45〜90度がよい。
That is, the nozzle body 41 has the above-described ejection angle θ with respect to the width direction intersecting the ejection direction with the transport direction of the substrate 1.
Incline. The injection angle θ is 20 to 80 degrees,
Preferably, the range is 30 to 70 degrees. The inclination angle θ is
It is preferable that the cleaning liquid L that has reached the plate surface of the substrate 1 surely flows at a predetermined speed toward one end in the width direction of the substrate 1 as indicated by an arrow B in FIG. The spread angle α is 20 to 12
0 degree, preferably 45 to 90 degrees.

【0034】ノズル体41を基板1の幅方向に対して所
定の角度で傾斜させたことで、基板1の上面と下面とに
供給される洗浄液Lは基板1の幅方向に沿って流れ、そ
の幅方向一端から流出する。つまり、基板1の上下面、
とくに上面に供給された洗浄液Lがその上面に滞留し難
くなる。
By inclining the nozzle body 41 at a predetermined angle with respect to the width direction of the substrate 1, the cleaning liquid L supplied to the upper surface and the lower surface of the substrate 1 flows along the width direction of the substrate 1, It flows out from one end in the width direction. That is, the upper and lower surfaces of the substrate 1,
In particular, the cleaning liquid L supplied to the upper surface is less likely to stay on the upper surface.

【0035】なお、第1の洗浄手段21の上流側には、
この第1の洗浄手段21に送り込まれる基板1の上下面
に洗浄液を供給する図示しないノズル体が設けられてい
る。それによって、基板1は乾燥した状態で第1の洗浄
手段21の上下一対の洗浄ブラシ23,24によって擦
られることがないようになっている。
In addition, on the upstream side of the first cleaning means 21,
A nozzle body (not shown) for supplying a cleaning liquid is provided on the upper and lower surfaces of the substrate 1 sent into the first cleaning means 21. This prevents the substrate 1 from being rubbed by the pair of upper and lower cleaning brushes 23 and 24 of the first cleaning means 21 in a dry state.

【0036】このような構成の処理装置によれば、基板
1は、搬送機構2の搬送ローラ9と押えローラ11とに
よって幅方向両端部の上下面が挟持されて矢印A方向に
搬送される。そして、基板1は第1の洗浄手段21の上
部洗浄ブラシ23と下部洗浄ブラシ24との間に入り込
み、これらの洗浄ブラシ23,24によって上下面がブ
ラシ洗浄された後、第2の洗浄手段22の上部洗浄ブラ
シ23と下部洗浄ブラシ24との間に入り込み、これら
の洗浄ブラシ23,24によって上下面がブラシ洗浄さ
れる。
According to the processing apparatus having such a configuration, the substrate 1 is conveyed in the direction of arrow A with the upper and lower surfaces of both ends in the width direction sandwiched by the conveying roller 9 and the pressing roller 11 of the conveying mechanism 2. Then, the substrate 1 enters between the upper cleaning brush 23 and the lower cleaning brush 24 of the first cleaning means 21, and the upper and lower surfaces thereof are brush-cleaned by these cleaning brushes 23, 24, and then the second cleaning means 22. Between the upper cleaning brush 23 and the lower cleaning brush 24, and the upper and lower surfaces are brush-cleaned by the cleaning brushes 23 and 24.

【0037】基板1の上面と下面とにはその上下面にそ
れぞれノズル体41から洗浄液Lが供給される。そのた
め、基板1の上下面は、洗浄液Lによって濡れた状態で
第1、第2の洗浄手段21,22によってブラシ洗浄さ
れるから、基板1の上下面に付着したパーティクルが上
下一対の洗浄ブラシ23,24によって洗浄除去される
ことになる。
The cleaning liquid L is supplied to the upper and lower surfaces of the substrate 1 from the nozzle body 41 on the upper and lower surfaces, respectively. Therefore, the upper and lower surfaces of the substrate 1 are brush-cleaned by the first and second cleaning means 21 and 22 in a state of being wet by the cleaning liquid L. , 24 to be washed away.

【0038】基板1から洗浄除去されたパーティクル
は、洗浄液Lととも流動する。洗浄液Lを供給するノズ
ル体41は、基板1の幅方向に対して所定の傾斜角度θ
で傾斜している。そのため、基板1の上下面に供給され
た洗浄液Lは基板1の幅方向に沿って流動し、その幅方
向一端から流出することになる。
The particles cleaned and removed from the substrate 1 flow together with the cleaning liquid L. The nozzle body 41 for supplying the cleaning liquid L has a predetermined inclination angle θ with respect to the width direction of the substrate 1.
It is inclined. Therefore, the cleaning liquid L supplied to the upper and lower surfaces of the substrate 1 flows along the width direction of the substrate 1 and flows out from one end in the width direction.

【0039】つまり、基板1の上下面、とくに上面に供
給された洗浄液Lはその上面に滞留し難くなる。そのた
め、基板1の上面に供給された洗浄液Lに、各洗浄手段
21,22の上部洗浄ブラシ23によって基板1から除
去されたパーティクルが含まれても、その洗浄液Lは基
板1の上面から迅速に流出するから、洗浄手段21,2
2によって除去されたパーティクルが基板1に再付着す
る確率を低くすることができる。
That is, the cleaning liquid L supplied to the upper and lower surfaces, especially the upper surface, of the substrate 1 hardly stays on the upper surface. Therefore, even if the cleaning liquid L supplied to the upper surface of the substrate 1 contains particles removed from the substrate 1 by the upper cleaning brush 23 of each of the cleaning means 21 and 22, the cleaning liquid L is quickly discharged from the upper surface of the substrate 1. The cleaning means 21 and 2
2 can reduce the probability that the particles removed will adhere to the substrate 1 again.

【0040】なお、基板1の下面においても、洗浄液L
を噴射角度θで傾斜させて流した方が、下部洗浄ブラシ
24によって基板1の下面から除去されたパーティクル
が洗浄液Lとともに基板1の幅方向一端へ流れ易くなる
から、基板1にパーティクルが再付着し難くくなるが、
基板1の下面に供給された洗浄液Lのほとんどはその下
面から落下する。そのため、基板1の下面においては、
洗浄液Lを所定の噴射角度θで傾斜させて噴射しなくと
もよい。
The cleaning liquid L is also applied to the lower surface of the substrate 1.
Is inclined at the injection angle θ, the particles removed from the lower surface of the substrate 1 by the lower cleaning brush 24 easily flow to one end of the substrate 1 in the width direction of the substrate 1 together with the cleaning liquid L. It is difficult to do,
Most of the cleaning liquid L supplied to the lower surface of the substrate 1 falls from the lower surface. Therefore, on the lower surface of the substrate 1,
The cleaning liquid L does not have to be injected at a predetermined injection angle θ.

【0041】さらに、基板1の搬送方向に沿って配置さ
れた第1の洗浄手段21と第2の洗浄手段22との間隔
が基板1の搬送方向に沿う長さ寸法に比べて小さく、基
板1が一対の洗浄手段21,22によって同時に挟持さ
れた状態で洗浄されることがある。とくに、基板1が大
型化すると、そのような傾向が発生し易い。
Further, the distance between the first cleaning means 21 and the second cleaning means 22 arranged along the transport direction of the substrate 1 is smaller than the length of the substrate 1 along the transport direction, and May be washed while being sandwiched by a pair of washing means 21 and 22 at the same time. In particular, when the size of the substrate 1 is increased, such a tendency is likely to occur.

【0042】基板1が一対の洗浄手段21,22によっ
て同時に洗浄される状態においては、基板1の上面に供
給された洗浄液Lが基板1の上面の搬送方向後端から流
出し難くなる。
In a state where the substrate 1 is simultaneously cleaned by the pair of cleaning means 21 and 22, the cleaning liquid L supplied to the upper surface of the substrate 1 hardly flows out from the rear end of the upper surface of the substrate 1 in the transport direction.

