KR870700411A - 반도체 웨이퍼 흐름 처리공정 및 그 장치 - Google Patents

반도체 웨이퍼 흐름 처리공정 및 그 장치

Info

Publication number
KR870700411A
KR870700411A KR870700149A KR870700149A KR870700411A KR 870700411 A KR870700411 A KR 870700411A KR 870700149 A KR870700149 A KR 870700149A KR 870700149 A KR870700149 A KR 870700149A KR 870700411 A KR870700411 A KR 870700411A
Authority
KR
South Korea
Prior art keywords
flow
vessels
treatment
fluid
wafers
Prior art date
Application number
KR870700149A
Other languages
English (en)
Other versions
KR890001502B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/747,894 external-priority patent/US4633893A/en
Priority claimed from US06/747,895 external-priority patent/US4738272A/en
Application filed filed Critical
Publication of KR870700411A publication Critical patent/KR870700411A/ko
Application granted granted Critical
Publication of KR890001502B1 publication Critical patent/KR890001502B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
    • B05B3/04—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B05C3/109—Passing liquids or other fluent materials into or through chambers containing stationary articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/002—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being a degassed liquid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019870700149A 1985-06-24 1985-11-20 반도체 웨이퍼 흐름 처리공정 및 그 장치 KR890001502B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US747,894 1985-06-24
US06/747,894 US4633893A (en) 1984-05-21 1985-06-24 Apparatus for treating semiconductor wafers
US06/747,895 US4738272A (en) 1984-05-21 1985-06-24 Vessel and system for treating wafers with fluids
PCT/US1985/002318 WO1987000094A1 (en) 1985-06-24 1985-11-20 Semiconductor wafer flow treatment

Publications (2)

Publication Number Publication Date
KR870700411A true KR870700411A (ko) 1987-12-29
KR890001502B1 KR890001502B1 (ko) 1989-05-06

Family

ID=27114840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870700149A KR890001502B1 (ko) 1985-06-24 1985-11-20 반도체 웨이퍼 흐름 처리공정 및 그 장치

Country Status (5)

Country Link
EP (1) EP0233184B1 (ko)
KR (1) KR890001502B1 (ko)
AT (1) ATE74294T1 (ko)
DE (1) DE3585797D1 (ko)
WO (1) WO1987000094A1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8601939A (nl) * 1986-07-28 1988-02-16 Philips Nv Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat.
DE68921757T2 (de) * 1989-11-23 1995-10-26 Cfm Technologies Inc Verfahren zum Trocknen von Oberflächen.
US5183512A (en) * 1991-08-29 1993-02-02 Aquotech, Inc. Method of cleaning semiconductor wafer and computer disks by purified water treated with electric AC signal
US6132522A (en) * 1996-07-19 2000-10-17 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using sequential chemical processing
KR20010032446A (ko) * 1997-12-10 2001-04-25 월터 알란 이. 전자 부품 제조를 위한 습식 공정 방법
CN1307545A (zh) 1998-06-02 2001-08-08 Cfmt公司 使用不同温度的液体通过湿法加工制造电子元件的方法
US6517636B1 (en) 1999-01-05 2003-02-11 Cfmt, Inc. Method for reducing particle contamination during the wet processing of semiconductor substrates
US6261845B1 (en) 1999-02-25 2001-07-17 Cfmt, Inc. Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates
WO2001068277A1 (en) 2000-03-13 2001-09-20 Cfmt, Inc. Processes and apparatus for treating electronic components
DE502008001992D1 (de) * 2008-02-08 2011-01-20 Rena Gmbh Substratträger
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1924997A1 (de) * 1969-05-16 1970-11-19 Siemens Ag Vorrichtung zum epitaktischen Abscheiden von Halbleitermaterial
DE2133876A1 (de) * 1971-07-07 1973-01-18 Siemens Ag Anordnung zum eindiffundieren von dotierstoffen
US4015615A (en) * 1975-06-13 1977-04-05 International Business Machines Corporation Fluid application system
US4235650A (en) * 1978-09-05 1980-11-25 General Electric Company Open tube aluminum diffusion
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids

Also Published As

Publication number Publication date
WO1987000094A1 (en) 1987-01-15
EP0233184A4 (en) 1989-01-12
EP0233184A1 (en) 1987-08-26
ATE74294T1 (de) 1992-04-15
EP0233184B1 (en) 1992-04-01
KR890001502B1 (ko) 1989-05-06
DE3585797D1 (de) 1992-05-07

Similar Documents

Publication Publication Date Title
KR870700411A (ko) 반도체 웨이퍼 흐름 처리공정 및 그 장치
DE69612973D1 (de) Verbesserung an der behandlung von proben
NO903423L (no) Appart for gjentatt automatisk utfoerelse av en termisk cyklus for behandling av proever.
ATE298659T1 (de) Vorrichtung und verfahren zum behandeln von artikeln wie ophthalmische linsen, kontaktlinsen oder medizinische vorrichtungen mit einer flüssigkeit
ATE222508T1 (de) Vorrichtung und verfahren zum bestrahlen von flüssigkeiten, insbesondere von körperflüssigkeiten
SE9404555L (sv) Förfarande och anordning för behandling av fluida samt användning av detta fluidum
IT8167830A0 (it) Dispositivo e procedimento per il trattamento centrifugo di fluidi in particolare sangue
GB2159328B (en) Vessel and apparatus for treating wafers with fluids
DE69120193D1 (de) Batchverfahren und Vorrichtung zur Behandlung von Halbleiterscheiben
BR8207993A (pt) Aparelho para a remocao ou para o alargamento de sitios estreitados em vasos conduzindo liquidos corporeos
NO155432C (no) Anordning og fremgangsmaate for behandling av partikkelformet material.
TR26291A (tr) Bir akici maddeyi muamele etmek icin cihaz
ATE234032T1 (de) Vorrichtung und verfahren zur behandlung von gegenständen in einer lösung mit brausetabletten
BR9505641A (pt) Processos para o tratamento biológico em multiplos estagios de um material influentes para sequenciar processamento em batelada de refugo liquido em um reator de pelo menos um estágio anearóbico e um aeróbico e para tratar mateirais fluidos e aparelho de tratamento de água de refugo e de gás
KR970003397A (ko) 기판처리장치
ATE67643T1 (de) Behandlung von knollenfruechten.
SE8306477L (sv) Reningsanordning av cyklontyp
ATE144757T1 (de) Reaktor für biologische behandlung von abwasser
JPS56148831A (en) Developing device for semiconductor wafer
US2737865A (en) Apparatus for simultaneously processing and washing photographic prints or negatives
JPS5764237A (en) Sensitive material processing device
JPS6481230A (en) Treatment device
JPS5777625A (en) Adsorbent for rheumatoid factor and apparatus for removing rheumatoid factor
DE3673124D1 (de) Verfahren und vorrichtung zum rueckspuelen eines festbett-ionenaustauschers.
IL96743A (en) Process and device for the treatment of electrophoresis carriers

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
J202 Request for trial for correction [limitation]
J121 Written withdrawal of request for trial
J202 Request for trial for correction [limitation]
FPAY Annual fee payment

Payment date: 20020427

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee