KR880003411A - Wafer Support Mechanism - Google Patents

Wafer Support Mechanism Download PDF

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Publication number
KR880003411A
KR880003411A KR1019870008806A KR870008806A KR880003411A KR 880003411 A KR880003411 A KR 880003411A KR 1019870008806 A KR1019870008806 A KR 1019870008806A KR 870008806 A KR870008806 A KR 870008806A KR 880003411 A KR880003411 A KR 880003411A
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South Korea
Prior art keywords
shaft
wafer
chuck
driving
rotating
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KR1019870008806A
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Korean (ko)
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KR920000673B1 (en
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카오루 신바라
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이시다 도쿠지로오
다이닛뽕스쿠링 세이소오 가부시키가이샤
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Publication of KR880003411A publication Critical patent/KR880003411A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

내용 없음No content

Description

웨이퍼 지지기구Wafer Support Mechanism

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 관련된 기구의 제2실시예를 나타낸 종 단면도,3 is a longitudinal sectional view showing a second embodiment of the appliance according to the present invention;

제4도는 제3도의 기구의 평면도,4 is a plan view of the mechanism of FIG.

제5도는 제2실시예의 웨이퍼 해지기구의 요부를 나타내는 종 단면도.Fig. 5 is a longitudinal sectional view showing the main part of the wafer release mechanism of the second embodiment.

Claims (19)

웨이퍼를 회전시키면서 웨이퍼의 표면처리를 시행하는 장치에 있어서, 상기 장치내에 처리실을 형성하는 하우징과, 상기 하우징 내부로 돌설된 상단부를 가진 중공체인 회전축과, 상기 회전축의 돌설된 상단부에 수평으로 장착되고 최소한 3개의 암이 방사상으로 연장 형성된 회전판 부재와, 웨이퍼의 외주연부를 동시에 지지하기 위하여 상기 각각의 암 상면에 설치되고, 그중 최소한 한개는 상기 암에 연하여 수평으로 이동자재로 설치된 척크 부재와, 상기 회전축 내부에 삽설되고 상기 척크부재가 웨이퍼를 지지할 수 있도록 작동시키기 위하여 상기 회전축에 대하여 회동되게 설치된 구동축과, 일단은 상기 구동축의 회전축심에 대하여 편심되게 상기 구동축의 상단부에 연결되고 타단은 상기 가동 척크부재에 연제된 링크 부재와, 상기 링크부재를 통하여 상기 가동 척크부재가 웨이퍼를 지지할 수 있는 방향으로 상기 회전축에 대하여 상기 구동측에게 항시 회동력을 부여하기 위하여 상기 회전축과 상기 구동축의 하단부 사이에 연제 설치된 작동수단과, 상기 가동척크부재가 웨이퍼를 해지시킬 수 있도록 상기 작동 수단에 인접되게 배설되고 상기 구동축이 상기 작동수단에 의하여 회동되는 상기 방향에 역방향으로 상기 구동축을 회동시키는 구동수단으로 구성된 웨이퍼 지지기구.An apparatus for performing a surface treatment of a wafer while rotating a wafer, the apparatus comprising: a rotating shaft which is a hollow body having a housing forming a processing chamber in the apparatus, an upper end projecting into the housing, and a horizontally mounted upper end of the rotating shaft; At least three arms extending radially from the rotating plate member, the chuck members disposed on the upper surface of each arm to support the outer periphery of the wafer at the same time, at least one of which is connected to the arm and is horizontally movable; A drive shaft inserted into the rotary shaft and installed to be rotated with respect to the rotary shaft to operate the chuck member to support the wafer, one end of which is connected to an upper end of the drive shaft eccentrically with respect to the rotary shaft center of the drive shaft, and the other end of the A link member softened to the movable chuck member, and the link member An actuating means softly installed between the rotating shaft and the lower end of the driving shaft to give the driving side a rotational force with respect to the driving side at all times in a direction in which the movable chuck member can support the wafer; And a driving means arranged to be adjacent to the operating means so as to release the driving means and rotating the driving shaft in a direction opposite to the direction in which the driving shaft is rotated by the operating means. 제1항에 있어서, 상기 자동 척크부재는 상기 암에 연하여 습동자재로 장착되고 상기 링크부재의 타단과 연계된 슬라이더부재에 고정되고, 타 척크부재는 상기 암에 고정되며, 또한 상기 슬라이더 부재와 동일한 무게의 발란서 부재는 상기 구동축의 회전축심에 대하여 상기 슬라이더 부재와 대칭으로 배설되고 상기 암에 연하여 습동자재로 장착하여 구성된 웨이퍼 지지기구.The slider of claim 1, wherein the automatic chuck member is attached to the arm and is fixed to the slider member connected to the other end of the link member, and the other chuck member is fixed to the arm. And a balancer member having the same weight is disposed symmetrically with the slider member with respect to the axis of rotation of the drive shaft, and is attached to the arm and mounted with sliding material. 제2항에 있어서, 상기 발란서 부재는 다른 링크부재의 일단에 연제되고 이 링크부재의 타단은 상기 구동축의 상기 상단부에 상기 또 다른 링크 부재의 일단과 함께 연결하여 구성된 웨이퍼 지지기구.The wafer support mechanism according to claim 2, wherein the balancer member is softened to one end of the other link member and the other end of the link member is connected to the upper end of the drive shaft together with one end of the another link member. 제1항에 있어서, 상기 척크부재는 높이에 차이를 두고 형성되며, 상기 척크부재에 연관되게 상기 전체 암의 끝단에 의하여 형성되는 원의 내측으로 방사상으로 다수의 웨이퍼 재치핀을 설치하여 구성된 웨이퍼 지지기구.The wafer support according to claim 1, wherein the chuck member is formed with a difference in height, and is formed by installing a plurality of wafer wit pins radially inwardly of a circle formed by an end of the entire arm in association with the chuck member. Instrument. 제1항에 있어서, 상기 작동수단은 상기 회전축과 상기 구동축의 하단부 사이에 핀을 설치하여 상기 회전축에 대하여 상기 구동축이 회동력을 부여받도록 상호 대향되는 상기 양 핀사이에 항시 인장력을 받도록 연결된 스프링으로 구성된 웨이퍼 지지기구.According to claim 1, wherein the actuating means is a spring connected between the rotational shaft and the lower end of the drive shaft by a spring connected between the two pins which are opposed to each other so that the driving shaft is given a rotational force with respect to the rotating shaft Configured wafer support mechanism. 제1항에 있어서, 상기 구동수단은 상기 역방향으로 상기 회전축에 대하여 상기 구동축을 회동시킬 수 있도록 상기 구동축의 상기 하단부에 설치된 핀을 압압하기 위한 에어 실린더로 구성된 웨이퍼 지지기구.The wafer support mechanism according to claim 1, wherein the driving means comprises an air cylinder for pressing a pin provided at the lower end of the driving shaft so as to rotate the driving shaft with respect to the rotating shaft in the reverse direction. 