【0043】しかしながら、洗浄液Lを供給するノズル
体41が基板1の幅方向に対して所定の傾斜角度θで傾
斜していることで、基板1の上面に供給された洗浄液L
は基板1の幅方向一端から流出する。したがって、その
ような場合であっても、基板1の上面にパーティクルを
含む洗浄液Lが滞留し難いから、洗浄液Lに含まれるパ
ーティクルが基板1に再付着するのを防止できる。
However, since the nozzle body 41 for supplying the cleaning liquid L is inclined at a predetermined inclination angle θ with respect to the width direction of the substrate 1, the cleaning liquid L supplied on the upper surface of the substrate 1 is
Flows out from one end of the substrate 1 in the width direction. Therefore, even in such a case, since the cleaning liquid L containing particles hardly stays on the upper surface of the substrate 1, it is possible to prevent particles included in the cleaning liquid L from re-adhering to the substrate 1.

【0044】第2の洗浄手段22の上部洗浄ブラシ23
は、基板1の上面の洗浄効果を高めるために、基板1の
搬送方向と逆方向に回転駆動されている。そのため、こ
の上部洗浄ブラシ23によって基板1から除去されたパ
ーティクルは基板1の上面を搬送方向と逆方向に戻さ
れ、基板1の上面に再付着し易い。
The upper cleaning brush 23 of the second cleaning means 22
Is driven to rotate in the direction opposite to the transport direction of the substrate 1 in order to enhance the effect of cleaning the upper surface of the substrate 1. Therefore, the particles removed from the substrate 1 by the upper cleaning brush 23 are returned on the upper surface of the substrate 1 in the direction opposite to the transport direction, and easily adhere to the upper surface of the substrate 1 again.

【0045】しかしながら、上部洗浄ブラシ23によっ
て戻されたパーティクルは、ノズル体41から噴射され
る洗浄液Lによって基板1の幅方向の一端へ流され、洗
浄液Lとともに基板1の上面から除去されるため、上部
洗浄ブラシ23を基板1の搬送方向と逆方向に回転させ
ても、パーティクルが再付着するのを防止することがで
きる。
However, the particles returned by the upper cleaning brush 23 flow to one end in the width direction of the substrate 1 by the cleaning liquid L jetted from the nozzle body 41 and are removed from the upper surface of the substrate 1 together with the cleaning liquid L. Even if the upper cleaning brush 23 is rotated in the direction opposite to the direction in which the substrate 1 is transported, particles can be prevented from re-adhering.

【0046】上記一実施の形態では、洗浄手段の洗浄部
材として洗浄ブラシを用いた場合について説明したが、
洗浄部材としては洗浄ブラシに代わり、ロール状のスポ
ンジブラシなどであってもよく、要は基板の上下面を幅
方向全長にわたって洗浄できるものであればよい。
In the above embodiment, the case where the cleaning brush is used as the cleaning member of the cleaning means has been described.
The cleaning member may be a roll-shaped sponge brush or the like instead of the cleaning brush, and it is essential that the cleaning member be capable of cleaning the upper and lower surfaces of the substrate over the entire length in the width direction.

【0047】また、上記一実施の形態では、一対の洗浄
手段が基板の搬送方向に対して所定間隔で配置され、各
洗浄手段の上流側にノズル体を設けるようにしたが、洗
浄手段が1つだけの場合には、洗浄ブラシの回転方向に
応じてノズル体を洗浄手段の上流側あるいは下流側の少
なくとも一方に設けるようにすればよい。
In the above embodiment, a pair of cleaning means are arranged at a predetermined interval in the substrate transport direction, and a nozzle body is provided upstream of each cleaning means. In the case of only one, the nozzle body may be provided on at least one of the upstream side and the downstream side of the cleaning means according to the rotation direction of the cleaning brush.

【0048】[0048]

【発明の効果】この発明によれば、基板の上面に洗浄液
を、この基板の搬送方向と交差する方向に対し所定の傾
斜角度で供給するようにした。
According to the present invention, the cleaning liquid is supplied to the upper surface of the substrate at a predetermined inclination angle with respect to the direction intersecting the direction of transport of the substrate.

【0049】そのため、基板の上面に供給された洗浄液
は基板の搬送方向と交差する方向の端部から流出し、上
面に溜まり難くくなるから、基板を洗浄した洗浄液に含
まれるパーティクルが基板に再付着するのを防止するこ
とができる。
Therefore, the cleaning liquid supplied to the upper surface of the substrate flows out from the end in the direction intersecting with the transport direction of the substrate, and it is difficult for the cleaning liquid to collect on the upper surface. Adhesion can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の一実施の形態を示す処理装置の概略
的構成を示す側面図。
FIG. 1 is a side view showing a schematic configuration of a processing apparatus according to an embodiment of the present invention.

【図2】ノズル体の配置状態を示す説明図。FIG. 2 is an explanatory diagram showing an arrangement state of a nozzle body.

【図3】洗浄手段とノズル体との配置状態を示す概略
図。
FIG. 3 is a schematic diagram illustrating an arrangement state of a cleaning unit and a nozzle body.

【図4】洗浄手段を示す断面図。FIG. 4 is a sectional view showing a cleaning unit.

【図5】搬送手段を示す断面図。FIG. 5 is a cross-sectional view showing a transport unit.

【符号の説明】[Explanation of symbols]

1…基板 2…搬送機構 21…第1の洗浄手段 22…第2の洗浄手段 23…上部洗浄ブラシ(上部洗浄部材) 24…下部洗浄ブラシ(下部洗浄部材) 41…ノズル体 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Transport mechanism 21 ... First cleaning means 22 ... Second cleaning means 23 ... Upper cleaning brush (upper cleaning member) 24 ... Lower cleaning brush (lower cleaning member) 41 ... Nozzle body

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 21/304 644 H01L 21/304 644E H05K 3/26 H05K 3/26 A Fターム(参考) 3B116 AA02 AB16 BA02 BA15 BB22 3B201 AA02 AB16 BA02 BA15 BB22 BB92 CB11 CB25 5E343 AA02 AA22 AA26 BB71 EE01 EE03 EE04 FF23 GG11 GG20Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) H01L 21/304 644 H01L 21/304 644E H05K 3/26 H05K 3/26 A F term (reference) 3B116 AA02 AB16 BA02 BA15 BB22 3B201 AA02 AB16 BA02 BA15 BB22 BB92 CB11 CB25 5E343 AA02 AA22 AA26 BB71 EE01 EE03 EE04 FF23 GG11 GG20

