KR890001114A - 전식방지용 전기절연접착제 - Google Patents
전식방지용 전기절연접착제 Download PDFInfo
- Publication number
- KR890001114A KR890001114A KR1019880007071A KR880007071A KR890001114A KR 890001114 A KR890001114 A KR 890001114A KR 1019880007071 A KR1019880007071 A KR 1019880007071A KR 880007071 A KR880007071 A KR 880007071A KR 890001114 A KR890001114 A KR 890001114A
- Authority
- KR
- South Korea
- Prior art keywords
- parts
- epoxy compound
- amount
- adhesive
- adhesive according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/36—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes condensation products of phenols with aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
- C08G59/683—Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 전기절연/전식특성을 시험하는데 사용된 시험패턴을 도시하는 것이다
Claims (7)
- (a)다작용성 에폭시 화합물, (b)적어도 하나의 알리시클릭 아미과(c) 페놀 또는 알킬 페놀로 구성되는 것을 특징으로 하는 전신억제용 실온경화성전기 절연접착제.
- 제 1 항에 있어서, 알리시클릭아민이 4,4'―디아미노시클로 헥실메탄, 3,3'―디메틸―4,4'―디아미노디시클로헥실메탄, 1,3―비스(아미노메틸)시클로헥산, 2―아미노―2―(4―아미노―4―메틸 시클로헥실)프로판과 3―아미노메틸―3,5,5―트리메틸 시클로헥실아민에서 선택되는 것을 특징으로 하는 접착제.
- 제 1 항에 있어서, 알킬페놀이 크레졸, 트리메틸페놀, 크실레놀, p―t―부틸페놀, p―옥틸페놀, 노닐페놀, 로릴페놀과 스테아릴페놀에서 선택되는 것을 특징으로 하는 접착제.
- 제 1 항에 있어서, 상기 알티시클릭아민은 100부의 에폭시 화합물에 대하여 약10―50중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
- 제 1 항에 있어서, 상기 알리시클릭아민은 100부의 에폭시 화합물에 대하여 약15―40중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
- 제 1 항에 있어서, 상기 페놀 또는 알킬페놀은 100부의 에폭시 화합물에 대하여 약5―10중량부의 분량이 존재하는 것을 특징으로 하는 접착제.
- 제 1 항에 있어서, 상기 페놀 또는 알킬페놀은 100부의 에폭시 화합물에 대하여 약10―60중량부의 분량이 존재하는 것을 특징으로 하는 접착제.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62146804A JPH0749572B2 (ja) | 1987-06-12 | 1987-06-12 | 電食防止用電気絶縁性接着剤 |
JP?62-146804 | 1987-06-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR890001114A true KR890001114A (ko) | 1989-03-18 |
Family
ID=15415904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880007071A KR890001114A (ko) | 1987-06-12 | 1988-06-11 | 전식방지용 전기절연접착제 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH0749572B2 (ko) |
KR (1) | KR890001114A (ko) |
GB (1) | GB2206351B (ko) |
HK (1) | HK42993A (ko) |
MY (1) | MY104317A (ko) |
SG (1) | SG83392G (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8431444B2 (en) * | 2011-08-16 | 2013-04-30 | General Electric Company | Epoxy encapsulating and lamination adhesive and method of making same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE596059A (ko) * | 1959-10-16 | |||
CH500946A (de) * | 1968-08-02 | 1970-12-31 | Ciba Geigy Ag | Verfahren zur Herstellung von neuen Addukten aus Polyepoxiden und Diaminen |
US4296004A (en) * | 1979-09-10 | 1981-10-20 | Henkel Corporation | Polycyclic polyamines |
-
1987
- 1987-06-12 JP JP62146804A patent/JPH0749572B2/ja not_active Expired - Fee Related
-
1988
- 1988-06-10 GB GB8813810A patent/GB2206351B/en not_active Expired - Fee Related
- 1988-06-11 MY MYPI88000650A patent/MY104317A/en unknown
- 1988-06-11 KR KR1019880007071A patent/KR890001114A/ko not_active Application Discontinuation
-
1992
- 1992-08-21 SG SG833/92A patent/SG83392G/en unknown
-
1993
- 1993-05-06 HK HK429/93A patent/HK42993A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JPH0749572B2 (ja) | 1995-05-31 |
GB8813810D0 (en) | 1988-07-13 |
GB2206351A (en) | 1989-01-05 |
JPS63312378A (ja) | 1988-12-20 |
SG83392G (en) | 1992-12-04 |
GB2206351B (en) | 1991-07-10 |
MY104317A (en) | 1994-03-31 |
HK42993A (en) | 1993-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |