KR870007647A - 자동 납땜 장치 - Google Patents

자동 납땜 장치

Info

Publication number
KR870007647A
KR870007647A KR1019870000429A KR870000429A KR870007647A KR 870007647 A KR870007647 A KR 870007647A KR 1019870000429 A KR1019870000429 A KR 1019870000429A KR 870000429 A KR870000429 A KR 870000429A KR 870007647 A KR870007647 A KR 870007647A
Authority
KR
South Korea
Prior art keywords
soldering device
automatic soldering
automatic
soldering
Prior art date
Application number
KR1019870000429A
Other languages
English (en)
Other versions
KR910002997B1 (ko
Inventor
후토미 하야가와
가즈오 오노다
Original Assignee
가부시끼가이샤 하이-벡
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 하이-벡 filed Critical 가부시끼가이샤 하이-벡
Publication of KR870007647A publication Critical patent/KR870007647A/ko
Application granted granted Critical
Publication of KR910002997B1 publication Critical patent/KR910002997B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019870000429A 1986-01-20 1987-01-20 자동 납땜 장치 KR910002997B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61009628A JPH0677811B2 (ja) 1986-01-20 1986-01-20 自動半田付け装置
JP86-9628 1986-01-20

Publications (2)

Publication Number Publication Date
KR870007647A true KR870007647A (ko) 1987-08-20
KR910002997B1 KR910002997B1 (ko) 1991-05-11

Family

ID=11725518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870000429A KR910002997B1 (ko) 1986-01-20 1987-01-20 자동 납땜 장치

Country Status (4)

Country Link
US (1) US4788403A (ko)
EP (1) EP0231096B1 (ko)
JP (1) JPH0677811B2 (ko)
KR (1) KR910002997B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3869019D1 (de) * 1987-08-31 1992-04-16 Siemens Ag Verfahren zum einloeten von smd-bauteilen, die zeitweise an einem mittels vakuumleitung evakuierbaren loetkopf gehalten werden.
DE4016696A1 (de) * 1990-05-23 1991-11-28 Siemens Ag Vorrichtung und verfahren zum positionsgenauen loeten von loetteilen auf einen traeger
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US6073817A (en) * 1998-09-04 2000-06-13 Ford Motor Company Pneumatically-actuated throttle valve for molten solder dispenser
US6426486B1 (en) * 2000-06-16 2002-07-30 Judco Manufacturing, Incorporated Optical apparatus and method for shrinking heat shrink tubing, fusing wires and solder and unsolder packaged electronic components
JP2003249591A (ja) * 2002-02-26 2003-09-05 Nec Electronics Corp エリアｉｏ型半導体装置の配線基板の設計方法
DE10250541B9 (de) * 2002-10-29 2004-09-16 Infineon Technologies Ag Elektronisches Bauteil mit Unterfüllstoffen aus Thermoplasten und Verfahren zu dessen Herstellung
JP2005064206A (ja) * 2003-08-11 2005-03-10 Niigata Seimitsu Kk 半導体部品の半田付け方法および半導体部品の実装構造
US7498538B1 (en) 2007-07-20 2009-03-03 Judco Manufacturing, Inc. Sliding contact switch
US7880107B1 (en) 2007-10-12 2011-02-01 Judco Manufacturing, Inc. Momentary push button switch
DE112008003888B4 (de) * 2008-07-17 2014-11-20 Denki Kogyo Co. Ltd. Anordnung von Führungselementen für eine Hochfrequenzinduktionsspule
EP2842682B1 (en) * 2012-04-25 2017-06-28 Origin Electric Company, Limited Soldering apparatus and method for manufacturing soldered product
CN103658909B (zh) * 2013-11-28 2017-01-18 浩科自动化有限公司 Pcb同步插件锡焊机及其工作步骤

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3632955A (en) * 1967-08-31 1972-01-04 Western Electric Co Simultaneous multiple lead bonding
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
JPS51127657A (en) * 1975-04-28 1976-11-06 Seiko Instr & Electronics Ltd Standard signal generator
JPS5393146A (en) * 1977-01-27 1978-08-15 Mitsubishi Electric Corp Infrared soldering apparatus
CA1123920A (en) * 1978-08-24 1982-05-18 Kevin R. Daly Laser soldering apparatus
DE2841465B2 (de) * 1978-09-23 1980-08-21 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Vorrichtung zum Verschweißen von Kontaktfahnen mit Sonnenzellen
JPS5554266A (en) * 1978-10-13 1980-04-21 Nippon Sheet Glass Co Ltd Method and apparatus for soldering of feeding terminal to glass for heating
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation

Also Published As

Publication number Publication date
JPH0677811B2 (ja) 1994-10-05
EP0231096A2 (en) 1987-08-05
JPS62168671A (ja) 1987-07-24
KR910002997B1 (ko) 1991-05-11
US4788403A (en) 1988-11-29
EP0231096B1 (en) 1991-12-18
EP0231096A3 (en) 1988-03-23

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19940207

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee