KR880004100A - 가죽의 탄처리방법 - Google Patents

가죽의 탄처리방법 Download PDF

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KR880004100A
KR880004100A KR870010639A KR870010639A KR880004100A KR 880004100 A KR880004100 A KR 880004100A KR 870010639 A KR870010639 A KR 870010639A KR 870010639 A KR870010639 A KR 870010639A KR 880004100 A KR880004100 A KR 880004100A
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Prior art keywords
melamine
formaldehyde resin
glycol ethers
formaldehyde
weight
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KR870010639A
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KR910002453B1 (ko
Inventor
푀르슈터 프랑크
켈러 칼프리트
벡커 헤르만
로쯔 베르너
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우르바하, 오이흐너
카젤라 아크 티엔게젤샤프트
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Publication of KR880004100A publication Critical patent/KR880004100A/ko
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Publication of KR910002453B1 publication Critical patent/KR910002453B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C14—SKINS; HIDES; PELTS; LEATHER
    • C14C—CHEMICAL TREATMENT OF HIDES, SKINS OR LEATHER, e.g. TANNING, IMPREGNATING, FINISHING; APPARATUS THEREFOR; COMPOSITIONS FOR TANNING
    • C14C3/00—Tanning; Compositions for tanning
    • C14C3/02—Chemical tanning
    • C14C3/08—Chemical tanning by organic agents
    • C14C3/18—Chemical tanning by organic agents using polycondensation products or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C14—SKINS; HIDES; PELTS; LEATHER
    • C14C—CHEMICAL TREATMENT OF HIDES, SKINS OR LEATHER, e.g. TANNING, IMPREGNATING, FINISHING; APPARATUS THEREFOR; COMPOSITIONS FOR TANNING
    • C14C3/00—Tanning; Compositions for tanning
    • C14C3/02—Chemical tanning
    • C14C3/08—Chemical tanning by organic agents
    • C14C3/16—Chemical tanning by organic agents using aliphatic aldehydes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0103—Zinc [Zn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Treatment And Processing Of Natural Fur Or Leather (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

가죽의 탄처리방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 공정의 말기에 산 촉매의 존재하에서 수용성 메라민-포름알데하이드 수지로 표피를 탄닝(tanning) 하여 가죽을 탄처리하는 방법에 있어서, 사용되는 멜라민-포름알데하이드 수지가 글리콜 에테르 및/또는 알킬 글리콜 에테르로 적어도 부분적으로 에테르화됨을 특징으로 하는 방법.
  2. 제1항에 있어서, 멜라민과 포름알데하이드의 몰비가 1 : (2 내지 7)인 멜라민-포름알데하이드 수지를 사용함을 특징으로 하는 방법.
  3. 제1항에 있어서, 사용되는 멜라민-포름알데하이드 수지가 멜라민 몰당 글리콜 에테르 및/또는 알킬 글리콜 에테르 1 내지 5몰, 1가 또는 다가 수성 알코올 및/또는 비환원당 0 내지 1몰, 및/또는 알카리 금속아황산염 및/또는 알칼리 금속 설팜산염 0 내지 1몰의 존재하에서 멜라민과 포름알데하이드를 1 : (2 내지 7)의 몰비로 축합시킴으로써 제조됨을 특징으로 하는 방법.
  4. 제1항에 있어서, 사용되는 멜라민-포름알데하이드 수지가 글리콜 에테르 및/또는 알킬 글리콜 에테르 1 내지 3몰, 1가 또는 다가 수성 알코올 및/또는 비환원당 0 내지 0.4몰, 및/또는 알칼리 금속 아황산염 및/또는 알칼리 금속 설팜산염 0 내지 0.4몰의 존재하에서 멜라민과 포름알데하이드를 1 : (2 내지 7)의 몰비로 축합시킴으로써 제조됨을 특징으로 하는 방법.
  5. 제1항 내지 제4항중의 어느 한 항에 있어서, 사용되는 멜라민-포름알데하이드 수지가 글리콜 에테르 및/또는 알킬 글리콜 에테르로 적어도 부분적으로 에테르화되며, 여기에 60중량%이하의 음이온성 개질 멜라민-포름알데하이드 수지를 가함을 특징으로 하는 방법.
  6. 제5항에 있어서, 가해지는 음이온성 개질 멜라민-포름알데하이드 수지가 50중량%이하의 멜라민을 우레아로 대체시킴으로써 제조됨을 특징으로 하는 방법.
  7. 제5항 및/또는 제6항에 있어서, 가해지는 음이온성 개질 멜라민-포름알데하이드 수지가 30중량% 이하의 멜라민을 우레아로 대체시킴으로써 제조됨을 특징으로 하는 방법.
  8. 제1항 내지 제7항중의 어느 한 항에 있어서, 사용되는 음이온성 개질 멜라민-포름알데하이드 수지가 글리콜 에테르 및/또는 알킬 그리콜 에테르로 적어도 부분적으로 에테르화되고, 50중량% 이하의 멜라민을 우레아로 대체시킴으로써 제조됨을 특징으로 하는 방법.
  9. 제1항 내지 제8항중의 어느 한 항에 있어서, 사용되는 음이온성 개질 멜라민-포름알데하이드 수지가 글리콜 에테르 및/또는 알킬 글리콜 에테르로 적어도 부분적으로 에테르화되고, 30중량% 이하의 멜라민을 우레아로 대체시킴으로써 제조됨을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870010659A 1986-09-25 1987-09-25 본딩방법 KR910002453B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP224765 1986-09-25
DEP3632587.2 1986-09-25
DE19863632587 DE3632587A1 (de) 1986-09-25 1986-09-25 Verfahren zur gerbung von leder
JP71651 1987-03-27
JP113698 1987-05-12

Publications (2)

Publication Number Publication Date
KR880004100A true KR880004100A (ko) 1988-06-01
KR910002453B1 KR910002453B1 (ko) 1991-04-22

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ID=6310331

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Application Number Title Priority Date Filing Date
KR1019870010659A KR910002453B1 (ko) 1986-09-25 1987-09-25 본딩방법

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US (1) US4822372A (ko)
EP (1) EP0264628A1 (ko)
JP (1) JPS6389599A (ko)
KR (1) KR910002453B1 (ko)
BR (1) BR8704919A (ko)
DE (1) DE3632587A1 (ko)
PT (1) PT85783B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4108139A1 (de) * 1991-03-13 1992-09-17 Boehme Chem Fab Kg Verfahren zum gerben von leder und pelzen
DE4426186A1 (de) * 1994-07-23 1996-01-25 Basf Ag Glykoletherhaltige Aminotriazinderivate und ihre Verwendung in Lackharzen
DE19707713A1 (de) * 1997-02-26 1998-08-27 Basf Ag Zusammensetzung zur Behandlung von gegerbtem Leder, sowie ihre Herstellung
DE102005050193A1 (de) 2005-10-18 2007-04-19 Basf Ag Verfahren zur Herstellung von Leder und dafür geeignete Produkte
JP5172228B2 (ja) 2007-06-28 2013-03-27 ミドリホクヨー株式会社 革
WO2009010546A1 (de) * 2007-07-19 2009-01-22 Basf Se Unvernetzte, hochverzweigte methyloltriaminotriazinether
ATE521720T1 (de) * 2007-10-24 2011-09-15 Basf Se Verfahren zur herstellung von leder
BRPI0912803A2 (pt) 2008-05-16 2015-10-13 Honda Motor Co Ltd couro natural
EP3196195A1 (en) 2016-01-22 2017-07-26 Basf Se Melamine-polyethers as dispersants in non-aqueous, liquid pigment compositions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2326740A (en) * 1940-08-03 1943-08-17 Rca Corp Broadcast facsimile transmission
US2316741A (en) * 1942-07-25 1943-04-13 American Cyanamid Co Leather manufacture
DE827225C (de) * 1942-07-25 1952-01-10 American Cyanamid Co Verfahren zur Herstellung von Leder
DE1264678B (de) * 1952-03-18 1968-03-28 Diamond Alkali Co Verfahren zum Behandeln von Leder
US2944046A (en) * 1952-09-23 1960-07-05 Jacques Wolf & Co Process for the production and use of novel tanning agents and products produced by such process
US3068190A (en) * 1958-12-05 1962-12-11 Dal Mon Research Co Condensation of aldehydes with triazinyl aryl sulfonic acid derivatives and process of preparing same

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PT85783A (de) 1987-10-01
BR8704919A (pt) 1988-05-17
JPS6389599A (ja) 1988-04-20
US4822372A (en) 1989-04-18
KR910002453B1 (ko) 1991-04-22
EP0264628A1 (de) 1988-04-27
DE3632587A1 (de) 1988-04-07
PT85783B (de) 1990-01-04

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