KR890004597A - 적층복합재와 그 제조방법 및 회로판 - Google Patents

적층복합재와 그 제조방법 및 회로판 Download PDF

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KR890004597A
KR890004597A KR1019880010461A KR880010461A KR890004597A KR 890004597 A KR890004597 A KR 890004597A KR 1019880010461 A KR1019880010461 A KR 1019880010461A KR 880010461 A KR880010461 A KR 880010461A KR 890004597 A KR890004597 A KR 890004597A
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laminated composite
polyisocyanate
composition
prepared
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이이 요우네즈 우사마
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원본미기재
알코 케미칼 캄파니
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/02—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only
    • C08G18/022—Polymeric products of isocyanates or isothiocyanates of isocyanates or isothiocyanates only the polymeric products containing isocyanurate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/161—Catalysts containing two or more components to be covered by at least two of the groups C08G18/166, C08G18/18 or C08G18/22
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
    • C08G18/20—Heterocyclic amines; Salts thereof
    • C08G18/2045—Heterocyclic amines; Salts thereof containing condensed heterocyclic rings
    • C08G18/2063—Heterocyclic amines; Salts thereof containing condensed heterocyclic rings having two nitrogen atoms in the condensed ring system
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
    • C08K5/1565—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2120/00—Compositions for reaction injection moulding processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/902—High modulus filament or fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31547—Of polyisocyanurate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/647—Including a foamed layer or component

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음.

Description

적층복합재와 그 제조방법 및 회로판
내용없음

Claims (30)

  1. 대략 주위온도 내지 약140℃의 온도하에 금형속에서 유기 디-또는 폴리이소시아네이트와 약2-약50중량부의 고리형 알킬렌카르보네이트(상기 중량부는 이소시아네이트-카르보네이트 혼합물을 기준으로 한 것임)와의 반응 혼합물을, 촉매로서 총 조성물 기준으로 약0.005-약3.0중량%의 농도를 갖는 3차아민 및 고리형 알킬렌 카르보네이트의 가용성 부가물과 반응시킴으로써 제조된 경질 폴리이소시아네이트 열경화 조성물로된 한 개 이상의 층과, 금속, 셀룰로오스, 플라스틱, 유리 및 세라믹으로 이루어진 군에서 선택된 재료 혹은 그 이 조합물로 된 한 개 이상의 층을 상기 금형속에서 조합하여 만든 적층 복합재.
  2. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 고리형 알킬렌카르보네이트를 20-35중량부의 양으로 사용하여 제조되는 적층 복합재.
  3. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 부가물 촉매를 0.008-1.0중량%의 농도로 사용하여 제조되는 적층 복합재.
  4. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 디페닐메탄 디이소시아네이트를 사용하여 제조되는 적층 복합재.
  5. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 프로필렌카르보네이트 함유 반응혼합물을 사용하여 제조되는 적층 복합재.
  6. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 트리에틸렌디아민과 프로필렌카르보네이트의 가용성 부가물을 촉매로 사용하여 제조되는 적층복합재.
  7. 제1항에 있어서, 경질 폴리이소시아네이트 조성물이 강화제로서의 탄소 및/또는 유리섬유 매트로 성형되는 적층 복합재.
  8. 제1항에 있어서, 경질 폴리이소시아네이트층이 전기전도성 금속호일로 성형되는 적층 복합재.
  9. 제8항에 있어서, 전기전도성 금속 호일이 구리 호일 또는 처리된 구리 호일인 적층 복합재.
  10. 제1항에 있어서, 경질 폴리이소시아네이트층이 발포 플라스틱 단층으로 성형되는 적층 복합재.
  11. 제10항에 있어서, 발포 플라스틱 단층이 발포 폴리프로필렌인 적층 복합재.
  12. 제10항에 있어서, 발포 플라스틱 단층이 폴리스티렌과 폴리에틸렌의 발포 혼합물인 적층 복합재.
  13. 제10항에 있어서, 발포 플라스틱이 발포 폴리에틸렌의 적층 복합재.
  14. 제10항에 있어서, 발포 플라스틱이 발포 스티렌/무수말레이산 공중합체인 적층 복합재.
  15. 대략 주위온도 내지 약 140℃의 온도하에 금형속에서 디페닐메탄이소시아네이트와 약20-약35중량부의 플로필렌카르보네이트(상기 중량부는 이소시아네이트-카르보네이트 조성물을 기준으로 한 것임)와의 반응 혼합물을, 총 조성물 기준으로 약0.008-약1.0중량%의 농도를 갖는 트리에틸렌디아민 및 프로필렌 카르보네이트의 가용성 부가물과 반응시킴으로써 제조된 경질 폴리이소시아누레이트 열경화 조성물로 된 한 개 이상의 층과, 금속, 셀룰로오스, 플라스틱, 유리 및 세라믹으로 이루어진 군에서 선택된 재료 혹은 그의 조합물로 된 한 개 이상의 층을 상기 금형속에서 조합하여 만든 적층 복합재.
  16. 대략 주위온도 내지 약140℃의 온도하에 금형속에서 유기 디-또는 폴리이소시아네이트와 약2-약50중량부의 고리형 알킬렌카르보네이트(상기 중량부는 이소시아네이트-카르보네이트 혼합물을 기준으로 한 것임)와의 반응혼합물을, 촉매로서 총 조성물 기준으로 약0.005-약3.0중량%의 농도를 갖는 3차아민 및 고리형 알킬렌카르보네이트의 가용성 부가물과 반응시킴으로써 제조된 경질 폴리이소시아네이트 열경화 조성물로 된 한 개 이상의 층과, 금속, 셀룰로오스, 플라스틱, 유리 및 세라믹으로 이루어진 군에서 선택된 재료 혹은 그의 조합물로 된 한 개 이상의 층을 상기 금형의 캐비티속에서 조합하여 만드는 것을 포함하는 적층 복합재의 제조방법.
  17. 제16항에 있어서, 고리형 알킬렌카르보네이트가 약20-약35중량부의 양으로 사용되는 방법.
  18. 제16항에 있어서, 촉매 부가물이 약0.008-약1.0중량%의 농도로 사용되는 방법.
  19. 제16항에 있어서, 유기 디-또는 폴리이소시아네이트가 디페닐메탄 디이소시아네이트인 방법.
  20. 제19항에 있어서, 디페닐메탄 디이소시아네이트가 카르보디이미드를 제조된 것인 방법.
  21. 제19항에 있어서, 디페닐메탄 디이소시아네이트가 글리콜로 개조된 것인 방법.
  22. 제16항에 있어서, 알킬렌 카르보네이트가 프로필렌카르보네이트인 방법.
  23. 제16항에 있어서, 가용성 부가물이 트리에틸렌디아민과 프로필렌카르보네이트의 반응복합물인 방법.
  24. 제16항에 있어서, 폴리이소시아누레이트 반응 혼합물이 보강재로서의 유리섬유매트로 성형되는 방법.
  25. 전기전도성 재료로 된 한 개이상의 층과, 대략 주위온도 내지 약140℃의 온도하에 금형속에서 유기 디-또는 폴리이소시아네이트와 약2-약50중량부의 고리형 알킬렌카르보네이트(상기 중량부는 이소시아네이트-카르보네이트 혼합물을 기준으로 한 것임)와의 반응혼합물을, 촉매로서 총 조성물 기준으로 약0.005-약3.0중량%의 농도를 갖는 3차아민 및 고리형 알킬렌카르보네이트의 가용성 부가물과 반응시킴으로써 제조된 경질 폴리이소시아누레이트 열경화 조성물로 된 한 개 이상의 층으로 되어있는 기질을 포함하는 회로판.
  26. 제25항에 있어서, 전기전도성 재료가 금속호일 또는 처리된 금속호일 회로판.
  27. 제26항에 있어서, 전기전도성 금속호일이 구리호일 또는 처리된 구리호일인 회로판.
  28. 제25항에 있어서, 경질 폴리이소시아누레이트 조성물이 유리섬유 매트로 성형되는 회로판.
  29. 전기전도성 금속으로 된 적어도 한 개의 층과, 대략 주위온도 내지 약 140℃의 온도하에 금형속에서 디페닐 메탄디이소시아네이트와 약20=약35중량부의 프로필렌카르보네이트(상기 중량부는 이소시아네이트-카르보네이트 조성물을 기준으로한 것임)와의 반응혼합물을, 총 조성물 기준으로 약 0.008-약1.0중량%의 농도를 갖는 트리에틸렌디아민 및 프로필렌카르보네이트의 가용성 부가물과 반응시킴으로써 제조된 경질 폴리이소시아누레이트 열경화 조성물로 된 한 개 이상의 층으로 되어있는 기질을 포함하는 회로판.
  30. 제29항에 있어서, 전기전도성 금속이 구리호일 또는 처리된 구리호일인 회로판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880010461A 1987-08-17 1988-08-17 적층복합재와 그 제조방법 및 회로판 KR890004597A (ko)

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US8600987A 1987-08-17 1987-08-17
US07/086,009 1987-08-17
US185648 1988-04-25
US07/185,648 US4879164A (en) 1987-08-17 1988-04-25 Laminated composite of a rigid polyisocyanurate substrate and metal, plastic, cellulose, glass, ceramic or combinations thereof

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ES2019458B3 (es) 1991-06-16
CA1300327C (en) 1992-05-12
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DE3861227D1 (de) 1991-01-17
EP0304273B1 (en) 1990-12-05
EP0304273A1 (en) 1989-02-22

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