KR880011197U - 칩(Chip)부품의 부착장치 - Google Patents

칩(Chip)부품의 부착장치

Info

Publication number
KR880011197U
KR880011197U KR2019870011062U KR870011062U KR880011197U KR 880011197 U KR880011197 U KR 880011197U KR 2019870011062 U KR2019870011062 U KR 2019870011062U KR 870011062 U KR870011062 U KR 870011062U KR 880011197 U KR880011197 U KR 880011197U
Authority
KR
South Korea
Prior art keywords
attachment device
chip parts
chip
parts
attachment
Prior art date
Application number
KR2019870011062U
Other languages
English (en)
Other versions
KR920006486Y1 (ko
Inventor
츠요시 모리
Original Assignee
아루프스 덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아루프스 덴기 가부시끼가이샤 filed Critical 아루프스 덴기 가부시끼가이샤
Publication of KR880011197U publication Critical patent/KR880011197U/ko
Application granted granted Critical
Publication of KR920006486Y1 publication Critical patent/KR920006486Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR2019870011062U 1986-11-17 1987-07-07 칩(Chip)부품의 부착장치 KR920006486Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP86-176365 1986-11-17
JP1986176365U JPS6429899U (ko) 1986-11-17 1986-11-17

Publications (2)

Publication Number Publication Date
KR880011197U true KR880011197U (ko) 1988-07-29
KR920006486Y1 KR920006486Y1 (ko) 1992-09-18

Family

ID=16012343

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870011062U KR920006486Y1 (ko) 1986-11-17 1987-07-07 칩(Chip)부품의 부착장치

Country Status (2)

Country Link
JP (1) JPS6429899U (ko)
KR (1) KR920006486Y1 (ko)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968941A (ja) * 1982-10-13 1984-04-19 Nitto Kogyo Kk 自動チツプマウント装置の治具盤
JPS61100995A (ja) * 1984-10-22 1986-05-19 アルプス電気株式会社 チツプ部品の取付装置

Also Published As

Publication number Publication date
JPS6429899U (ko) 1989-02-22
KR920006486Y1 (ko) 1992-09-18

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