KR840005830A - Abrasive and manufacturing method thereof - Google Patents

Abrasive and manufacturing method thereof Download PDF

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Publication number
KR840005830A
KR840005830A KR1019830003791A KR830003791A KR840005830A KR 840005830 A KR840005830 A KR 840005830A KR 1019830003791 A KR1019830003791 A KR 1019830003791A KR 830003791 A KR830003791 A KR 830003791A KR 840005830 A KR840005830 A KR 840005830A
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KR
South Korea
Prior art keywords
synthetic resin
surfactant
abrasive
abrasive according
solid
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KR1019830003791A
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Korean (ko)
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KR860001466B1 (en
Inventor
다가시(외 3) 미야다니
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사바 쇼오이찌(외 1)
도교오 시바우라 덴기 가부시기 가이샤
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Publication of KR840005830A publication Critical patent/KR840005830A/en
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Publication of KR860001466B1 publication Critical patent/KR860001466B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00Selection of abrasive materials or additives for abrasive blasts
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se

Abstract

내용 없음No content

Description

연마재 및 그 제조방법Abrasive and its manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에서, 합성수지입체에 크랙(crack)을 발생시키기 위한 일실시예를 나타낸 단면도.1 is a cross-sectional view showing an embodiment for generating a crack in the synthetic resin solid body in the present invention.

제2도는 본 발명의 연마재 입자의 형상 및 크랙의 발생의 발생상태를 표시한 평면도,2 is a plan view showing the shape of the abrasive grains of the present invention and the occurrence of cracks;

제3도는 몰드 플래쉬(moldflash)를 갖가 반도체 장치의 몰드품의 평면도.3 is a plan view of a molded article of a semiconductor device having a moldflash.

Claims (28)