제1항에 있어서, 상기 구동수단은 상기 회전축이 하강시에 상기 구동축을 상기 회전축에 대하여 상기 역방향으로 회동시킬 수 있도록 상기 구동축의 하단부에 형성된 캠 폴로워와 계합이 되게 상기 구동축의 최하단부 하방으로 배설된 캠 부재로 구성된 웨이퍼 지지기구.The driving means of claim 1, wherein the driving means is disposed below the lowermost end of the driving shaft so that the driving shaft engages with a cam follower formed at a lower end of the driving shaft so that the driving shaft can rotate in the opposite direction with respect to the rotating shaft when the rotating shaft is lowered. Support mechanism consisting of a cam member. 제1항에 있어서, 상기 가동 척크부재는 상기 암에 대하여 회동되고 상기 링크부재의 타단과연결된 회동부재에 고정되어 이에 의하여 상기 회동부재가 상기 링크부재를 통하여 상기 구동축의 회동에 연동되어 회동시에 상기 회동부재에 의하여 상기 가동 척크부재가 회동되어 웨이퍼를 지지하도록 구성된 웨이퍼 지지기구.The rotating chuck member of claim 1, wherein the movable chuck member is pivoted with respect to the arm and is fixed to a pivot member connected to the other end of the link member, whereby the pivot member is interlocked with the rotation of the drive shaft through the link member. And the movable chuck member is pivoted by a pivoting member to support the wafer. 제7항에 있어서, 상기 가동 척크부재는 웨이퍼 재치부와 척크부로 구성된 웨이퍼 지지기구.8. The wafer support mechanism of claim 7, wherein the movable chuck member is comprised of a wafer placing portion and a chuck portion. 제8항에 있어서, 상기 가동 척크부재의 척크부는 절결부로 구성된 웨이퍼 지지기구.The wafer support mechanism according to claim 8, wherein the chuck portion of the movable chuck member is formed of a cutout portion. 제8항에 있어서, 상기 가동척크부재의 척크부는 상기 가동 척크부재의 몸체의 회전축에 편심되게 상기 재치부에 형성된 본질적으로 소원주로 구성된 웨이퍼 지지기구.9. The wafer support mechanism of claim 8, wherein the chuck portion of the movable chuck member is composed essentially of a circumference formed in the placement portion eccentrically to a rotation axis of the body of the movable chuck member. 웨이퍼를 회전시키면서 웨이퍼의 표면처리를 시행하는 장치에 있어서, 상기 장치내에 처리실을 형성하는 하우징과, 상기 하우징 내부로 돌설된 상단부를 가진 중공체인 회전축과, 상기 회전축의 돌설된 상단부에 장착된 회전판 부재와, 웨이퍼의 외주연부를 동시에 지지하기 위하여 상기 회전판 부재에 설치되고, 그중 최소한 한개는 상기 회전판 부재에 연하여 방사상으로 이동자재로 설치된 최소한 3개의 척크 부재와, 상기 회전축 내부에 삽설되고 상기 가동 척크부재 웨이퍼를 지지할 수 있도록 작동시키기 위하여 상기 회전축에 대하여 회동되게 설치된 구동축과, 일단은 상기 구동축의 회전축심에 대하여 편심되게 상기 구동축의 상단부에 연결되고 타단은 상기 가동 척크부재에 연제된 링크 부재와, 상기 링크부재를 통하여 상기 가동 척크부재가 웨이퍼를 지지할 수 있는 방향으로 상기 회전축에 대하여 상기 구동측에게 항시 회동력을 부여하기 위하여 상기 회전축과 상기 구동축의 하단부 사이에 연계 설치된 작동수단과, 상기 가동척크부재와 웨이퍼를 해지시킬 수 있도록 상기 작동 수단에 인접되게 배설되고 상기 구동축이 상기 작동수단에 의하여 회동되는 상기 방향에 역방향으로 상기 구동축을 회동시키는 구동수단으로 구성된 웨이퍼 지지기구.An apparatus for performing a surface treatment of a wafer while rotating a wafer, the apparatus comprising: a housing forming a processing chamber in the apparatus, a rotating shaft that is a hollow body having an upper end protruding into the housing, and a rotating plate member mounted on the protruding upper end of the rotating shaft. And at least three chuck members installed on the rotary plate member to support the outer periphery of the wafer at the same time, at least one of which is connected to the rotary plate member radially with a moving material, and inserted into the rotary shaft and the movable chuck. A drive shaft rotatably installed with respect to the rotation shaft to operate the member wafer so as to be supported, and one end connected to an upper end of the drive shaft eccentrically with respect to the rotation shaft center of the drive shaft, and the other end connected to the link member softened to the movable chuck member; Through the link member, the movable chuck member The operating means interlocked between the rotating shaft and the lower end of the driving shaft to give the driving side a rotational force at all times with respect to the rotating shaft in a direction capable of supporting the wafer, and the movable chuck member and the wafer to release the wafer. And a driving means arranged adjacent to the operating means and configured to rotate the driving shaft in a direction opposite to the direction in which the driving shaft is rotated by the operating means. 제12항에 있어서, 상기 가동 척크부재는 상기 회전판 부재에 연하여 방사상으로 습동자재로 장착되고 상기 링크부재의 타단과 연계된 슬라이더 부재에 고정되고, 타 척크부재는 상기 회전판 부재에 고정되며, 또한 상기 슬라이더 부재와 동일한 무게의 발란서 부재는 상기 구동축의 회전축심에 대하여 상기 슬라이더 부재와 대칭으로 배설되고 상기 회전판 부재에 연하여 방사상으로 습동 자재로 장착하여 구성된 웨이퍼 지지기구.13. The movable chuck member according to claim 12, wherein the movable chuck member is attached to the rotary plate member in a radially sliding manner and is fixed to a slider member associated with the other end of the link member, and the other chuck member is fixed to the rotary plate member. And a balancer member having a weight equal to that of the slider member is disposed symmetrically with the slider member with respect to the axis of rotation of the drive shaft, and is attached to the rotating plate member and radially mounted with a sliding material. 제13항에 있어서, 상기 발란서 부재는 다른 링크부재의 일단에 연계되고 이 링크 부재의 타단은 상기 구동축의 상기 회전축심에 편심되게 사기 구동축의 상단부에 연결하여 구성된 웨이퍼 지지기구.The wafer support mechanism according to claim 13, wherein the balancer member is connected to one end of the other link member and the other end of the link member is connected to an upper end portion of the fraudulent drive shaft eccentrically with the rotation shaft center of the drive shaft. 제13항에 있어서, 상기 가동 척크부재는 상기 회전판 부재에 형성된 통공을 통하여 간격을 가지면서 수직 관통되어 상기 슬라이더 부재에 고정되고, 상기 발란서 부재는 상기 회전판 부재에 형성된 다른 통공을 통하여 간격을 가지면서 수직 관통된 핀을 구비하여서 구성된 웨이퍼 지지기구.The movable chuck member according to claim 13, wherein the movable chuck member is vertically penetrated while being spaced through a through hole formed in the rotating plate member, and fixed to the slider member, and the balance member has a gap through another hole formed in the rotating plate member. And a wafer support mechanism having vertically penetrated pins. 웨이퍼를 회전시키면서 웨이퍼의 표면처리를 시행하는 장치에 있어서, 상기 장치내에 처리실을 형성하는 하우징과, 상기 하우징 내부로 돌설된 상단부를 가진 중공체인 회전축과, 상기 회전축의 돌설된 상단부에 수평으로 장착된 회전판 부재와, 웨이퍼의 외주연부를 동시에 지지하기 위하여 상기 회전축의 회전축심에 대하여 대칭으로 배설되고, 그중 최소한 한개는 상기 회전판 부재에 연하여 방사상으로 습동자재로 설치된 척크부재와, 상기 회전축 내부에 삽설되고 상기 척크부재를 작동시키기 위하여 상기 회전축에 대하여 축상으로 승강 이동토록 설치된 구동축과, 상기 구동축의 상단부에 장착된 캠 부재와, 일단에 상기 캠 부재와 계합되는 캠플로워가 형성되고 타단은 상기 척크 부재에 고정되며, 상기 캠 부재가 연결된 상기 구동축이 상기 회전축에 대하여 축상으로의 이동에 상기 캠 플로워가 연동될시에 상기 척크부재와 함께 상기 회전판 부재에 연하여 수평으로 이동하도록 설치된 링크부재와, 상기 척크부재가 동시에 웨이퍼를 항지 지지할 수 있도록 상기 구동축을 상기 회전축에 대하여 일정상태로 유지시키는 유지수단과, 상기 구동축이 상기 회전축에 대하여 축상으로 이동될시 상기 링크부재를 통하여 상기 척크부재가 웨이퍼를 해지할 수 있도록 상기 구동축의 하단부에 설치된 구동 수단으로 구성된 웨이퍼 지지기구.An apparatus for performing a surface treatment of a wafer while rotating a wafer, the apparatus comprising: a housing for forming a processing chamber in the apparatus, a rotating shaft that is a hollow body having an upper end protruding into the housing, and a horizontally mounted upper end of the rotating shaft; A chuck member disposed symmetrically with respect to the rotary shaft center of the rotary shaft to support the rotary plate member and the outer periphery of the wafer at the same time, at least one of which is attached to the rotary plate member radially sliding material and inserted into the rotary shaft. And a driving shaft provided to move up and down axially with respect to the rotation shaft to operate the chuck member, a cam member mounted at an upper end of the driving shaft, a cam follower engaged with the cam member at one end thereof, and the other end of the chuck member. Fixed to the drive shaft to which the cam member is connected A link member provided to move horizontally to the rotating plate member together with the chuck member when the cam follower is axially moved relative to the front axis, and the drive shaft so that the chuck member can simultaneously support the wafer. Holding means for maintaining a constant state with respect to the rotating shaft, and driving means provided at the lower end of the driving shaft so that the chuck member can release the wafer through the link member when the driving shaft is moved axially with respect to the rotating shaft. Configured wafer support mechanism. 제16항에 있어서, 상기 유지수단은 상기 회전축과 상기 구동축의 하단부 사이에 상호 축상으로 인장력을 부여받도록 이들 사이에 연결된 스프링으로 구성된 웨이퍼 지지기구.17. The wafer support mechanism of claim 16, wherein the holding means is comprised of a spring connected therebetween so as to receive a tensile force mutually axially between the rotary shaft and the lower end of the drive shaft. 제16항에 있어서, 상기 구동수단은 상기 구동축과 상기 하단부에 하향으로 돌출된 핀으로 구성된 웨이퍼 지지기구.The wafer support mechanism according to claim 16, wherein the driving means comprises pins protruding downward from the driving shaft and the lower end portion. 제16항에 있어서, 상기 척크부재의 대향되는 2개는 상기 회전판 부재에 연하여 방사상으로 습동자재로 장착된 슬라이더부재에 설치하여 구성된 웨이퍼 지지기구.17. The wafer support mechanism according to claim 16, wherein two opposite sides of the chuck member are installed on a slider member radially mounted in contact with the rotating plate member. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870008806A 1986-08-13 1987-08-11 Wafer supporting apparatus KR920000673B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP190246 1986-08-13
JP19024686 1986-08-13
JP?61-190246 1986-08-13
JP285752 1986-11-29
JP61285752A JPS63153839A (en) 1986-08-13 1986-11-29 Rotary holding device for substrate
JP?61-285752 1986-11-29

Publications (2)

Publication Number Publication Date
KR880003411A true KR880003411A (en) 1988-05-17
KR920000673B1 KR920000673B1 (en) 1992-01-20

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KR100367665B1 (en) * 2000-07-24 2003-01-10 (주)케이.씨.텍 Apparatus for fixing wafer

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US6497241B1 (en) * 1999-12-23 2002-12-24 Lam Research Corporation Hollow core spindle and spin, rinse, and dry module including the same
EP1204139A4 (en) 2000-04-27 2010-04-28 Ebara Corp Rotation holding device and semiconductor substrate processing device
JP4514942B2 (en) * 2000-12-07 2010-07-28 株式会社アルバック Deposition equipment
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JP4468775B2 (en) 2004-09-14 2010-05-26 大日本スクリーン製造株式会社 Substrate holding and rotating device
KR100829923B1 (en) 2006-08-30 2008-05-16 세메스 주식회사 Spin head and method using the same for treating substrate
JP4819010B2 (en) * 2007-09-04 2011-11-16 東京エレクトロン株式会社 Processing apparatus, processing method, and storage medium
KR100873153B1 (en) * 2007-10-05 2008-12-10 세메스 주식회사 Spin head
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JP5460475B2 (en) * 2010-06-16 2014-04-02 東京エレクトロン株式会社 Substrate liquid processing equipment
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JP6181438B2 (en) * 2013-06-24 2017-08-16 株式会社荏原製作所 Substrate holding device and substrate cleaning device
JP6789048B2 (en) * 2016-09-23 2020-11-25 株式会社Ｓｃｒｅｅｎホールディングス Board processing equipment

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Publication number Priority date Publication date Assignee Title
KR100367665B1 (en) * 2000-07-24 2003-01-10 (주)케이.씨.텍 Apparatus for fixing wafer

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JPS63153839A (en) 1988-06-27
KR920000673B1 (en) 1992-01-20

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