KR880004029A - Epoxy Resin Composition for Semiconductor Encapsulation - Google Patents

Epoxy Resin Composition for Semiconductor Encapsulation Download PDF

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Publication number
KR880004029A
KR880004029A KR1019860008056A KR860008056A KR880004029A KR 880004029 A KR880004029 A KR 880004029A KR 1019860008056 A KR1019860008056 A KR 1019860008056A KR 860008056 A KR860008056 A KR 860008056A KR 880004029 A KR880004029 A KR 880004029A
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KR
South Korea
Prior art keywords
epoxy resin
semiconductor encapsulation
resin composition
functional group
pendant functional
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Application number
KR1019860008056A
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Korean (ko)
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KR890004088B1 (en
Inventor
이정대
오동섭
진일교
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정상영
고려화학 주식회사
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Priority to KR1019860008056A priority Critical patent/KR890004088B1/en
Publication of KR880004029A publication Critical patent/KR880004029A/en
Application granted granted Critical
Publication of KR890004088B1 publication Critical patent/KR890004088B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음No content

Description

반도체 봉지용 에폭시수지 조성물Epoxy Resin Composition for Semiconductor Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

노볼락계 에폭시수지, 다음구조식(Ⅰ)의 펜단트(pendant)형 관능기를 지니는 에폭시수지, 페놀수지계 경화제 및 경화촉매, 무기충진재로 구성되는 반도체 봉지용 에폭시수지 조성물.An epoxy resin composition for semiconductor encapsulation comprising a novolac epoxy resin, an epoxy resin having a pendant functional group of the following formula (I), a phenol resin curing agent and a curing catalyst, and an inorganic filler. 상기식에서 n은 0 또는 1이상의 정수이다.N is 0 or an integer of 1 or more. 제1항에 있어서, 구조식(Ⅰ)의 펜단트형 관능기를 지니는 에폭시수지가 에폭시당량 250-500범위인 것을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin having a pendant functional group of formula (I) is in the range of 250-500 epoxy equivalent weight. 제1항 및 제2항에 있어서, 구조식(Ⅰ)의 펜단트형 관능기를 지니는 에폭시수지와 노볼락례 에폭시수지의 배합비가 무게비로 5:95 내지 25:75인 반도체 봉지용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1 or 2, wherein the compounding ratio of the epoxy resin having the pendant functional group of the formula (I) and the novolak epoxy resin is 5:95 to 25:75 by weight. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019860008056A 1986-09-26 1986-09-26 Epoxy resin composition for encapsulating semiconductor KR890004088B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860008056A KR890004088B1 (en) 1986-09-26 1986-09-26 Epoxy resin composition for encapsulating semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860008056A KR890004088B1 (en) 1986-09-26 1986-09-26 Epoxy resin composition for encapsulating semiconductor

Publications (2)

Publication Number Publication Date
KR880004029A true KR880004029A (en) 1988-06-01
KR890004088B1 KR890004088B1 (en) 1989-10-20

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ID=19252497

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860008056A KR890004088B1 (en) 1986-09-26 1986-09-26 Epoxy resin composition for encapsulating semiconductor

Country Status (1)

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KR (1) KR890004088B1 (en)

Also Published As

Publication number Publication date
KR890004088B1 (en) 1989-10-20

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