KR860001466B1 - Method for removing flashes from mold resin product - Google Patents

Abstract

Plastic polishing pellets having multiple knife-type edges and cracks used to remove flashes from the palstic molding product are produced from thermosetting resin, e.g., urea resin, melamine, unsaturaed polyester, alkyd resin, or epoxy resin, by blending or coating the non-ionic surfactant which does not contain halogen, ammonia, phosphorus, sulfur, or metallic ion compd. The pellets have the shapes of a flat-plate, needle, or block.

Description

Abrasive and its manufacturing method

1 is a cross-sectional view showing an embodiment for generating a crack in the synthetic resin solid body in the present invention.

2 is a plan view showing the shape of the abrasive grains of the present invention and the occurrence of cracks;

3 is a plan view of a molded article of a semiconductor device having a moldflash.

4 is a schematic view of a wet blast device used for removing resin flash of a mold of a semiconductor device.

5 is a cross-sectional view for explaining the resin flash removal by the abrasive.

FIG. 6 is a graph showing comparison of flash removal property between Examples and Comparative Examples of the present invention. FIG.

7A, 7B and 7C are exemplary views of various shapes of the abrasive having cracks.

8 is a graph showing the relationship between various types of abrasives and abrasive properties.

9 is a graph showing the relationship between various types of abrasives and abrasive properties.

9 is a graph showing comparison of flash removal ability between an embodiment of the present invention and a comparative example.

TECHNICAL FIELD The present invention relates to abrasives and, in particular, to synthetic resin abrasives suitable for flash removal of plastic molded articles. In the molded article obtained through the resin encapsulation process of a semiconductor device such as IC or LSI, a lot of pull lash sometimes occurs. For example, after inserting a lead frame in which a semiconductor element is mounted, into a mold, a epoxy resin is injected into the mold, and a semiconductor element (not shown) is placed on the lead frame 9 as shown in FIG. The semiconductor mold product 11 encapsulated with the resin layer 10 is obtained. However, at the time of molding out of the mold product, between the lead frame 9 and the lead frame 9 near the resin layer 10. The resin flash 12 is generated. Therefore, the removal process of the resin flash 9 is required as post-processing after molding.

Therefore, in the related art, hard abrasives such as alumina, silicon carbide, glass beads, or soft abrasives, such as arc arcs, are used for the resin flash 12... Of the lead frame 9. Spraying the resin on the resin flash 12. Was removed by destruction.

However, when a hard abrasive is used, its hardness is more than H _R C 70, whereas the hardness of epoxy resins for general semiconductor devices is around H _R M 100 so that the abrasive is significantly harder and specific gravity than epoxy resin. Since it is four times larger, the resin flash 12... In this case, there is a problem in that the surface of the molded molded article 11 is damaged to damage the back tube and moisture penetrates into the wound portion of the molded molded article 11 to adversely affect the reliability of the semiconductor device.

On the other hand, when vegetable soft abrasives such as arc flour and apricot flour are used, they are highly elastic and viscous in a dry state, and only the edges of these abrasives are rounded and the polishing force decreases in a short time. Due to the weak polishing force, it takes longer than the case of using a hard abrasive material. In order to process between single yarns, it is necessary to apply pressure spraying at high pressure. As a result, not only there is a risk of bending the lead frame 9, but also a disadvantage that the production cost is expensive, and since the soft abrasive is generally a dielectric, when the abrasive is used, the abrasive and the molded article 11 come into contact with each other. Therefore, since static electricity is generated and the crushed powder of the abrasive is firmly adhered to the surface of the mold-molded product 11 by the static electricity, in the following lead coating or plating process, a portion without lead or plating is formed, resulting in a poor appearance. This causes the corrosion of the id frame 9.

Accordingly, it is an object of the present invention to efficiently remove resin flashes without causing damage to these molded articles and without generating static electricity in the removal of resin flashes generated during molding of semiconductor molded products and other synthetic resin molded articles. It is another object of the present invention to provide an abrasive and a method for producing the abrasive which can exert an excellent abrasive force for a long time in the spray processing on the workpiece.

