KR880004542A - 집적회로 검사스테이션용 압전의 압력검출장치 - Google Patents
집적회로 검사스테이션용 압전의 압력검출장치 Download PDFInfo
- Publication number
- KR880004542A KR880004542A KR870001905A KR870001905A KR880004542A KR 880004542 A KR880004542 A KR 880004542A KR 870001905 A KR870001905 A KR 870001905A KR 870001905 A KR870001905 A KR 870001905A KR 880004542 A KR880004542 A KR 880004542A
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- piezoelectric element
- pad
- pressure pad
- detecting device
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims description 8
- 238000001514 detection method Methods 0.000 title claims 7
- 239000000523 sample Substances 0.000 claims description 7
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 2
- 229910002113 barium titanate Inorganic materials 0.000 claims 2
- 229920003023 plastic Polymers 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229920002379 silicone rubber Polymers 0.000 claims 2
- 239000004945 silicone rubber Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 지지구조체에 고정한 본 발명의 사시도.
제2도는 제1도 2-2선에 의한 부분단면도.
제3도는 검사프로브와 결합된 본 발명의 확대단면도.
제4도는 검사프로브와 결합된 본 발명의 다른 실시예에 대한 확대단면도.
Claims (15)
- 지지구조체에 장착된 검사프로브를 가진 집적회로 검사스테이션에서 사용하기 위한 압력검출장치에 있어서, 상기 프로브의 바로 위에 있는 상기 지지구조체에 고정된 탄성압력패드와, 상기 압력패드내에 매립되어 검사중 상기 압력패드상에 가해진 압력을 검출하며, 상기 압력패드에 가해진 압력에 비례하는 전기적 임펄스를 발생시키는 압전소자로 이루어지는 압력검출장치.
- 제1항에 있어서, 상기 압력패드에 강성의 팁이 부착되어 이루어지는 압력검출장치.
- 제2항에 있어서, 상기 팁이 투명플라스틱으로 이루어지는 압력검출장치.
- 제1항에 있어서, 상기 압력패드에는 이를 관통한 보어를 형성하여 사용자가 이 압력패드를 통하여 상기 프로브내의 아래로 들여다볼 수 있게 이루어지는 압력검출장치.
- 제1항에 있어서, 상기 압력패드가 투명한 실리콘고무로 이루어지는 압력검출장치.
- 제1항에 있어서, 상기 압전소자의 재료가 수정 또는 티타네이트바륨인 압력검출장치.
- 제1항에 있어서, 상기 압전소자가 중심이 개구된 영역을 가진 링형태로 이루어지며, 다수의 전기접촉리드를 그에 연결하여, 상기 압전소자에 의하여 발생된 전기적 임펄스를 상기 압력패드로부터 전송하여 이루어지는 압력검출장치.
- 제1항에 있어서, 상기 압전소자가 투명체인 디스크형태로 이루어지며, 다수의 전기접촉 리드를 그에 연결하여, 상기 압전소자에 의하여 발생된 전기적 임펄스를 상기 압력패드로부터 전송하여 이루어지는 압력검출장치.
- 지지구조체에 장착된 프로부를 가진 집적회로 검사스테이션에서 사용하기 위한 압력장치에 있어서,상기 프로브 바로 위에 상기 지지구조체에 고정되며, 관통된 보어를 형성하여 사용자가 이를 통하여 상기 프로브내의 아래로 들여다 볼 수 있게 이루어지는 탄성압력패드와, 상기 압력패드에 부착된 강성의 팁과, 상기 압력패드내에 매립되어 검사중 상기 압력패드상에 가해진 압력을 검출하며, 상기 압력패드에 가해진 압력에 비례하는 전기적 임펄스를 발생시키는 압전소자와, 상기 압전소자에 연결되어, 상기 압전소자에 의하여 발생된 전기적 임펄스를 상기 압력패드로부터 전송하는 다수의 전기접촉리드로 이루어지는 압력검출장치.
- 제9항에 있어서, 상기 압력패드가 투명한 실리콘고무로 이루어지는 압력검출장치.
- 제9항에 있어서, 상기 팁이 투명플라스틱으로 이루어지는 압력검출장치.
- 제9항에 있어서, 상기 압전소자가 중심이 개구된 영역을 가진 링형태로 이루어지는 압력검출장치.
- 제12항에 있어서, 상기 압전소자의 재료가 티타네이트바륨인 압력검출장치.
- 제9항에 있어서,상기 압전소자가 투명체인 디스크형태로 이루어지는 압력검출장치.
