JPS6121982B2 - - Google Patents
Info
- Publication number
- JPS6121982B2 JPS6121982B2 JP10275883A JP10275883A JPS6121982B2 JP S6121982 B2 JPS6121982 B2 JP S6121982B2 JP 10275883 A JP10275883 A JP 10275883A JP 10275883 A JP10275883 A JP 10275883A JP S6121982 B2 JPS6121982 B2 JP S6121982B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive material
- resin
- synthetic resin
- glass beads
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003082 abrasive agent Substances 0.000 claims description 61
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 229920003002 synthetic resin Polymers 0.000 claims description 31
- 239000000057 synthetic resin Substances 0.000 claims description 31
- 239000011324 bead Substances 0.000 claims description 25
- 239000011521 glass Substances 0.000 claims description 25
- 239000002245 particle Substances 0.000 claims description 20
- 239000008187 granular material Substances 0.000 claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000005498 polishing Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyoxyethylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003211 malignant effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は研磨材に関し、特に合成樹脂のバリ除
去に適した研磨材に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an abrasive material, and particularly to an abrasive material suitable for removing burrs from synthetic resins.
例えば、ICやLSIなどの半導体装置の製造工程
において、半導体素子がマウントされたリードフ
レームを成形用金型内に収納した後、この金型内
にエポキシ樹脂を注入して第１図に示すようにリ
ードフレーム１上の半導体素子（図示せず）が樹
脂層２で封止された半導体モールド成形品３を形
成している。しかしながら、かかるモールド成形
時においては樹脂層２付近のリードフレーム１上
及びリードフレーム１のリード間に樹脂バリ４…
が発生するため、成形後の後加工として樹脂バリ
４…の除去工程を必要とする。このようなことか
ら、従来においてはアルミナ、炭化珪素、ガラス
ビーズ等の硬化研磨材、又はクルミ殻等の軟質研
磨材を前記リードフレーム１の樹脂バリ４…に高
速噴射し、この樹脂バリ４…を破壊して除去して
いる。しかしながら、硬質研磨材を用いた場合、
その硬度はＨRC70以上であるのに対しエポキシ
樹脂の硬度はＨRM100前後であり、研磨材の方が
エポキシ樹脂に比べてはるかに硬く、かつ比重も
４倍以上と大きいため、樹脂バリ４…の除去に際
し、モールド成形品３の表面に傷を付けて外観を
損ねると共に、モールド成形品３の傷部から有害
なイオンを含有する水分が浸透し、半導体素子の
信頼性に悪影響を及ぼすという問題があつた。他
方、軟質研磨材を用いた場合、研磨力が弱いた
め、硬質研磨材を用いる場合よりも高圧で加圧噴
射する必要がある。その結果、リードフレーム１
の曲げを生じる虞があるばかりか、ランニングコ
ストの高騰化を招く欠点があつた。また軟質研磨
材を用いた場合、この研磨材とモールド成形品３
とが接触することにより静電気が発生し、この静
電気により研磨材の破砕粉がモールド成形品３表
面に強固に付着するため、はんだのぬれ性が低下
し、後工程での半田コートやめつきにおいて外観
不良を招いたりリードフレーム１の腐食の発生原
因となる。
For example, in the manufacturing process of semiconductor devices such as ICs and LSIs, a lead frame on which a semiconductor element is mounted is placed in a mold for molding, and then epoxy resin is injected into the mold as shown in Figure 1. A semiconductor element (not shown) on a lead frame 1 is sealed with a resin layer 2 to form a semiconductor molded product 3. However, during such mold forming, resin burrs 4 on the lead frame 1 near the resin layer 2 and between the leads of the lead frame 1...