That is, the present invention provides an abrasive characterized in that it has a plurality of doll edges and at the same time becomes a synthetic resin solid having a crack that is easily cracked by cracking with the workpiece.

In addition, the present invention is a method for producing a synthetic resin abrasive obtained by molding a synthetic resin material and then granulating the resin, wherein in the forming step or granulation step, a crack which is easily split and cracked by a collision with a workpiece is eliminated. It is to provide a method for producing a synthetic resin abrasive, characterized in that the generation.

In the present invention, the synthetic resin solids constituting the abrasive have a plurality of cracks irregularly formed, for example, in the case of use of spraying or the like, the cracks are separated by the cracks due to collisions with the workpieces, and a new sharp blade ( adge) is formed. (Spontaneous stimulus action (自 生發 刃 作用))

In this way, since the impact on the resin flash is always sharp, the removal of the resin flash becomes efficient and its duration is long.

On the other hand, in the present invention, the "crack which is easily split and cracked by the collision with the workpiece" is a step of deliberately generating the inside and the outside during the molding of the synthetic resin and / or the granulation process, as is clear from the following description. By cracking or cracking, a number of cracks are generated by adding a process of intentionally generating cracks by physical, thermal or chemical action.

Therefore, it is to be understood that the synthetic resin molding is merely atomized by a crusher or the like to distinguish it from fine or small amount of cracks that may be formed at that time. This is because these cracks do not have enough functions to propagate the blades consumed by the collision with the workpiece and to determine the performance thereof.

Preferred synthetic resins in the present invention are those having relatively high hardness and low ductility. Examples of such synthetic resins include cured products of thermosetting resins such as epoxy resins, urea resins, polyether resins, and melamine resins, or polystyrenes, polycarbonates, and polyacrylates. The relatively hard thermoplastic resin can be used. In particular, thermosetting resins are suitable for resin flash removal because they are hard and easy to make particles having sharp edges in polygons.

On the other hand, when using the resin flash removal of the semiconductor mold, the molded article deunga equal to the hardness of the resin to be sealed, or for example, will close to the hardness of H _R M 80-120 with respect to the epoxy resin mold product before the hardness H _R M 100 after Unsaturated polyester resin and alkyd resin which have is suitable. The particle size of the synthetic resin granules can be freely selected according to the use of the abrasive, but, for example, when used to remove the resin flash of the molded article, the particle size (1/2 of the sum of the maximum and minimum diameters of one particle) is 0.05. It is desirable to have peaks and average values within the range of -2.0 mm.

Moreover, the shape of this granular material is arbitrary, such as spherical shape, acicular shape, flat shape, and polygonal shape, Comprising: The synthetic resin solids from which these shapes differ are comprised, and an abrasive | polishing material is comprised. The mixed abrasive may be effective for removing the flash.

It is preferable that such synthetic resin solids have a plurality of pickled blades for the purpose of grinding the workpiece or removing the resin flash by dry or wet spraying.

In addition, what is necessary is just to determine the average particle diameter and shape of an abrasive material suitably in consideration of the grade of processing required for the characteristic of a workpiece, and the like.

The synthetic resin abrasive of the present invention may be maintained by mixing a surfactant with the abrasive particle surface or inside. When the surfactant causes cracks in the resin flash, etc., due to the impact of granular resin particles, when the abrasive is used in the wet blast method, water penetrates into the gap between the resin flash and the lead frame through the crack. At the same time, it serves to prevent the charging of the processed product caused by the collision of synthetic resin granules. As such surfactant, all can be used irrespective of cationic, anionic, nonionic, and amphoteric. However, when used to remove the resin flash of a semiconductor mold molded article, it is preferable to use a nonionic surfactant which does not contain metal ions, halogen components, ammonia components, phosphorus components, sulfur components and the like which adversely affect the semiconductor elements. Examples of the nonionic surfactants include polyoxy ethylene alkyl ethers, polyoxy ethylene alkyl esters, polyoxyethylene alkyl phenol ethers, sorbitan alkyl esters, and polyoxy ethylene sorbitan alkyl esters.