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 基板を所定方向に搬送する搬送機構と、 上下方向に対向して配置された上部洗浄部材と下部洗浄
部材とを有し、これら洗浄部材によって上記搬送機構が
搬送する基板の上面と下面とを洗浄する洗浄手段と、 この洗浄手段の上流側あるいは下流側の少なくとも一方
に配置され洗浄手段によって洗浄される基板の上面と下
面のうちの少なくとも上面にこの基板の搬送方向と交差
する方向に対し所定の傾斜角度で液体を供給する液体供
給手段とを具備したことを特徴とする基板の洗浄装置。
1. A transfer mechanism for transferring a substrate in a predetermined direction, an upper cleaning member and a lower cleaning member disposed to face each other in a vertical direction, and the upper surface of the substrate transferred by the transfer mechanism by these cleaning members. Cleaning means for cleaning the substrate and the lower surface; and at least one of the upper surface and the lower surface of the substrate which is disposed at least upstream or downstream of the cleaning device and which is cleaned by the cleaning device, intersects the transport direction of the substrate. A substrate supply device for supplying a liquid at a predetermined inclination angle with respect to a direction.
【請求項2】 基板を所定方向に搬送する搬送機構と、 上下方向に対向して配置された上部洗浄部材と下部洗浄
部材とを有するとともに上記搬送機構によって搬送され
る基板の搬送方向に対して所定の間隔で配置され、上記
搬送機構が搬送する基板の上面と下面とをそれぞれ洗浄
する一対の洗浄手段と、 これら一対の洗浄手段の間に配置され洗浄手段によって
洗浄される基板の上面と下面のうちの少なくとも上面に
この基板の搬送方向と交差する方向に対し所定の傾斜角
度で液体を供給する液体供給手段とを具備したことを特
徴とする基板の洗浄装置。
2. A transport mechanism for transporting a substrate in a predetermined direction, an upper cleaning member and a lower cleaning member disposed to face each other in a vertical direction, and the transport mechanism transports the substrate in the transport direction of the substrate transported by the transport mechanism. A pair of cleaning means arranged at predetermined intervals for cleaning the upper surface and the lower surface of the substrate transported by the transport mechanism, respectively; and an upper surface and a lower surface of the substrate disposed between the pair of cleaning devices and cleaned by the cleaning means. A substrate supply device for supplying a liquid at a predetermined inclination angle with respect to a direction intersecting with the substrate transport direction on at least the upper surface of the substrate.
【請求項3】 上記上部洗浄部材と下部洗浄部材は、そ
れぞれ洗浄ブラシであることを特徴とする請求項1又は
請求項2記載の基板の洗浄装置。
3. The apparatus for cleaning a substrate according to claim 1, wherein the upper cleaning member and the lower cleaning member are each a cleaning brush.
【請求項4】 上記上部洗浄部材は、基板の搬送方向と
がY区方向に回転駆動されることを特徴とする請求項1
記載の基板の洗浄装置。
4. The apparatus according to claim 1, wherein the upper cleaning member is driven to rotate in a Y-direction with respect to a substrate transfer direction.
The apparatus for cleaning a substrate according to the above.
【請求項5】 対向して配置された上部洗浄部材と下部
洗浄部材との間に基板を送り込み、この基板の上面と下
面とを上記各洗浄部材によって洗浄する基板の洗浄方法
において、 上記上部洗浄手段と下部洗浄手段との間に送り込まれる
基板の上面と下面のうちの少なくとも上面に、この基板
の送り方向と交差する方向に対し所定の傾斜角度で液体
を供給することを特徴とする基板の洗浄方法。
5. A method of cleaning a substrate, comprising: feeding a substrate between an upper cleaning member and a lower cleaning member disposed opposite to each other; and cleaning an upper surface and a lower surface of the substrate by each of the cleaning members. Supplying a liquid at a predetermined inclination angle with respect to a direction intersecting with a direction in which the substrate is fed, to at least an upper surface of the upper surface and the lower surface of the substrate fed between the means and the lower cleaning means. Cleaning method.
JP2001003798A 2000-12-15 2001-01-11 Substrate cleaning device Expired - Fee Related JP4602567B2 (en)

Priority Applications (1)

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JP2001003798A JP4602567B2 (en) 2000-12-15 2001-01-11 Substrate cleaning device

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JP2000382162 2000-12-15
JP2000-382162 2000-12-15
JP2001003798A JP4602567B2 (en) 2000-12-15 2001-01-11 Substrate cleaning device

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CN110227686A (en) * 2018-03-06 2019-09-13 夏普株式会社 Cleaning device
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US7725976B1 (en) 2004-08-26 2010-06-01 The Sherwin-Williams Company Apparatus and method for the automated cleaning of articles
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JP2007020489A (en) * 2005-07-19 2007-02-01 Yoken Nukumi Washing apparatus of roll plate material for cultivating enoki mushroom and method for washing the same
KR100841501B1 (en) * 2005-12-13 2008-06-25 다이니폰 스크린 세이조우 가부시키가이샤 Substrate processing method and substrate processing apparatus
JP2008068223A (en) * 2006-09-15 2008-03-27 Nec Lcd Technologies Ltd Apparatus for washing substrate and method for washing substrate
JP2010214554A (en) * 2009-03-18 2010-09-30 Sanko Sangyo Kk Surface treatment device, its conveyor and conveyor belt
CN102646616A (en) * 2011-02-21 2012-08-22 芝浦机械电子株式会社 Substrate cleaning apparatus, substrate cleaning method, display manufacturing apparatus and display manufacturing method
CN110227686A (en) * 2018-03-06 2019-09-13 夏普株式会社 Cleaning device
CN109396084A (en) * 2018-11-20 2019-03-01 四川九洲电器集团有限责任公司 A kind of optical fiber cleaning device and optical fiber assembling line
CN109396084B (en) * 2018-11-20 2024-03-01 四川九洲电器集团有限责任公司 Optical fiber cleaning device and optical fiber assembly line
JP2022092713A (en) * 2020-12-11 2022-06-23 芝浦メカトロニクス株式会社 Substrate processing apparatus
JP7312738B2 (en) 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 Substrate processing equipment

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