- 제14항에 있어서, 상기 압전소자의 재료가 수정인 압력검출장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/905,358 US4673839A (en) | 1986-09-08 | 1986-09-08 | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
US905358 | 2001-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880004542A true KR880004542A (ko) | 1988-06-04 |
Family
ID=25420688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR870001905A KR880004542A (ko) | 1986-09-08 | 1987-03-04 | 집적회로 검사스테이션용 압전의 압력검출장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4673839A (ko) |
EP (1) | EP0259942A3 (ko) |
JP (1) | JPS63184349A (ko) |
KR (1) | KR880004542A (ko) |
CA (1) | CA1251288A (ko) |
Families Citing this family (58)
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US4811246A (en) * | 1986-03-10 | 1989-03-07 | Fitzgerald Jr William M | Micropositionable piezoelectric contactor |
US4783719A (en) * | 1987-01-20 | 1988-11-08 | Hughes Aircraft Company | Test connector for electrical devices |
US5012186A (en) * | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
US5189363A (en) * | 1990-09-14 | 1993-02-23 | Ibm Corporation | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester |
US5304922A (en) * | 1991-08-26 | 1994-04-19 | Hughes Aircraft Company | Electrical circuit with resilient gasket support for raised connection features |
US5349263A (en) * | 1991-10-09 | 1994-09-20 | Mitsumi Electric Co., Ltd. | Pointing device suitable for miniaturization |
EP0547251A1 (en) * | 1991-12-14 | 1993-06-23 | International Business Machines Corporation | A method for testing a micro circuit |
US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
US5561377A (en) | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
US5621333A (en) * | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
US6046599A (en) * | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US5949239A (en) * | 1996-09-27 | 1999-09-07 | Altera Corporation | Test head apparatus for use in electronic device test equipment |
US5894161A (en) * | 1997-02-24 | 1999-04-13 | Micron Technology, Inc. | Interconnect with pressure sensing mechanism for testing semiconductor wafers |
US6127831A (en) * | 1997-04-21 | 2000-10-03 | Motorola, Inc. | Method of testing a semiconductor device by automatically measuring probe tip parameters |
US6002263A (en) | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
US6137299A (en) * | 1997-06-27 | 2000-10-24 | International Business Machines Corporation | Method and apparatus for testing integrated circuit chips |
US6426636B1 (en) | 1998-02-11 | 2002-07-30 | International Business Machines Corporation | Wafer probe interface arrangement with nonresilient probe elements and support structure |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6343369B1 (en) | 1998-09-15 | 2002-01-29 | Microconnect, Inc. | Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US6496026B1 (en) | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
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US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
US6836135B2 (en) | 2001-08-31 | 2004-12-28 | Cascade Microtech, Inc. | Optical testing device |
WO2003100445A2 (en) | 2002-05-23 | 2003-12-04 | Cascade Microtech, Inc. | Probe for testing a device under test |
US6847219B1 (en) | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US7250779B2 (en) | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
US6861856B2 (en) | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
US6720789B1 (en) | 2003-02-13 | 2004-04-13 | International Business Machines Corporation | Method for wafer test and wafer test system for implementing the method |
US7221172B2 (en) | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
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US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
JP2007517231A (ja) | 2003-12-24 | 2007-06-28 | カスケード マイクロテック インコーポレイテッド | アクティブ・ウェハプローブ |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
DE202005021434U1 (de) | 2004-06-07 | 2008-03-20 | Cascade Microtech, Inc., Beaverton | Thermooptische Einspannvorrichtung |
EP1766426B1 (en) | 2004-07-07 | 2013-09-11 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7253648B2 (en) * | 2005-05-27 | 2007-08-07 | Tektronix, Inc. | Signal acquisition probe having a retractable double cushioned probing tip with EOS/ESD protection capabilities |
US7167011B2 (en) * | 2005-05-27 | 2007-01-23 | Tektronix, Inc. | Differential measurement probe having retractable double cushioned variable spacing probing tips with EOS/ESD protection capabilities |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
JP2017129395A (ja) * | 2016-01-19 | 2017-07-27 | 三菱電機株式会社 | 半導体装置の検査装置および半導体装置の検査方法 |
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US3213666A (en) * | 1962-11-29 | 1965-10-26 | Gulton Ind Inc | Impact sensor |
US3832632A (en) * | 1971-11-22 | 1974-08-27 | F Ardezzone | Multi-point probe head assembly |
US3810016A (en) * | 1971-12-17 | 1974-05-07 | Western Electric Co | Test probe for semiconductor devices |
DE2344239B2 (de) * | 1973-09-01 | 1977-11-03 | Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen | Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet |
US4079362A (en) * | 1976-07-02 | 1978-03-14 | Canadian Patents And Development Limited | Piezo-electric seed-flow monitor |
US4195259A (en) * | 1978-04-04 | 1980-03-25 | Texas Instruments Incorporated | Multiprobe test system and method of using same |
GB2094479B (en) * | 1978-01-30 | 1983-03-16 | Texas Instruments Inc | Determining probe contact in testing integrated circuits |
JPS58164236U (ja) * | 1982-04-27 | 1983-11-01 | 日本電気ホームエレクトロニクス株式会社 | 半導体ウエ−ハ特性測定装置 |
-
1986
- 1986-09-08 US US06/905,358 patent/US4673839A/en not_active Expired - Fee Related
-
1987
- 1987-02-24 CA CA000530444A patent/CA1251288A/en not_active Expired
- 1987-03-04 KR KR870001905A patent/KR880004542A/ko not_active Application Discontinuation
- 1987-03-20 EP EP87302425A patent/EP0259942A3/en not_active Withdrawn
- 1987-08-31 JP JP62217761A patent/JPS63184349A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63184349A (ja) | 1988-07-29 |
EP0259942A2 (en) | 1988-03-16 |
JPH0345541B2 (ko) | 1991-07-11 |
US4673839A (en) | 1987-06-16 |
EP0259942A3 (en) | 1989-10-04 |
CA1251288A (en) | 1989-03-14 |
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