Since this occurs, a step of removing the resin burrs 4 is required as a post-processing after molding. For this reason, in the past, hardened abrasives such as alumina, silicon carbide, and glass beads, or soft abrasives such as walnut shells were injected at high speed onto the resin burrs 4 of the lead frame 1, and the resin burrs 4... are destroyed and removed. However, when using hard abrasives,
Its hardness is over H R C70, while the hardness of epoxy resin is around H R M100. Abrasive materials are much harder than epoxy resin, and have a specific gravity more than four times as large, so resin burrs When removing 4..., the surface of the molded product 3 is damaged and its appearance is damaged, and moisture containing harmful ions penetrates through the scratches of the molded product 3, which adversely affects the reliability of the semiconductor element. There was a problem. On the other hand, when a soft abrasive is used, the abrasive force is weak, so it is necessary to spray at a higher pressure than when a hard abrasive is used. As a result, lead frame 1
Not only does this pose a risk of bending, but it also has the drawback of increasing running costs. In addition, when a soft abrasive material is used, this abrasive material and the molded product 3
Static electricity is generated by contact with the molded product 3, and this static electricity causes the crushed powder of the abrasive to firmly adhere to the surface of the molded product 3, reducing solder wettability and causing damage to the appearance during solder coating and plating in subsequent processes. This may lead to defects or corrosion of the lead frame 1.
本発明は、上記事情を勘案してなされたもの
で、例えば半導体などのモールド成形品の成形時
に樹脂バリを効率的に除去できるとともに、モー
ルド成形品の損傷を招くことがない研磨材を提供
しようとするものである。
The present invention has been made in consideration of the above circumstances, and it is an object of the present invention to provide an abrasive material that can efficiently remove resin burrs during the molding of molded products such as semiconductors, and does not cause damage to the molded products. That is.
本発明の研磨材は、合成樹脂粒状物に例えばガ
ラスビーズなどの球状体の硬質研磨材を保持させ
たものである。上記合成樹脂粒状物としては、尿
素樹脂、メラミン樹脂、ポリエステル樹脂、アル
キツド樹脂、エポキシ樹脂等の熱硬化性樹脂、又
はポリアミド、ポリカーボネート、ポリスチレン
などの熱可塑性樹脂を用いることができる。とり
わけ、熱硬化性樹脂を用いたばあい、噴射加工時
の衝撃により鋭いエツジが不断に再生されるので
樹脂バリ除去に適している。こうした合成樹脂粒
状物の粒径は、研磨材の用途により自由に選定し
得るが、例えばモールド成形品の樹脂バリ除去に
用いる場合には平均粒径（一つの粒子の最大径と
最小径の和の1/2）で0.5〜1.0mmの範囲内におい
てピークをもつものが望ましい。また、この合成
樹脂粒状物の形状は、球状、多角体等任意であ
る。
The abrasive material of the present invention has a spherical hard abrasive material such as glass beads held in synthetic resin particles. As the synthetic resin particles, thermosetting resins such as urea resin, melamine resin, polyester resin, alkyd resin, and epoxy resin, or thermoplastic resins such as polyamide, polycarbonate, and polystyrene can be used. In particular, when a thermosetting resin is used, the sharp edges are constantly regenerated by the impact during the injection process, making it suitable for removing resin burrs. The particle size of such synthetic resin granules can be freely selected depending on the use of the abrasive, but for example, when used for removing resin burrs from molded products, the average particle size (sum of the maximum and minimum diameters of one particle) 1/2) with a peak within the range of 0.5 to 1.0 mm. Further, the shape of the synthetic resin particles may be arbitrary, such as spherical or polygonal.
一方、球体状の硬質研磨材は、合成樹脂粒状物
より研磨能力が大きく、合成樹脂粒状物単独の場
合よりも研磨能力を向上させるためのものであ
る。このような硬質研磨材としては、平均粒径が
0.1mm前後（粒度＃150）の球体状をなすガラスビ
ーズが好適している。このような球体状硬質研磨
材の合成樹脂粒状物への混合割合は、体積比で１
〜100体積％であつて、最適範囲としては５〜30
体積％である。 On the other hand, the spherical hard abrasive material has a greater polishing ability than the synthetic resin granules, and is intended to improve the polishing ability compared to the case of the synthetic resin granules alone. For such hard abrasives, the average particle size is
Spherical glass beads of around 0.1 mm (particle size #150) are suitable. The mixing ratio of such spherical hard abrasive material to synthetic resin granules is 1 by volume.
~100% by volume, with an optimal range of 5-30
It is volume %.
本発明における研磨材は、合成樹脂粒状物に球
体状の硬質研磨材を保持させたものであるが、具
体的には以下に示す２種類のものがある。 The abrasive material in the present invention is made by holding a spherical hard abrasive material in synthetic resin particles, and specifically there are two types shown below.
(1) 球体状硬質研磨材が合成樹脂粒状物の表面の
みならず内部にも分散して混在している研磨
材。(1) An abrasive material in which spherical hard abrasive materials are dispersed and mixed not only on the surface of synthetic resin particles but also inside them.
(2) 球体状硬質研磨材が合成樹脂粒状物の表面に
のみ付着している研磨材。(2) An abrasive in which the spherical hard abrasive is attached only to the surface of the synthetic resin particles.
以下、本発明の一実施例を図面を参照して詳述
する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
まず、不飽和ポリエステル樹脂液に平均粒計
0.1mm以下の球状体をなすガラスビーズを添加
し、撹拌して均一に混合した後、硬化剤を加えて
不飽和ポリエステル硬化物を生成した。つづい
て、この硬化物をクラツシヤ、ハンマー等により
粗紛砕したのち、ボールミル、ロールミル又は衝
撃粉砕機等を用いて粗粒子を微粉砕した。この
後、微粒子を篩により分級して第２図に示す如く
ＨRM100で平均粒径が0.3mm前後の塊状の合成樹
脂粒状物５の表面及び内部にガラスビーズ６…が
25体積％付着、混在した多角体状の研磨材７を得
た。 First, add an average particle meter to the unsaturated polyester resin liquid.
Glass beads in the form of spheres of 0.1 mm or less were added and stirred to mix uniformly, and then a curing agent was added to produce a cured unsaturated polyester. Subsequently, this cured product was coarsely pulverized using a crusher, a hammer, etc., and then the coarse particles were pulverized using a ball mill, roll mill, impact pulverizer, etc. Thereafter, the fine particles are classified using a sieve, and as shown in FIG.
A mixed polygonal abrasive material 7 with 25% adhesion by volume was obtained.
つぎに、第３図に図示する湿式プラスト装置を
用いて前記研磨材による半導体モールド成形品の
樹脂バリ除去を説明する。まず、加圧室８内に設
置したホツパ９内に研磨材７…と水１０とを１：
９の比率で収容する。つづいて、第１のポンプ１
１を作動して研磨材７…を水１０と共に吸い込
み、これをホツパ９底部へ強制的に送給すること
により撹拌し、研磨材７…を均一に分散させてス
ラリーを調整した。ついで、第２のポンプ１２を
作動させて、スラリーを吸上げてガン１３に導入
し、これを空気導入管１４からの圧縮空気により
分散加速して水、研磨材及び空気の三相高速噴射
流１５として加工室８内に搬送された半導体モー
ルド成形品（図示せず）に向つて噴射させる。こ
のように噴射流がモールド成形品に噴射される
と、第４図に示すように研磨材７がモールド成形
品３のリードフレーム１上及びリードフレーム１
のリード間に付着した樹脂バリ４に衝突する。樹
脂バリ４は、熱硬化性のエポキシ樹脂からなり、
脆く破壊され易いため、ガラスビーズ６…により
研磨力が強化された研磨材７による衝撃力及びこ
の衝撃力に伴なう振動により、樹脂バリ４にクラ
ツク１６が発生する。しかして、前記樹脂バリ４
のクラツク１６に水が侵入し、侵入した水はリー
ドフレーム１と樹脂バリ４の界面に入り、樹脂バ
リ４をリードフレーム１に対して浮かすように作
用するため、樹脂バリ４は容易に剥離する。更
に、研磨材７が樹脂バリ４のクラツク１６…に何
度も衝突するため、前記侵入した水による樹脂バ
リ４の浮上げ作用と相俟つて樹脂バリ４が完全に
除去される。とりわけ、本実施例の研磨材７は、
研磨力が合成樹脂単独の場合よりも強化されてい
るので、リードフレームのリード間にはさまつて
いる厚さ１〜10μｍから50μｍの前後の樹脂バリ
も除去できる。しかも、本実施例の研磨材７は、
被加工物に衝突した際に、ガラスビーズ６…を起
点としてクラツクが生じ易く、ついには、クラツ
クが成長して、一部が脱落し、新しい鋭利なエツ
ジが容易に生じる。つまり、本実施例の研磨材７
は、鋭いエツジの新生作用（自主発刃作用）を有
しているので、樹脂バリの除去能力を長期間にわ
たつて維持することができる。 Next, the removal of resin burrs from a semiconductor molded product using the abrasive material will be explained using the wet plast apparatus shown in FIG. First, abrasive material 7 and water 10 are placed in a hopper 9 installed in a pressurizing chamber 8 in a ratio of 1:1.
Accommodate at a ratio of 9. Next, the first pump 1
1 was activated to suck in the abrasive materials 7 along with water 10, and the abrasive materials 7 were forcibly fed to the bottom of the hopper 9 for stirring to uniformly disperse the abrasive materials 7 and prepare a slurry. Next, the second pump 12 is operated to suck up the slurry and introduce it into the gun 13, which is dispersed and accelerated by compressed air from the air introduction pipe 14 to form a three-phase high-speed jet stream of water, abrasive material, and air. 15, the liquid is sprayed toward a semiconductor molded product (not shown) transported into the processing chamber 8. When the jet stream is injected onto the molded product in this way, the abrasive material 7 is sprayed onto the lead frame 1 of the molded product 3 and onto the lead frame 1 as shown in FIG.
collides with the resin burr 4 attached between the leads. The resin burr 4 is made of thermosetting epoxy resin,
Since the resin burr 4 is brittle and easily broken, cracks 16 occur in the resin burr 4 due to the impact force caused by the abrasive material 7 whose abrasive force has been strengthened by the glass beads 6 and the vibration accompanying this impact force. However, the resin burr 4
Water enters into the crack 16, enters the interface between the lead frame 1 and the resin burr 4, and acts to float the resin burr 4 relative to the lead frame 1, so that the resin burr 4 is easily peeled off. . Further, since the abrasive material 7 collides with the cracks 16 of the resin burr 4 many times, the resin burr 4 is completely removed due to the floating action of the resin burr 4 due to the intruding water. In particular, the abrasive material 7 of this example is
Since the polishing power is stronger than that of synthetic resin alone, it is possible to remove resin burrs with a thickness of 1 to 10 μm to 50 μm that are sandwiched between the leads of the lead frame. Moreover, the abrasive material 7 of this example is
When the glass beads 6 collide with the workpiece, cracks tend to occur starting from the glass beads 6, and eventually the cracks grow and some of them fall off, easily creating new sharp edges. In other words, the abrasive material 7 of this example
has the ability to generate sharp edges (self-sharpening ability), so it can maintain its ability to remove resin burrs over a long period of time.
ちなみに、ガラスビーズ６…を含む本実施例の
研磨材７と、ガラスビーズ６…を含まない同樹脂
製の研磨材とを用いて、噴射圧力、噴射流量、噴
射時間が同一の条件で樹脂バリが付着した100個
の試験片についてバリ取りを行ない、何個完全に
バリ取りされたかを調べた。その結果、ガラスビ
ーズを含まない研磨材は、100個のうち20〜30個
の試験片については樹脂バリが残存していたが、
本実施例の研磨材７の場合は100個の試験片全部
について完全に樹脂バリが除去された。換言すれ
ば、従来の研磨材及び本実施例の研磨材を用いて
100個の試験片全部について完全に樹脂バリが除
去するまでの処理時間を比較すると、本実施例の
研磨材７の方が約20％処理時間を短縮できる。し
たがつて、三相高速噴射流１５の噴出圧力をこと
さら高くしなくとも、樹脂バリ４を完全に除去で
きるため、噴射流１５によるリードフレームの曲
りを防止できる。また、本実施例の研磨材７は、
本体が合成樹脂からなつていること、およびこの
研磨材７を構成するガラスビーズ６…が球体をな
していることとが相俟つて、アルミナ、炭化珪素
等の硬質研磨材単独の場合に比べて、半導体モー
ルド成形品３及びバリ取りに用いる治具に付着、
埋入しにくくなり、後工程での洗浄処理により容
易にバリや研磨屑を除去できる。その結果、はん
だのぬれ性が害されることなく半田コートやメツ
キ後の外観不良や使用中の腐食発生を防止でき
る。また、埋入とともに生じたクラツクより悪性
のイオンを含有する水分が内部に浸透することが
なくなり、電子部品としての信頼性劣化を防止す
ることができる。さらに、ガラスビーズ６…と合
成樹脂粒状物５とは、一体的に結合しているの
で、長期間の使用により研磨材の全体量が不足し
ても、これらガラスビーズと合成樹脂粒状物とを
一定の割合に配合して補給する必要がなく、その
ままの状態で供給できる利点を有する。 Incidentally, resin burrs were made using the abrasive material 7 of this example containing glass beads 6 and an abrasive material made of the same resin that does not contain glass beads 6 under the same conditions of injection pressure, injection flow rate, and injection time. Deburring was performed on 100 test specimens to which was adhered, and it was determined how many were completely deburred. As a result, resin burrs remained on 20 to 30 out of 100 test pieces of the abrasive material that did not contain glass beads, but
In the case of abrasive material 7 of this example, resin burrs were completely removed from all 100 test pieces. In other words, using the conventional abrasive material and the abrasive material of this example,
Comparing the processing time required to completely remove the resin burrs for all 100 test pieces, the abrasive material 7 of this example can shorten the processing time by about 20%. Therefore, the resin burr 4 can be completely removed without increasing the ejection pressure of the three-phase high-speed jet flow 15, so that bending of the lead frame due to the jet flow 15 can be prevented. Moreover, the abrasive material 7 of this example is
The fact that the main body is made of synthetic resin and the glass beads 6 constituting this abrasive material 7 are spherical makes it more durable than a single hard abrasive material such as alumina or silicon carbide. , adhered to the semiconductor molded product 3 and the jig used for deburring,
It becomes difficult to embed, and burrs and polishing debris can be easily removed by cleaning in the post-process. As a result, poor appearance after solder coating or plating and corrosion during use can be prevented without impairing solder wettability. In addition, water containing malignant ions will not penetrate into the interior of the device due to cracks generated during embedding, and deterioration in reliability as an electronic component can be prevented. Furthermore, since the glass beads 6 and the synthetic resin granules 5 are integrally bonded, even if the total amount of abrasive is insufficient due to long-term use, these glass beads and the synthetic resin granules can be combined. It has the advantage of being able to be supplied as is without the need to mix and replenish it in a fixed proportion.
なお、本発明の研磨材は上記実施例のものに限
らず、第５図に示す如く合成樹脂粒状物５表面全
体に球体状をなすガラスビーズ１７…を接着剤１
８により付着させた研磨材７′を用いてもよい。
この研磨材７′は、例えば0.3mm前後の平均粒径の
合成樹脂粒状物５をいつたん接着剤溶液中にデイ
ツピングするか、或いは同粒状物に接着剤溶液を
スプレーするかした後、ガラスビーズ粉体と混合
することにより製造し得る。かかる第５図図示の
研磨材７′においても、前記実施例と同様、バリ
取り性能の向上や洗浄の容易化等の効果を有す
る。上記接着剤１８としては、シリコーン樹脂又
はエポキシ樹脂が好適している。後者のエポキシ
樹脂を用いてガラスビーズ１７…を接着した場合
は、ガラスビーズ１７…は、合成樹脂粒状物５に
強固に固着されているので、研磨加工にともなつ
てガラスビーズ１７…が合成樹脂粒状物５より離
脱する際にクラツクが発生し、発生したクラツク
を起点として新しい切刃が新生する自主発刃作用
を有しており、研磨力を長期間にわたつて一定水
準に維持することができる。また、前記実施例と
同様に、補給が容易である利点を有する。一方、
接着剤１８としてシリコーン樹脂を用いた場合、
接着力は、エポキシ樹脂より小さいためガラスビ
ーズ１７…が離脱しやすいが、前記実施例と同様
に、配合作用が不要となり、補給が容易である利
点を有している。さらに、他の実施例として、ガ
ラスビーズとともに、合成樹脂粒状物の0.001〜
１重量％の範囲で、ポリオキシエチレンアルキル
エーテル類、ポリオキシエチレンアルキルエステ
ル類等の界面活性材をガラスビーズとともに保持
させてもよい。保持形態は、合成樹脂本体の表面
にのみ膜状に付着させてもよいし、微粒子状に合
成樹脂本体の内部及び表面に混在させてもよい。
このようにすることにより、合成樹脂本体にガラ
スビーズが混在していることによる効果と合わせ
て、スラリーの表面張力を低下させて樹脂バリに
生じたクラツクへの浸透性を向上させてバリ取り
除去効果を促進させるとともに、モールド成形品
の帯電を防止して、バリや研磨屑の洗浄処理を容
易化させることができる。また、第６図に示すよ
うに、ワイヤカツト状の合成樹脂粒状物１９の表
面に接着剤を介して球体状をなすガラスビーズ２
０…を被着させた研磨材７″を用いても、前記実
施例と同様の効果を奏する。本発明に係る研磨材
は上記実施例の如く半導体モールド成形品の樹脂
バリ除去に限定されず、他のモールド成形品の樹
脂バリの除去及び乾式プラスト加工にも同様に適
用できる。さらに、研磨材としてはガラスビーズ
に拘泥することなく球体状の硬質流体であれば、
どのようなものでもよい。 Note that the abrasive material of the present invention is not limited to that of the above-mentioned embodiments, and as shown in FIG.
An abrasive material 7' deposited by 8 may also be used.
This abrasive material 7' is prepared by dipping synthetic resin granules 5 with an average particle size of, for example, around 0.3 mm into an adhesive solution, or by spraying the adhesive solution onto the granules, and then using glass beads. It can be produced by mixing with powder. The abrasive material 7' shown in FIG. 5 also has effects such as improved deburring performance and easier cleaning, similar to the embodiments described above. As the adhesive 18, silicone resin or epoxy resin is suitable. When the glass beads 17 are bonded using the latter epoxy resin, the glass beads 17 are firmly fixed to the synthetic resin particles 5, so that the glass beads 17 are bonded to the synthetic resin as they are polished. Cracks are generated when separating from the granules 5, and a new cutting edge is generated from the generated cracks as a starting point, which has a self-starting effect, making it possible to maintain the polishing force at a constant level over a long period of time. can. Also, like the embodiments described above, it has the advantage of being easy to replenish. on the other hand,
When silicone resin is used as the adhesive 18,
Since the adhesive force is smaller than that of epoxy resin, the glass beads 17 are easily detached, but as in the previous embodiment, it has the advantage that no blending action is required and replenishment is easy. Furthermore, as another example, along with glass beads, synthetic resin granules of 0.001~
A surfactant such as polyoxyethylene alkyl ethers and polyoxyethylene alkyl esters may be retained together with the glass beads within a range of 1% by weight. The holding form may be attached only to the surface of the synthetic resin body in the form of a film, or may be mixed in the form of fine particles inside and on the surface of the synthetic resin body.