The ratio of adhesion of the surfactant to the synthetic resin granular material varies depending on the use and the kind of the surfactant, but it is generally preferable to adhere the surfactant in the range of 0.001-1% by weight. In the case where the surfactant is mixed in the synthetic resin particles, the surfactant is mixed so that the surface of the synthetic resin particles can be properly leached.

In the present invention, a method of generating cracks in the synthetic resin constituting the abrasive can be performed in the molding or granulating step of the synthetic resin material as follows.

When using a thermosetting resin as a synthetic resin material

(A) The method of generating an internal at the time of shaping | molding.

Yes:

(1) A method in which a thermosetting resin is preliminarily powdered (e.g., a particle size of 0.01-2 mm) as a nucleus to be powdered in a synthetic resin material and molded around the nucleus body by shrinkage during molding.

(2) The synthetic resin material is cut by heat or by the addition of a catalyst, and coarsely crushed by external force during curing, and many cracks are generated due to the fragility of the molded product having insufficient curing during the coarse grinding. How to use the thing.

(3) A method in which a synthetic resin material is cured at a higher temperature than usual, and internally and externally generated by this rapid curing reaction to generate a myriad of cracks.

(B) A method of forming a synthetic resin material, and then immersing in a suitable agent such as acetone, methanol, or immersed in water to break to generate cracks in the molding.

(C) A method of forcibly producing granules by pressurizing the granulated material by pressing with a plurality of pickled tools.

(D) A method of granulating the synthetic resin material after granulation at a low temperature, for example, 10 ° C. or lower, more preferably -20 ° C. or lower, and brittle.

(E) A method in which a synthetic resin material is granulated after molding, and then heated to a high temperature (eg 15 ° C. or more) and atomized in a state of reduced strength to generate cracks.

(F) A method of generating cracks by applying thermal shock to a synthetic resin molded product by quenching or quenching.

(G) A method of generating cracks by combining two or more of the methods (A)-(F).

When using thermoplastic resin as synthetic resin material

The method of said (A) (1), (B), (C), (D), (F), or the method of arbitrarily combining them, and generating a crack.

In the present invention, for pulverizing the synthetic resin material, for example, the pulverized synthetic resin material is pulverized by various crushers, for example, crusher, crushing crusher, roller crusher, disc crusher, cone crusher, hammer mill, edge runner, ball mill or tube mill Can be used.

The abrasive of the present invention becomes a synthetic resin solid having a crack that is easily cracked by external force, so that when it is sprayed by a dry or wet blasting method, it is possible to grind or remove the workpiece by the collision force of the abrasive. At the same time, due to the impact force during the spraying process, the cracks are easily broken along the cracks, causing a new sharp blade to be formed to maintain the grinding or flash removal performance of the workpiece even in long-term use.

On the other hand, the abrasive of the present invention is not limited to the removal of the resin flash of the semiconductor mold product, but can also be applied to the resin flash agent of a general mold product or to the surface treatment of soft metal.

Hereinafter, the present invention will be described in detail with reference to Examples. (% Based on weight)

Example 1

First, 2% of MEKPO (55% methyl ether ketone peroxide) was added to unsaturated polyester material, Esta R253A-1 (trade name: manufactured by Mitsui Tooatsu Kagu Kaisha Co., Ltd.), and Rossa × W × H 3000mm × 300mm × Mold in 20mm mold.

The unsaturated polyester resin cured product block thus obtained was cut and then pulverized by crusher, hammer, etc., and then the pulverized powder was pulverized using a ball mill, roller mill or impact pulverizer and the like, and the average diameter was around 0.7 mm. An unsaturated polyester resin solid having a pickling blade of was prepared. Next, as shown in FIG. 1, the crushed particles 3 of the material (e. And a plurality of blades prepared by the above method between the upper and lower types 1 and 2, by preparing a compressor having a structure held specifically for the fixing layer 4a, 4b. Polyester resin solid body (6) having ... The crushed particles (3) ... by pressing in the upper and lower types 1,2 3D, which comes into contact with the microstructure, is further re-solidified and cracks 8a, which are easily broken apart by external force as shown in FIG. An abrasive 8 having an average particle diameter of about 0.3 mm was obtained. In this way, an abrasive 8 having a large number of cracks 8a and blades 8b as shown in FIG. 2 was obtained.

Next, a method of removing the resin flash of the semiconductor mold-molded product shown in FIG. 3 by the abrasive using the wet blast device shown in FIG. 4 will be described.

After inserting a lead frame in which a semiconductor element is mounted in advance into a molding die, an epoxy resin is injected into the mold and a semiconductor element (not shown) on the lead frame 9 is removed from the resin layer 10 as shown in FIG. The sealed semiconductor mold molded article 11 was molded.

To this molded product (11). The resin flash 12... Between the lead frame 9 near the resin layer 10 and the lead of the lead frame 9 at the time of mold molding. Occurred.

Subsequently, the abrasive 8 is formed in the groover 14 provided in the pressure chamber 13 shown in FIG. And water 15 were added at a ratio of 1: 3, and then the first pump 16 was operated to obtain the abrasive 8. Is sucked like water 15, and it is stirred by forcibly feeding it to the bottom of the hopper 14, and the abrasive material 8... Was uniformly dispersed to prepare a slurry.

Subsequently, the second pump 17 is operated to suck up the slurry and introduce it into the injector 18, which is then dispersed and accelerated by compressed air in the air introduction pipe 19 to produce a three-phase high speed jet of water, abrasives and air. 20) was sprayed toward the above-mentioned semiconductor mold molded article (not shown) conveyed into the processing chamber 13. In this way, when the jet stream is injected into the molded article, the plurality of blades 8... Abrasive 8 collides with the resin flash 12 attached on the lead frame 9 of the molded article 11 and between the leads of the lead frame 9. The resin flash 12 is made of a thermosetting epoxy resin, and cracks in the resin flash 912 due to the concentrated (local) impact force caused by the blade 8b of the relatively weak abrasive 8 and the vibration accompanying the impact force. (21) is generated, and acts to float against the crack (9) generated in the resin flash (12). Again many days (5)… Since the abrasive 8 having an impact collides with the crack of the resin flash 12 several times, the resin flash 12 is completely removed by synergy with the floating action of the resin flash 21 due to the invading water.

In addition, the abrasive 8 has irregular cracks 7... Because of this, the chip is broken along the crack 8a of the abrasive 8 due to the collision with the semiconductor mold molded article 11, and the rounded blade falls off to form a new sharp blade. As a result, the removal performance of the resin flash 12 of the semiconductor mold molded article 11 can be maintained even in long-term use.

Therefore, by using the abrasive 8 of the present invention, for example, by spraying the semiconductor mold molded article 11, the resin flash 12 of the molded article 11 can be effectively removed, and the abrasive ( 8) crack 8a... The sharp edges generated by cracking and falling off can be completely removed without remaining parts acting on the resin flash 12 attached to the minute parts of the molded part 11 (for example, between the leads of the lead frame 9). have.

It was confirmed by the test indicated below that the abrasive of Example 1 had excellent flash deodorization performance. In this test, a comparative example is described together.

[Comparative Example]

MEKPO is added to unsaturated polyester material ester R235A-1 by 2%, and the mold is cast in a mold of length x width x height = 300 mm x 300 mm x 20 mm. The synthetic resin block thus obtained was coarsely crushed with a crusher, and then a solid resin solid having an average particle diameter of about 0.3 mm was obtained using an impact crusher.

