KR890000585A - Epoxy Resin Compositions for Semiconductor Encapsulation - Google Patents

Epoxy Resin Compositions for Semiconductor Encapsulation Download PDF

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Publication number
KR890000585A
KR890000585A KR1019870006672A KR870006672A KR890000585A KR 890000585 A KR890000585 A KR 890000585A KR 1019870006672 A KR1019870006672 A KR 1019870006672A KR 870006672 A KR870006672 A KR 870006672A KR 890000585 A KR890000585 A KR 890000585A
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KR
South Korea
Prior art keywords
epoxy resin
semiconductor encapsulation
weight
composition
novolak
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Application number
KR1019870006672A
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Korean (ko)
Inventor
이정대
유창준
문창모
Original Assignee
정상영
고려화학 주식회사
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Application filed by 정상영, 고려화학 주식회사 filed Critical 정상영
Priority to KR1019870006672A priority Critical patent/KR890000585A/en
Publication of KR890000585A publication Critical patent/KR890000585A/en

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Abstract

내용 없음No content

Description

반도체 봉지용 에폭시 수지 조성물Epoxy Resin Compositions for Semiconductor Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

노볼락형 에폭시 수지와 페놀수지계 경화제를 기본 성분으로 하고, 경화촉진제, 무기총전재등의 공지의 배합물을 배합하고, 여기에 에폭시 수지와 폴리 부타디엔의 반응물 및 일반식(Ⅰ)의 구조를 지니는 비스 우레아계 화합물을 첨가하는 것을 특징으로하는 반도체 봉지용 에폭시 수지 조성물.Bis having a novolak-type epoxy resin and a phenol resin-based curing agent as a basic component, and a known compound such as a curing accelerator and an inorganic gun material, are blended therein, and a reaction product of the epoxy resin and polybutadiene and a structure of the general formula (I). An epoxy resin composition for semiconductor encapsulation, comprising adding a urea compound. (여기서, Z는 2관능성 방향족 탄소 수소기, R1, R2는 각각 서로 독립적으로 같거나 다를 수 있으며, 탄소수 1-6의 지방족 포화 탄화 수소기를 의미한다.(Wherein, Z is a bifunctional aromatic carbon hydrogen group, R1, R2 may each independently be the same or different, and means an aliphatic saturated hydrocarbon group of 1-6 carbon atoms. 제1항에 있어서, 비스 우레아계 화합물중 일반식(i)의 Z가A compound according to claim 1, wherein Z in general formula (i) 인 것을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.An epoxy resin composition for semiconductor encapsulation. 제1항에 있어서, 에폭시 수지와 폴리 부타디엔의 반응물의 배합량이 조성물 내의 노볼락형 에폭시 수지 100중량부에 대하여 10-50중량부, 비스 우레아계 화합물의 배합량이 조성물내의 노볼락형 에폭시 수지 100중량부에 대하여 1-10중량부의 범위로 첨가함을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.The amount of the reactant of the epoxy resin and the polybutadiene is 10-50 parts by weight based on 100 parts by weight of the novolak-type epoxy resin in the composition, and the amount of the bisurea-based compound is 100 parts by weight of the novolak-type epoxy resin in the composition. The epoxy resin composition for semiconductor encapsulation which is added in the range of 1-10 weight part with respect to a part. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870006672A 1987-06-30 1987-06-30 Epoxy Resin Compositions for Semiconductor Encapsulation KR890000585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019870006672A KR890000585A (en) 1987-06-30 1987-06-30 Epoxy Resin Compositions for Semiconductor Encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870006672A KR890000585A (en) 1987-06-30 1987-06-30 Epoxy Resin Compositions for Semiconductor Encapsulation

Publications (1)

Publication Number Publication Date
KR890000585A true KR890000585A (en) 1989-03-15

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KR1019870006672A KR890000585A (en) 1987-06-30 1987-06-30 Epoxy Resin Compositions for Semiconductor Encapsulation

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KR (1) KR890000585A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (en) * 1998-12-30 2000-07-15 유현식 Epoxy resin composition for semiconductor encapsulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000045210A (en) * 1998-12-30 2000-07-15 유현식 Epoxy resin composition for semiconductor encapsulation

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