By doing this, in addition to the effect of glass beads mixed in the synthetic resin body, the surface tension of the slurry is lowered and the cracks formed in the resin burr are improved and deburred. In addition to promoting the effect, it is possible to prevent charging of the molded product and facilitate cleaning of burrs and polishing debris. Further, as shown in FIG. 6, spherical glass beads 2 are attached to the surface of wire-cut synthetic resin particles 19 with an adhesive.
Even if the abrasive material 7" coated with It can be similarly applied to the removal of resin burrs and dry plast processing of other molded products.Furthermore, as an abrasive material, it is not limited to glass beads, but any spherical hard fluid can be used.
It can be anything.
以上詳述した如く、本発明によれば半導体モー
ルド及びその他の成形品の成形時に発生した樹脂
バリ等を、この成形品の損傷を招くことなく、容
易かつ迅速に除去できると共に、樹脂バリ除去後
のモールド成形品の洗浄を容易に行なうことがで
きる等顕著な効果を奏する。
As described in detail above, according to the present invention, resin burrs etc. generated during molding of semiconductor molds and other molded products can be easily and quickly removed without causing damage to the molded products, and after removing the resin burrs, It has remarkable effects such as making it easy to clean molded products.
第１図は半導体モールド成形品を示す平面図、
第２図は本発明の一実施例を示す研磨材の断面
図、第３図は第２図の研磨材によるブラスト処理
に用いられる湿式ブラスト装置の一形態を示す説
明図、第４図は研磨材による樹脂バリ除去を示す
説明図、第５図及び第６図はそれぞれ本発明の他
の実施例を示す研磨材の断面図及び斜視図であ
る。
１……リードフレーム、２……樹脂層、３……
半導体モールド成形品、４……樹脂バリ、５……
合成樹脂粒状物、６，１７，２０……ガラスビー
ズ、７，７′，７″……研磨材、８……加工室、９
……ホツパ、１０……水、１１，１２……ポン
プ、１３……ガン、１５……三相高速噴射流、１
６……クラツク。
Figure 1 is a plan view showing a semiconductor molded product;
FIG. 2 is a sectional view of an abrasive material showing an embodiment of the present invention, FIG. 3 is an explanatory diagram showing one form of a wet blasting device used for blasting using the abrasive material of FIG. 2, and FIG. 4 is a polishing material. 5 and 6 are a sectional view and a perspective view, respectively, of an abrasive material showing other embodiments of the present invention. 1...Lead frame, 2...Resin layer, 3...
Semiconductor molded product, 4...Resin burr, 5...
Synthetic resin granules, 6, 17, 20... Glass beads, 7, 7', 7''... Abrasive material, 8... Processing chamber, 9
...Hotsupa, 10...Water, 11,12...Pump, 13...Gun, 15...Three-phase high-speed jet flow, 1
6...Kratsuku.
Claims (1)
持された球体状硬質研磨材とを具備することを特
徴とする研磨材。 ２ 球体状硬質研磨材は合成樹脂粒状物の表面に
付着していることを特徴とする特許請求の範囲第
１項記載の研磨材。 ３ 球体状硬質研磨材は合成樹脂粒状物の表面の
みならず内部にも分散して混在していることを特
徴とする特許請求の範囲第１項記載の研磨材。 ４ 合成樹脂粒状物は熱硬化性樹脂により形成さ
れていることを特徴とする特許請求の範囲第１項
乃至第３項記載の研磨材。 ５ 球体状硬質研磨材はガラスビーズであること
を特徴とする特許請求の範囲第１項乃至第３項記
載の研磨材。 ６ 合成樹脂粒状物には界面活性材が保持されて
いることを特徴とする特許請求の範囲第１項記載
の研磨材。[Scope of Claims] 1. An abrasive material comprising synthetic resin granules and a spherical hard abrasive material held by the synthetic resin granules. 2. The abrasive material according to claim 1, wherein the spherical hard abrasive material is attached to the surface of the synthetic resin particles. 3. The abrasive material according to claim 1, wherein the spherical hard abrasive material is dispersed and mixed not only on the surface of the synthetic resin particles but also inside the synthetic resin particles. 4. The abrasive material according to claims 1 to 3, wherein the synthetic resin particles are made of a thermosetting resin. 5. The abrasive material according to any one of claims 1 to 3, wherein the spherical hard abrasive material is a glass bead. 6. The abrasive material according to claim 1, wherein a surfactant is retained in the synthetic resin particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10275883A JPS59227970A (en) | 1983-06-10 | 1983-06-10 | Abrasive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10275883A JPS59227970A (en) | 1983-06-10 | 1983-06-10 | Abrasive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59227970A JPS59227970A (en) | 1984-12-21 |
| JPS6121982B2 true JPS6121982B2 (en) | 1986-05-29 |
Family
ID=14336096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10275883A Granted JPS59227970A (en) | 1983-06-10 | 1983-06-10 | Abrasive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59227970A (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6288568A (en) * | 1985-10-16 | 1987-04-23 | Mitsui Toatsu Chem Inc | Abrasive |
| JPH03166060A (en) * | 1989-11-24 | 1991-07-18 | Mitsui Toatsu Chem Inc | Composite projection material for blasting |
| JPH04115870A (en) * | 1990-09-05 | 1992-04-16 | Sony Corp | Injection type work device for free composite abrasive grain |
| JP4014244B2 (en) * | 1997-02-17 | 2007-11-28 | 横浜ゴム株式会社 | Golf ball manufacturing method |
| JPH10232099A (en) * | 1997-02-19 | 1998-09-02 | Genden Koji Kk | Method and device for grinding and sweeping internal surface of tube |
| JP2000079563A (en) * | 1998-09-02 | 2000-03-21 | Yunipetsuku:Kk | Pipe grinding method and grinding material |
| JP2000127045A (en) * | 1998-10-20 | 2000-05-09 | Sinto Brator Co Ltd | Projection material for sand blast |
| AU2323400A (en) * | 1999-02-01 | 2000-08-25 | Bridgestone Corporation | Grinding beads and beads production method and device therefor |
| JP2003170603A (en) * | 2001-09-26 | 2003-06-17 | Fuji Photo Film Co Ltd | Method and apparatus for manufacturing liquid drop jet head |
| JP2003306664A (en) * | 2002-04-12 | 2003-10-31 | Mitsuboshi Belting Ltd | Resin composite abrasive material |
| JP2004243464A (en) * | 2003-02-13 | 2004-09-02 | Toshiba Corp | Polishing method of large-sized parts and abrasive grain for use in it |
| JP3800610B2 (en) * | 2003-08-19 | 2006-07-26 | 合資会社亀井鉄工所 | Abrasive |
| JP2005179604A (en) * | 2003-12-22 | 2005-07-07 | Polyplastics Co | Abrasive material and method for reclaiming metal parts of molding machine |
| JP5103681B2 (en) * | 2006-10-10 | 2012-12-19 | 株式会社秋山製作所 | Suture needle and method for manufacturing the suture needle |
| JP5041313B2 (en) * | 2006-12-12 | 2012-10-03 | 株式会社秋山製作所 | Suture needle and method for manufacturing the suture needle |
| JP5376242B2 (en) * | 2009-12-08 | 2013-12-25 | 新東工業株式会社 | Blasting projection material and manufacturing method thereof |
| JP6905355B2 (en) * | 2017-03-01 | 2021-07-21 | 日揮触媒化成株式会社 | Abrasives and their manufacturing methods |
-
1983
- 1983-06-10 JP JP10275883A patent/JPS59227970A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59227970A (en) | 1984-12-21 |
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