Using the cracked abrasive of Example 1 and the abrasive of the said comparative example, the resin flash of the semiconductor device was removed and the flash removal performance was investigated, and it obtained as shown in FIG. Here, the test condition is that the semiconductor device is flash-deleted by a wet blasting device for 24 hours continuously, and then 10,000 flashes are removed. The percentage of the workpieces removed is expressed as a fraction of 100 as flash-removability. As is clear from FIG. 6, the abrasive of Example 1 has a flash removal property of about 100%, whereas the abrasive of the comparative example has a low flash removal property of about 80%. Thus, the abrasive of the present invention has excellent flash removal property. This was confirmed.

On the other hand, the spraying process using the abrasive of the present embodiment is not limited to the case where the resin flash of the semiconductor mold molded article is removed as described above, but is also applied to the resin flash agent of the general molded molded article or the surface contour of the soft metal. .

Example 2

It is common sense to add 2% MEKPO to the ester-R235A-1 and to form a thickness of 5 mm or less in order to remove the internal reaction heat of a conventional molding, but in order to use the reaction heat at the time of curing, the length × width × height = 300 mm × 300 mm × The mold is molded into a 200 mm mold and cured to obtain a block. At this time, the temperature in the center of the block is 250 ℃ or more, the inner outer grain occurs, anhydrous cracks occur. In this way, the blocks in which the cracks were formed were coarsely crushed with a crusher, and then, using an impact crusher, a large number of cracked abrasives having a particle diameter of about 0.3 mm were obtained. In the abrasive in this example, the flash removeability was remarkably improved as in Example 1.

Example 3

20 parts of the pulverized product having a particle diameter of 1 mm or less obtained in Example 2 were mixed as 100 parts of the above ester-R235A-1, followed by adding 2 parts of MEKPO, followed by molding in a mold of length × width × height × 300 mm × 300 mm × 200 mm. Get a block. Then, by heating rapidly to impart thermal shock to induce the inside of the block and generate anhydrous cracks, and in the same manner as in Example 2, a plurality of cracked abrasives having an average particle diameter of about 0.3 mm were obtained. Got it. The abrasive material in this example also improved remarkably as in Example 1.

Example 4

After adding MEKPO to 0.3% of ester-R235A-1, casting it to the mold of the same dimension as Example 1, and reacting near 5 degreeC, it gelatinizes and immediately adds an impact shock, and produces a crack in a block. Thereafter, a sufficiently hardened block was obtained in the same manner as in Example 2 to obtain an abrasive having a large number of cracks of around 0.3 mm in average particle diameter. The abrasive material in this example was also improved in flash removal property as in Example 1.

Example 5

When molding as in Example 4, the temperature of the synthetic resin was set to 100-150 ° C. to harden inside and outside of the block to generate cracks, and in the same manner as in Example 2, the average particle diameter was about 0.3 mm. An abrasive with cracks was obtained. The abrasive removal in this example also improved remarkably as in Example 1.

Example 6

The same resin as in Example 1, and the block cured by casting to the same size mold under the same catalyst conditions is heated to 150-200 ℃ and then quenched below -10 ℃, or 100-200 ℃ at a temperature below -10 ℃ After the cracks were generated in the block by heating the metal to a temperature of, the abrasive having a large number of cracks having an average particle diameter of about 0.3 mm was obtained in the same manner as in Example 2. The abrasive removal in this example also improved remarkably as in Example 1.

Example 7

After the same resin as in Example 1, the same mold was cast and cured in the same dimensions of the mold, and coarsely pulverized in the same manner as in Example 2, and the coarsely pulverized synthetic resin particles were immersed in the acetone solution for 1 week. The chemical liquid was removed, finely pulverized, and an abrasive having a large number of cracks having an average particle diameter of about 0.3 mm was obtained. The abrasive removal in this example also improved remarkably as in Example 1.

Example 8

The same resin as in Example 1, and the block cured by molding in the mold of the same dimension under the same catalyst conditions in the same manner as in Example 2 and the coarse-pulverized synthetic resin particles were cooled to -20 ℃ and the same method as in Example 2 The grinding | pulverization material which grind | pulverized and had many cracks whose average particle diameter was about 0.3 mm was obtained. In this example, the abrasive was also remarkably improved in the same manner as in Example 1.

Example 9

The coarsely pulverized synthetic resin particles in the same manner as in Example 2 were heated to 170 ° C., and then pulverized in the same manner as in Example 2 at this temperature to obtain an abrasive having a large number of cracks with an average particle diameter of about 0.3 mm. In this example, the abrasive was also remarkably improved in the same manner as in Example 1.

Example 10

First, 0.1% by weight of polyoxyethylene nonyl ether (non-ionic surfactant) was added to the unsaturated polyester resin solution, and the mixture was uniformly mixed. Then, 2% of the curing agent MEKPO (55%) was added as in Example 1, and 300 mm × 300 mm. It casted and hardened | cured to the mold of * 20mm.

This cured product was hardness H _R M 100. Subsequently, this hardened | cured material was coarsely pulverized with a crusher etc., and the fine granules were pulverized using an impact grinder etc., and classified, and the granular material of the average resin diameter 0.7mm was obtained.

Subsequently, an abrasive having an average particle diameter of about 0.3 mm having a large number of cracks that were easily cracked and cracked by pressing down the granular material by using a compressor as described in Example 1 was obtained.

Next, the abrasive of the present embodiment including the surfactant and the abrasive of Example 1 without the surfactant were used. The apparatus of Example 1 was used to apply 10,000 resin flashes to the resin flash under the same conditions of injection pressure, injection flow rate and injection time. The test pieces were deflashed and the treatment time for all 10,000 specimens until the resin flash was completely removed was compared. As a result, the side of the abrasive containing the surfactant was able to shorten the processing time by 20%.

It was confirmed that the cleaning action by the surfactant was activated, making it difficult to attach the flash or polishing pieces to the test piece and the tool used for removing the flash, so that the flash or polishing pieces could be easily removed in the cleaning process in the post process. In the case of dry blasting, it was confirmed that it was helpful for antistatic.

In the abrasive according to the present embodiment, surfactants are attached and mixed on the surface and inside of the resin granular material, and even though the abrasive is used in a slurry state like water for a long time, the surfactant gradually dissolves in water and is maintained at a predetermined surfactant concentration. It was confirmed that the diffusion of the surfactant was unnecessary, and as a result, the flash removal performance could be always kept stable. On the other hand, when cracks existed, it was confirmed that the surfactant is easily leached from the inside.

Example 11

Many cracked abrasives obtained in Example 3 were immersed several times in an aqueous solution of about 1% by weight of sorbitan alkylesters and then dried to obtain an abrasive coated with a surfactant.

The same experiment as in Example 10 was carried out using the obtained abrasive and the abrasive obtained in Example 3. As a result, the same results as in Example 10 were obtained.

Example 12

A plurality of cracked coarse particles obtained in Example 2 were pulverized using a coarse mill, agitator, disc mill, cone mill, bottom hammer, edge runner centrifugal mill or the like or flattened, bulky or In order to make it easy to form into a needle shape, the molded article of synthetic resin material is made thinner, slightly thicker, or roughly, and then pulverized. An average particle diameter of about 1 mm).

On the other hand, for comparison, abrasives having cracks 8a having flat cracks, blocks, or needles 7a, 7b, and 7c having the same average particle diameter as shown in FIGS. A mixture of abrasives was also prepared.

Each of these four kinds of abrasives was applied to flash removal processing of a semiconductor mold product in the same manner as in Example 1. The results are shown in FIG. Flash elimination is the removal of 10,000 flashes after the semiconductor device has been flash-processed by a wet blast device for 12 consecutive hours. The ratio is expressed in 100 fractions as the flash removing ability. It turned out that flash removal property was favorable in this order, only a mixture, a block, only a flat, and only a bed.

Example 13

In the same manner as in Example 1, except that polystyrene, polyacrylate, and hard polyvinyl chloride were used instead of the cured block of unsaturated polyester resin in Example 1, cracked fine particles were made, and in the same manner as in Example 1, the semiconductor was Flash removal of the device mold was made possible.

The result was the same flash deodorization as in Example 1.

On the other hand, for comparison, the average particle diameter of these thermoplastic resins was 0.2-1.6 mm spherical or circumferential, and the flash removal processing was carried out as in Example 1. The results are shown in FIG. Flash removal was sampled and expressed as a percentage as in Example 1.

Claims (27)

An abrasive made of a synthetic resin solid having a plurality of doll blades and having cracks that are easily cracked and broken by collision with the workpiece. The abrasive according to claim 1, wherein the surfactant is held in this synthetic resin solid. The abrasive according to claim 2, wherein the surfactant is mixed in the surface and the inside of the synthetic resin solid. The abrasive according to claim 2, wherein the surfactant adheres only to the surface of the synthetic resin solid. The abrasive according to claim 2, wherein the surfactant is a nonionic surfactant. The abrasive according to claim 5, wherein the nonionic surfactant contains no halogen, ammonia, phosphorus, sulfur, or metal ion. The abrasive according to claim 1, wherein the synthetic resin solid content contains 1% by weight or less of surfactant therein. The abrasive according to claim 7, wherein the surfactant is a nonionic surfactant. The abrasive according to claim 8, wherein the nonionic surfactant contains no halogen, ammonia, phosphorus, sulfur, or metal ion. The abrasive according to claim 1, wherein the synthetic resin solid is a thermosetting resin. The abrasive according to claim 10, wherein the thermosetting resin is selected from cured products of urea resins, melamine resins, unsaturated polyester resins, alkyd resins, and epoxy resins. The abrasive according to claim 1, wherein the synthetic resin solid is at least one type selected from flat, needle and block yarns. The abrasive according to claim 1, wherein the synthetic resin solid particle diameter (1/2 of the sum of the maximum and minimum diameters of the solid) has a peak value and an average value in the range of 0.05 to 2,0 mm. A method for producing a synthetic resin abrasive comprising molding a synthetic resin material and then granulating the synthetic resin material, wherein in the forming step or granulation step, cracks are easily cracked due to collision with the workpiece. Manufacturing method. The method according to claim 14, wherein the inside and outside are generated during molding of the synthetic resin material. The production method according to claim 15, wherein the thermosetting resin is preliminarily powdered and dispersed in a synthetic resin material to form a nucleus to generate internal and external conditions. The method according to claim 15, wherein the synthetic resin material is gelled by heating or by the addition of a catalyst to generate right during curing. The production method according to claim 15, wherein the synthetic resin material is cured at a higher temperature than usual to generate an interior by the rapid curing reaction. The production method according to claim 15, wherein the synthetic resin material is immersed in a solvent or in boiling water after molding, and then pulverized it. A method for producing fine granulated particles according to claim 14, wherein the granulated synthetic resin particles are pressurized by a processing tool having a plurality of pickles. The manufacturing method of Claim 14 which refine | miniaturizes the granulated synthetic resin particle at the temperature of 10 degrees C or less. The production method according to claim 14, wherein the granulated synthetic resin particles are brought into a state of reduced strength at a high temperature, and the fine particles are granulated. The manufacturing method according to claim 14, wherein the molded resin material is subjected to thermal granulation after applying a thermal shock by quenching or quenching. The manufacturing method of Claim 14 which mixes surfactant previously with a synthetic resin raw material. The method according to claim 14, wherein the surface of the synthetic resin material is solidified and then the surface of the surface is coated with a surfactant. 26. The method of claim 25, wherein the coating is by dipping the synthetic resin granules into a surfactant solution. The method according to claim 25, wherein the surfactant is coated after the crack is generated in the synthetic resin solid.

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