DE3767344D1 - Automatische loetvorrichtung. - Google Patents

Automatische loetvorrichtung.

Info

Publication number
DE3767344D1
DE3767344D1 DE8787302224T DE3767344T DE3767344D1 DE 3767344 D1 DE3767344 D1 DE 3767344D1 DE 8787302224 T DE8787302224 T DE 8787302224T DE 3767344 T DE3767344 T DE 3767344T DE 3767344 D1 DE3767344 D1 DE 3767344D1
Authority
DE
Germany
Prior art keywords
soldering device
automatic soldering
automatic
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787302224T
Other languages
English (en)
Inventor
Seiji Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apollo Seiko Ltd
Original Assignee
Apollo Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61167869A external-priority patent/JPS6352762A/ja
Application filed by Apollo Seiko Ltd filed Critical Apollo Seiko Ltd
Application granted granted Critical
Publication of DE3767344D1 publication Critical patent/DE3767344D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8787302224T 1986-04-09 1987-03-16 Automatische loetvorrichtung. Expired - Fee Related DE3767344D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8022086 1986-04-09
JP61167869A JPS6352762A (ja) 1986-04-09 1986-07-18 整列端子部の半田付け方法及びその自動半田付け装置

Publications (1)

Publication Number Publication Date
DE3767344D1 true DE3767344D1 (de) 1991-02-21

Family

ID=26421266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787302224T Expired - Fee Related DE3767344D1 (de) 1986-04-09 1987-03-16 Automatische loetvorrichtung.

Country Status (3)

Country Link
US (1) US4805830A (de)
EP (1) EP0241154B1 (de)
DE (1) DE3767344D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2638669A1 (fr) * 1988-11-10 1990-05-11 Sree Robot permettant l'insertion et le soudage de composants electroniques sur une plaque support
EP0420050B1 (de) * 1989-09-29 1994-12-28 Siemens Nixdorf Informationssysteme Aktiengesellschaft Verfahren zum Auflöten von Bauelementen auf Leiterplatten
DE3939812C2 (de) * 1989-12-01 1993-11-11 Deutsche Aerospace Laserlötsystem für SMD-Elemente
US5262617A (en) * 1990-08-17 1993-11-16 Kabushiki Kaisha Tokyo Horaisha Cutting means for fabrics and the like utilizing a heated cutting means mounted on a movable carriage
US5065932A (en) * 1990-09-24 1991-11-19 International Business Machines Corporation Solder placement nozzle with inert cover gas and inert gas bleed
JPH04361871A (ja) * 1991-06-06 1992-12-15 Pioneer Electron Corp クリームハンダ塗布用ディスペンサー
US5902495A (en) * 1996-10-22 1999-05-11 International Business Machines Corporation Method and apparatus for establishing a solder bond to a solder ball grid array
US6045025A (en) * 1997-02-03 2000-04-04 Fuji Photo Film Co., Ltd. Method and apparatus for soldering and soldering land of a printed circuit board
US6095872A (en) * 1998-10-21 2000-08-01 Molex Incorporated Connector having terminals with improved soldier tails
JP3590319B2 (ja) * 2000-03-10 2004-11-17 株式会社ジャパンユニックス ガス噴射式はんだ付け方法及び装置
JP2002064117A (ja) * 2000-08-22 2002-02-28 Mitsubishi Electric Corp ワイヤボンディング方法、ワイヤボンディング装置および半導体装置
US6831252B1 (en) 2003-01-27 2004-12-14 Dennis M. Crookshanks Electric soldering iron
KR100846846B1 (ko) 2007-03-19 2008-07-17 한국단자공업 주식회사 인쇄회로기판용 자동 납땜장치
US7699208B2 (en) * 2007-11-30 2010-04-20 Nordson Corporation Soldering tip, soldering iron, and soldering system
US8222559B2 (en) * 2009-11-30 2012-07-17 Cheng Uei Precision Industry Co. Ltd. Automatic soldering machine
CN102412494B (zh) * 2010-09-21 2013-08-21 深圳市君灏精密工业有限公司 自动插针机
EP3962246A1 (de) * 2020-08-28 2022-03-02 Unitechnologies SA Lötverfahren und -vorrichtung
CN112157328B (zh) * 2020-08-31 2022-05-03 杭州野陆机电技术有限公司 一种电磁系统双头自动焊接装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD116014A1 (de) * 1975-01-14 1975-11-05
SU670399A1 (ru) * 1977-04-01 1979-06-30 Предприятие П/Я А-7438 Устройство дл пайки микросхем
JPS62165996A (ja) * 1986-01-17 1987-07-22 富士通株式会社 リフローボンディング装置

Also Published As

Publication number Publication date
EP0241154A2 (de) 1987-10-14
EP0241154A3 (en) 1988-03-23
EP0241154B1 (de) 1991-01-16
US4805830A (en) 1989-02-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee