KR870010616A - 웨이퍼 취급 아암 - Google Patents

웨이퍼 취급 아암 Download PDF

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Publication number
KR870010616A
KR870010616A KR870003641A KR870003641A KR870010616A KR 870010616 A KR870010616 A KR 870010616A KR 870003641 A KR870003641 A KR 870003641A KR 870003641 A KR870003641 A KR 870003641A KR 870010616 A KR870010616 A KR 870010616A
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KR
South Korea
Prior art keywords
piece
central
distal
support piece
axis
Prior art date
Application number
KR870003641A
Other languages
English (en)
Inventor
에이취. 딕 폴
Original Assignee
스탠리 젯드. 코울
배리언 어소시에이츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 젯드. 코울, 배리언 어소시에이츠 인코포레이티드 filed Critical 스탠리 젯드. 코울
Publication of KR870010616A publication Critical patent/KR870010616A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Feeding Of Workpieces (AREA)
  • Manipulator (AREA)

Abstract

내용 없음

Description

웨이퍼 취급 아암
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 웨이퍼 처리 시스템의 부분 단면 정면도.
제2도는 제1도 선 2-2를 따라 취한 제1도 시스템의 부분 단면도.
제3도는 제2도의 선 3-3을 따라 취한 제1도 및 제2도 시스템을 통한 단면도.

Claims (4)

  1. 중심쪽 지지편과, 중심쪽 신장편과, 발단부상의 작업물을 지지하는 수단을 가진 말단쪽 지지편과, 말단쪽 신장편, 및 상기 아암에 동력을 전달하여 제어하기 위해 제1축에 관해 회전하는 한쌍의 동심축을 포함하며, 상기 중심쪽 지지편은 제1의 상기 동심축에 직각으로 고정 부착되고, 상기 중심쪽 신장편은 제2의 상기 동심축에 직각으로 고정부착되고, 상기 중심쪽 신장편은 제2축에서 상기 말단쪽 신장편에 피버트 가능하게 부착되고, 상기 중심쪽 지지편과 상기 말단쪽 신장편은 각각 제3 및 제4축에서 상기 말단쪽 지지편에 피버트 가능하게 부착되며, 상기 제1,제2,제3 및 제4축은 평행하고, 상기 축 사이의 공간은 평행사변형을 형성하는 것이 특징인 작업물 취급 아암.
  2. 제1항에 있어서.
    상기 말단쪽 지지 아암은 평 블레이드인 것이 특징인 작업물 취급 아암.
  3. 제2항에 있어서.
    상기 중심쪽 신장편은 상기 중심쪽 지지편 보다 짧은 것이 특징인 작업물 취급 아암.
  4. 제3항에 있어서.
    상기 동심축을 독립적으로 구동하는 2개의 구동 수단을 포함하는 것이 특징인 작업물 취급 아암.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870003641A 1986-04-17 1987-04-16 웨이퍼 취급 아암 KR870010616A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85327386A 1986-04-17 1986-04-17
US853273 1986-04-17

Publications (1)

Publication Number Publication Date
KR870010616A true KR870010616A (ko) 1987-11-30

Family

ID=25315569

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870003641A KR870010616A (ko) 1986-04-17 1987-04-16 웨이퍼 취급 아암

Country Status (3)

Country Link
EP (1) EP0242996A2 (ko)
JP (1) JPS62245645A (ko)
KR (1) KR870010616A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
US7056392B1 (en) * 2003-04-16 2006-06-06 Lsi Logic Corporation Wafer chucking apparatus and method for spin processor

Also Published As

Publication number Publication date
EP0242996A2 (en) 1987-10-28
JPS62245645A (ja) 1987-10-26

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