KR890001114A - 전식방지용 전기절연접착제 - Google Patents

전식방지용 전기절연접착제 Download PDF

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Publication number
KR890001114A
KR890001114A KR1019880007071A KR880007071A KR890001114A KR 890001114 A KR890001114 A KR 890001114A KR 1019880007071 A KR1019880007071 A KR 1019880007071A KR 880007071 A KR880007071 A KR 880007071A KR 890001114 A KR890001114 A KR 890001114A
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KR
South Korea
Prior art keywords
parts
epoxy compound
amount
adhesive
adhesive according
Prior art date
Application number
KR1019880007071A
Other languages
English (en)
Inventor
하기와라 야스요
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도날드 밀러 셀, 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 filed Critical 도날드 밀러 셀
Publication of KR890001114A publication Critical patent/KR890001114A/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/36Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681Metal alcoholates, phenolates or carboxylates
    • C08G59/683Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

전식방지용 전기절연접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 전기절연/전식특성을 시험하는데 사용된 시험패턴을 도시하는 것이다

Claims (7)

  1. (a)다작용성 에폭시 화합물, (b)적어도 하나의 알리시클릭 아미과(c) 페놀 또는 알킬 페놀로 구성되는 것을 특징으로 하는 전신억제용 실온경화성전기 절연접착제.
  2. 제 1 항에 있어서, 알리시클릭아민이 4,4'―디아미노시클로 헥실메탄, 3,3'―디메틸―4,4'―디아미노디시클로헥실메탄, 1,3―비스(아미노메틸)시클로헥산, 2―아미노―2―(4―아미노―4―메틸 시클로헥실)프로판과 3―아미노메틸―3,5,5―트리메틸 시클로헥실아민에서 선택되는 것을 특징으로 하는 접착제.
  3. 제 1 항에 있어서, 알킬페놀이 크레졸, 트리메틸페놀, 크실레놀, p―t―부틸페놀, p―옥틸페놀, 노닐페놀, 로릴페놀과 스테아릴페놀에서 선택되는 것을 특징으로 하는 접착제.
  4. 제 1 항에 있어서, 상기 알티시클릭아민은 100부의 에폭시 화합물에 대하여 약10―50중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
  5. 제 1 항에 있어서, 상기 알리시클릭아민은 100부의 에폭시 화합물에 대하여 약15―40중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
  6. 제 1 항에 있어서, 상기 페놀 또는 알킬페놀은 100부의 에폭시 화합물에 대하여 약5―10중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
  7. 제 1 항에 있어서, 상기 페놀 또는 알킬페놀은 100부의 에폭시 화합물에 대하여 약10―60중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880007071A 1987-06-12 1988-06-11 전식방지용 전기절연접착제 KR890001114A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62146804A JPH0749572B2 (ja) 1987-06-12 1987-06-12 電食防止用電気絶縁性接着剤
JP?62-146804 1987-06-12

Publications (1)

Publication Number Publication Date
KR890001114A true KR890001114A (ko) 1989-03-18

Family

ID=15415904

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880007071A KR890001114A (ko) 1987-06-12 1988-06-11 전식방지용 전기절연접착제

Country Status (6)

Country Link
JP (1) JPH0749572B2 (ko)
KR (1) KR890001114A (ko)
GB (1) GB2206351B (ko)
HK (1) HK42993A (ko)
MY (1) MY104317A (ko)
SG (1) SG83392G (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE596059A (ko) * 1959-10-16
CH500946A (de) * 1968-08-02 1970-12-31 Ciba Geigy Ag Verfahren zur Herstellung von neuen Addukten aus Polyepoxiden und Diaminen
US4296004A (en) * 1979-09-10 1981-10-20 Henkel Corporation Polycyclic polyamines

Also Published As

Publication number Publication date
JPH0749572B2 (ja) 1995-05-31
GB8813810D0 (en) 1988-07-13
GB2206351A (en) 1989-01-05
JPS63312378A (ja) 1988-12-20
SG83392G (en) 1992-12-04
GB2206351B (en) 1991-07-10
MY104317A (en) 1994-03-31
HK42993A (en) 1993-05-14

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