KR870000401A - 연마용 조성물 및 연마방법 - Google Patents

연마용 조성물 및 연마방법 Download PDF

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Publication number
KR870000401A
KR870000401A KR1019860001446A KR860001446A KR870000401A KR 870000401 A KR870000401 A KR 870000401A KR 1019860001446 A KR1019860001446 A KR 1019860001446A KR 860001446 A KR860001446 A KR 860001446A KR 870000401 A KR870000401 A KR 870000401A
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KR
South Korea
Prior art keywords
polishing
product
polishing composition
abrasive
aluminum oxide
Prior art date
Application number
KR1019860001446A
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English (en)
Other versions
KR940000662B1 (ko
Inventor
히로히도 기다노
도시끼 오오와끼
다까시 바라
Original Assignee
후지미 겐마자이 고오교 가부시끼가이샤
고시야마 이사무
후지미 겐마자이 고오교 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지미 겐마자이 고오교 가부시끼가이샤, 고시야마 이사무, 후지미 겐마자이 고오교 가부시끼 가이샤 filed Critical 후지미 겐마자이 고오교 가부시끼가이샤
Publication of KR870000401A publication Critical patent/KR870000401A/ko
Application granted granted Critical
Publication of KR940000662B1 publication Critical patent/KR940000662B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Abstract

내용 없음

Description

연마용 조성물 및 연마방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 물과 산화알루미늄의 연마제와 황산니켈의 연마촉진제를 함유하는 중성 내지 약산성의 연마용 조성물.
  2. 제1항에 있어서, 연마촉진제의 함량이 1-20중량%이고 PH값이 7-5인 연마용 조성물.
  3. 제2항에 있어서 연마제의 함량이 2-30중량%이고 연마제의 입자크기가 0.7-4㎛이고 최대 입자 크기는 20㎛이하인 연마용 조성물.
  4. 제3항에 있어서, 연마제는 입상 보에마이트를 1,100-1,200℃에서 2-3시간 동안 하소하여 상대적으로 큰 입자를 작은입자로 분쇄하고 일정크기의 입자를 선별하여 만든 α산화알루미늄인 연마용 조성물.
  5. 제품의 표면과 제품표면에 접동가능한 연마패드의 표면사이에 연마조성물을 공급하는 연마방법에 있어서 연마조성물은 물과 산화알루미늄의 연마제와 황산니켈의 연마촉진제를 함유하고 중성 내지 약산인 연마방법.
  6. 제5항에 있어서 제품은 플라스틱제품인 연마방법.
  7. 제5항에 있어서 제품의 표면이 무전해 니켈도금층인 연마방법.
  8. 제5항에 있어서 제품의 표면이 알루마이트층인 연마방법.
  9. 제5항에 있어서 제품이 알루미늄제품인 연마방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860001446A 1985-06-04 1986-02-28 연마용 조성물 및 연마 방법 KR940000662B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60-121200 1985-06-04
JP60121200A JPS61278587A (ja) 1985-06-04 1985-06-04 研磨用組成物
JP121200 1985-06-04

Publications (2)

Publication Number Publication Date
KR870000401A true KR870000401A (ko) 1987-02-18
KR940000662B1 KR940000662B1 (ko) 1994-01-26

Family

ID=14805342

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860001446A KR940000662B1 (ko) 1985-06-04 1986-02-28 연마용 조성물 및 연마 방법

Country Status (5)

Country Link
US (1) US4696697A (ko)
EP (1) EP0204408B1 (ko)
JP (1) JPS61278587A (ko)
KR (1) KR940000662B1 (ko)
DE (1) DE3681504D1 (ko)

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JPH0197560A (ja) * 1987-10-09 1989-04-17 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物
JP2632889B2 (ja) * 1988-01-19 1997-07-23 株式会社フジミインコーポレーテッド 研磨用組成物
JP2632898B2 (ja) * 1988-02-09 1997-07-23 株式会社フジミインコーポレーテッド 研磨用組成物
US4956015A (en) * 1988-01-19 1990-09-11 Mitsubishi Kasei Corporation Polishing composition
JPH01257563A (ja) * 1988-04-08 1989-10-13 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物
JPH0214280A (ja) * 1988-07-01 1990-01-18 Showa Denko Kk プラスチック研磨用組成物
JPH0284485A (ja) * 1988-09-20 1990-03-26 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物
US4898598A (en) * 1988-10-27 1990-02-06 Superior Granite & Marble Restoration Compound and method for polishing stone
US4954142A (en) * 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5084071A (en) * 1989-03-07 1992-01-28 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US5104421B1 (en) * 1990-03-23 1993-11-16 Fujimi Abrasives Co.,Ltd. Polishing method of goods and abrasive pad therefor
US5114437A (en) * 1990-08-28 1992-05-19 Sumitomo Chemical Co., Ltd. Polishing composition for metallic material
JPH0781133B2 (ja) * 1992-05-06 1995-08-30 株式会社フジミインコーポレーテッド メモリーハードディスクの研磨用組成物
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
JP4141514B2 (ja) * 1996-11-26 2008-08-27 株式会社フジミインコーポレーテッド リンス用組成物
US6162268A (en) * 1999-05-03 2000-12-19 Praxair S. T. Technology, Inc. Polishing slurry
JP4273475B2 (ja) 1999-09-21 2009-06-03 株式会社フジミインコーポレーテッド 研磨用組成物
US6347978B1 (en) 1999-10-22 2002-02-19 Cabot Microelectronics Corporation Composition and method for polishing rigid disks
US6461958B1 (en) 2000-02-04 2002-10-08 Seagate Technology Llc Polishing memory disk substrates with reclaim slurry
US6261476B1 (en) * 2000-03-21 2001-07-17 Praxair S. T. Technology, Inc. Hybrid polishing slurry
US6383065B1 (en) 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US20050104048A1 (en) * 2003-11-13 2005-05-19 Thomas Terence M. Compositions and methods for polishing copper
US20100243670A1 (en) * 2009-03-24 2010-09-30 Ferro Corporation Methods and products for replenishing a polishing slurry in a polishing apparatus
CN111656283B (zh) * 2019-01-03 2021-09-14 京东方科技集团股份有限公司 模板制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972786A (en) * 1974-06-28 1976-08-03 Ampex Corporation Mechanically enhanced magnetic memory
JPS533518A (en) * 1976-06-30 1978-01-13 Tadatoshi Moriguchi Manufacturing method of insecticide mainly using seaweed
JPS5489389A (en) * 1977-12-27 1979-07-16 Fujimi Kenmazai Kougiyou Kk Composition for polishing of moldings in synthetic resin
US4383857A (en) * 1980-05-28 1983-05-17 The United States Of America As Represented By The United States Department Of Energy Attack polish for nickel-base alloys and stainless steels
JPS58113285A (ja) * 1981-12-28 1983-07-06 Showa Denko Kk レジノイド砥石用アルミナ砥粒
JPS58198581A (ja) * 1982-05-14 1983-11-18 Matsushita Electric Ind Co Ltd 研摩用組成物およびその製造方法
US4475981A (en) * 1983-10-28 1984-10-09 Ampex Corporation Metal polishing composition and process

Also Published As

Publication number Publication date
EP0204408A3 (en) 1988-04-27
EP0204408A2 (en) 1986-12-10
JPS64436B2 (ko) 1989-01-06
EP0204408B1 (en) 1991-09-18
US4696697A (en) 1987-09-29
KR940000662B1 (ko) 1994-01-26
JPS61278587A (ja) 1986-12-09
DE3681504D1 (de) 1991-10-24

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