KR880005203A - Epoxy Resin Composition for Semiconductor Encapsulation - Google Patents

Epoxy Resin Composition for Semiconductor Encapsulation Download PDF

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Publication number
KR880005203A
KR880005203A KR1019860008696A KR860008696A KR880005203A KR 880005203 A KR880005203 A KR 880005203A KR 1019860008696 A KR1019860008696 A KR 1019860008696A KR 860008696 A KR860008696 A KR 860008696A KR 880005203 A KR880005203 A KR 880005203A
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KR
South Korea
Prior art keywords
compound
resin composition
epoxy resin
semiconductor encapsulation
weight
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KR1019860008696A
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Korean (ko)
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KR900000422B1 (en
Inventor
이정대
오동섭
문창모
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정상영
고려화학 주식회사
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Priority to KR1019860008696A priority Critical patent/KR900000422B1/en
Publication of KR880005203A publication Critical patent/KR880005203A/en
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Publication of KR900000422B1 publication Critical patent/KR900000422B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음No content

Description

반도체 봉지용 에폭시수지 조성물Epoxy Resin Composition for Semiconductor Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

노볼락형 에폭시수지, 페놀수지계 경화제로 되는 에폭시수지에서 포스핀계 화합물과 다음 일반식(I)의 S-트리아진고리가 부가된 이미다졸계 화합물의 혼합물 및 다음 일반식(II)의 폴리아마이드계 화합물을 배합하는 것을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.A mixture of a phosphine compound and an imidazole compound to which an S-triazine ring of the following general formula (I) is added, and a polyamide compound of the general formula (II) Epoxy resin composition for semiconductor encapsulation comprising the compound. 상기식에서 R1은 수소, 메틸 또는 에틸기, R2는 탄소수 1-15인 포화탄화수소, 페닐기 또는 싸이크로헥실기, R3은 탄소수 15-25인 직쇄의 탄화수소, a,b는 서로 독립적으로 같거나 다를 수 있으며, 1-10의 정수, c는 2-12의 정수를 의미한다.Wherein R 1 is hydrogen, methyl or ethyl group, R 2 is saturated hydrocarbon having 1 to 15 carbon atoms, phenyl group or cyclohexyl group, R 3 is straight chain hydrocarbon having 15 to 25 carbon atoms, a, b are the same independently May vary, an integer from 1-10, c means an integer from 2-12. 제1항에 있어서, 유기포스핀계 화합물과 일반식(I)의 S-트리아진 고리가 부가된 이미다졸게 화합물의 혼합비가 무게비로 65:5-60:40이고, 이 혼합물을 노볼락형 에폭시와 페놀수지계 경화제 전체무게의 0.05-10중량% 함유량을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.The mixing ratio of the organophosphine compound and the imidazole compound to which the S-triazine ring of the general formula (I) is added is 65: 5-60: 40 by weight, and the mixture is a novolak-type epoxy. And 0.05-10% by weight of the total weight of the phenol resin curing agent. 제1항에 있어서, 일반식(II)의 플리아마이드계 화합물을 전체조성물에 대하여 0.5-10중량% 배합함을 특징으로 하는 반도체 봉지용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the plyamide compound of formula (II) is blended at 0.5-10% by weight based on the total composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019860008696A 1986-10-16 1986-10-16 Epoxy resin composition KR900000422B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860008696A KR900000422B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860008696A KR900000422B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition

Publications (2)

Publication Number Publication Date
KR880005203A true KR880005203A (en) 1988-06-28
KR900000422B1 KR900000422B1 (en) 1990-01-30

Family

ID=19252834

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860008696A KR900000422B1 (en) 1986-10-16 1986-10-16 Epoxy resin composition

Country Status (1)

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KR (1) KR900000422B1 (en)

Also Published As

Publication number Publication date
KR900000422B1 (en) 1990-01-30

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