KR880005204A - Epoxy Resin Composition for Semiconductor Encapsulation - Google Patents

Epoxy Resin Composition for Semiconductor Encapsulation Download PDF

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Publication number
KR880005204A
KR880005204A KR1019860008697A KR860008697A KR880005204A KR 880005204 A KR880005204 A KR 880005204A KR 1019860008697 A KR1019860008697 A KR 1019860008697A KR 860008697 A KR860008697 A KR 860008697A KR 880005204 A KR880005204 A KR 880005204A
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South Korea
Prior art keywords
compound
epoxy resin
semiconductor encapsulation
resin composition
weight
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KR1019860008697A
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Korean (ko)
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KR890004089B1 (en
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이정대
오동섭
문창모
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정상영
고려화학 주식회사
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Priority to KR1019860008697A priority Critical patent/KR890004089B1/en
Publication of KR880005204A publication Critical patent/KR880005204A/en
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Publication of KR890004089B1 publication Critical patent/KR890004089B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음No content

Description

반도체 봉지용 에폭시수지 조성물Epoxy Resin Composition for Semiconductor Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (4)

노볼락형 에폭시수지, 페놀수지계 경화제로 되는 에폭시수지에서 유기포스핀계 화합물, 리오우레아계 화합물중에서 선정된 화합물 및 다음 일반식(I)의 비스아마이드계 화합물을 배합하는 것을 특징으로 하는 반도체 봉지용 에폭시수지 종성물.Epoxy for semiconductor encapsulation, comprising a compound selected from an organophosphine compound, a riourea compound and a bisamide compound of the following general formula (I) in a novolak type epoxy resin, an epoxy resin which is a phenol resin curing agent Resin species. 상기식에서 R1은 탄소수 15-20인 직쇄의 탄화수소기, R2는 수소 또는 메틸기, n은 2-10의 정수를 의미한다.In the above formula, R 1 is a straight chain hydrocarbon group having 15-20 carbon atoms, R 2 is hydrogen or methyl group, n is an integer of 2-10. 제1항에 있어서, 유기포스핀계 화합물과 티오우레아계 화합물의 혼합비가 무게비로 95:5-80:20이고, 이 혼합물을 노볼락형 엑폭시와 페놀수지계 경화제 전체무게의 0.05-10 중량% 함유하는 반도체 봉지용 에폭시수지 조성물.The mixing ratio of the organic phosphine compound and the thiourea compound is 95: 5-80: 20 by weight, and the mixture contains 0.05-10% by weight of the total weight of the novolak-type epoxy and phenol resin-based curing agents. Epoxy resin composition for semiconductor encapsulation. 제1항에 있어서, 일반식(I)의 비스아마이드계 화합물의 첨가량이 전체 조성물에 대하여 0.5-5중량%인 반도체 봉지용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the amount of the bisamide compound of general formula (I) added is 0.5-5% by weight based on the total composition. 제1항 및 제2항에 있어서, 티오우레아계 화합물이 에틸렌 리오우레아, N,N'-디페닐티오우레아 및 디올소 토릴티오우레아인 반도체 봉지용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1 or 2, wherein the thiourea-based compound is ethylene riourea, N, N'-diphenylthiourea and diolso torylthiourea. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019860008697A 1986-10-16 1986-10-16 Epoxy resin composition for encapsulating semiconductor KR890004089B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860008697A KR890004089B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition for encapsulating semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860008697A KR890004089B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition for encapsulating semiconductor

Publications (2)

Publication Number Publication Date
KR880005204A true KR880005204A (en) 1988-06-28
KR890004089B1 KR890004089B1 (en) 1989-10-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860008697A KR890004089B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition for encapsulating semiconductor

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KR (1) KR890004089B1 (en)

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Publication number Publication date
KR890004089B1 (en) 1989-10-20

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