복수의 인형날을 갖고있음과 동시에, 피가공물과의 충돌에 의하여 쪼개져 갈라지기 쉬운 크랙을 갖는 합성수지 입체로 된 연마재.An abrasive made of a synthetic resin solid having a plurality of doll blades and having cracks that are easily cracked and broken by collision with the workpiece. 특허청구의 범위 1항에 있어서, 계면활성제가 이 합성수지 입체에 보지되어 있는 연마재.The abrasive according to claim 1, wherein the surfactant is held in this synthetic resin solid. 특허청구의 범위 2항에 있어서, 계면활성제가 합성수지 입체의 표면 및 내부에 혼재하고 있는 연마재.The abrasive according to claim 2, wherein the surfactant is mixed in the surface and the inside of the synthetic resin solid. 특허청구의 범위 2항에 있어서, 계면활성제가 합성수지 입체의 표면에만 부착하고 있는 연마재.The abrasive according to claim 2, wherein the surfactant adheres only to the surface of the synthetic resin solid. 특허청구의 범위 2항에 있어서, 이 계면활성제가 비이온 계면활성제인 연마재.The abrasive according to claim 2, wherein the surfactant is a nonionic surfactant. 특허청구의 범위 5항에 있어서, 비이온계면 활성제가 할로겐성분, 암모니아성분, 인성분, 유황성분, 금속이온 성분을 포함하지 않는 연마재.The abrasive according to claim 5, wherein the nonionic surfactant contains no halogen, ammonia, phosphorus, sulfur, or metal ion. 특허청구의 범위 1항에 있어서, 이 합성수지 입체가 내부에 1중량%이하의 계면활성제를 포함한 연마재.The abrasive according to claim 1, wherein the synthetic resin solid content contains 1% by weight or less of surfactant therein. 특허청구의 범위 7항에 있어서, 이 계면활성제가 비이온 계면활성제인 연마재.The abrasive according to claim 7, wherein the surfactant is a nonionic surfactant. 특허청구의 범위 8항에 있어서, 비이온 계면활성제가 할로겐성분, 암모니아성분, 인성분, 유황성분, 금속이온 성분을 포함하지 않는 연마재.The abrasive according to claim 8, wherein the nonionic surfactant contains no halogen, ammonia, phosphorus, sulfur, or metal ion. 특허청구의 범위 1항에 있어서, 합성수지 입체가 열경화성 수지지로 된 연마재.The abrasive according to claim 1, wherein the synthetic resin solid is a thermosetting resin. 특허청구의 범위 10항에 있어서, 열경화성 수지가 요소수지, 메라민수지, 불포화 폴리에스텔수지, 알킷수지, 에폭시수지의 경화물로부터 선택되는 연마재.The abrasive according to claim 10, wherein the thermosetting resin is selected from cured products of urea resins, melamine resins, unsaturated polyester resins, alkyd resins, and epoxy resins. 특허청구의 범위 1항에 있어서, 합성수지 입체가 편평형상, 침상형상, 블록형사에서 선택된 적어도 일종의 형상으로 되어있는 연마재.The abrasive according to claim 1, wherein the synthetic resin solid is at least one type selected from flat, needle and block yarns. 특허청구의 범위 1항에 있어서, 합성수지 입체의 입경(입체의 최대직경과 최소직경의 합의 1/2)이 0.05~2,0mm의 범위에 피크치 및 평균치가 있는 연마재.The abrasive according to claim 1, wherein the synthetic resin solid particle diameter (1/2 of the sum of the maximum and minimum diameters of the solid) has a peak value and an average value in the range of 0.05 to 2,0 mm. 합성수지 소재를 성형하고 이어서 이것을 입상화하는 합성수지 연마재의 제조방법에 있어서, 상기 성형공정 또는 입상화 공정에 있어서, 피가공물과의 충돌에 의하여 용이하게 쪼개져 갈라지는 크랙을 발생시키는 것을 특징으로 하는 합성수지 연마재의 제조방법.A method for producing a synthetic resin abrasive comprising molding a synthetic resin material and then granulating the synthetic resin material, wherein in the forming step or granulation step, cracks are easily cracked due to collision with the workpiece. Manufacturing method. 특허청구의 범위 14항에 있어서, 합성수지 소재의 성형시에 내부외를 발생케하는 방법.The method according to claim 14, wherein the inside and outside are generated during molding of the synthetic resin material. 특허청구의 범위 15항에 있어서, 열경화성 수지를 미리 분체화한 것을 핵으로 하여 합성수지 소재중에 분산시켜서 성형하여 내부외를 발생케하는 제조방법.The production method according to claim 15, wherein the thermosetting resin is preliminarily powdered and dispersed in a synthetic resin material to form a nucleus to generate internal and external conditions. 특허청구의 범위 15항에 있어서, 합성수지 소재를 가열에 의하여 또는촉매첨가에 의항여 겔화시켜 경화도중에서 의를 발생케하는 제조방법.The method according to claim 15, wherein the synthetic resin material is gelled by heating or by the addition of a catalyst to generate right during curing. 특허청구의 범위 15항에 있어서, 합성수지 소재를 통상보다 높은 온도로 경화시켜 이 급격한 경화반응에 의하여 내부의를 발생케하는 제조방법.The production method according to claim 15, wherein the synthetic resin material is cured at a higher temperature than usual to generate an interior by the rapid curing reaction. 특허청구의 범위 15항에 있어서, 합성수지 소재를 성형후, 용제 또는 자비중에 침지한 후, 이것을 분쇄하는 제조방법.The production method according to claim 15, wherein the synthetic resin material is immersed in a solvent or in boiling water after molding, and then pulverized it. 특허청구의 범위 14항에 있어서 조립체화한 합성수지입자를 다수의 절인을 가진 가공구에 의하여 가압하여 미세입자화하는 제조방법.The manufacturing method of Claim 14 of Claim 14 which granulates the granulated synthetic resin particle by the process tool which has many pickles. 특허청구의 범위 14항에 있어서, 조입체화한 합성수지 입자를 10℃ 이하의 온도에서 미세화하는 제조방법.The manufacturing method of Claim 14 which refine | miniaturizes the granulated synthetic resin particle at the temperature of 10 degrees C or less. 특허청구의 범위 14항에 있어서, 조입체화한 합성수지 입자를, 고온에서 강도저하 상태로 하고 이것을 미립자화하는 제조방법.The production method according to claim 14, wherein the granulated synthetic resin particles are brought into a state of reduced strength at a high temperature, and the fine particles are granulated. 특허청구의 범위 14항에 있어서, 합성수지 소재 성형물에 급열 또는 급냉에 의한 열충격을 가한 후 미립체화하는 제조방법.The method according to claim 14, wherein the synthetic resin molded article is subjected to thermal granulation after quenching or quenching and then granulated. 특허청구의 범위 14항에 있어서, 합성수지 소재에 미리 계면활성제를 혼재시키는 제조방법.The manufacturing method of Claim 14 which mixes surfactant previously with a synthetic resin raw material. 특허청구의 범위 14항에 있어서, 합성수지 소재를 입체화한 후 그 표면에 계면활성제를 코팅하는방법.The method according to claim 14, wherein the surface of the synthetic resin material is solidified and then the surface of the surface is coated with a surfactant. 특허청구의 범위 25항에 있어서, 상기 코팅은 합성수지 입상물을 계면활성제 용액에 디핑으로 하는 방법.26. The method of claim 25, wherein the coating is by dipping the synthetic resin granules into a surfactant solution. 특허청구의 범위 25항에 있어서, 합성수지 입체에 크랙을 발생시킨 후에 계면활성제의 코팅을 하는 방법.The method according to claim 25, wherein the surfactant is coated after the crack is generated in the synthetic resin solid. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019830003791A 1982-08-20 1983-08-13 Method for removing flashes from mold resin product KR860001466B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP57144455A JPS5937055A (en) 1982-08-20 1982-08-20 Abrasive material
JP57-14445 1982-08-20
JP144455 1982-08-20

Publications (2)

Publication Number Publication Date
KR840005830A true KR840005830A (en) 1984-11-19
KR860001466B1 KR860001466B1 (en) 1986-09-26

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KR1019830003791A KR860001466B1 (en) 1982-08-20 1983-08-13 Method for removing flashes from mold resin product

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221975A (en) * 1987-03-09 1988-09-14 Sekisui Plastics Co Ltd Synthetic resin grains for polishing
JP2760339B2 (en) * 1996-03-05 1998-05-28 日本電気株式会社 Lead frame deburring method and lead frame deburring device
AU2323400A (en) * 1999-02-01 2000-08-25 Bridgestone Corporation Grinding beads and beads production method and device therefor
US20040194803A1 (en) * 2003-04-04 2004-10-07 Asm Technology Singapore Pte Ltd Cleaning of an electronic device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426072A (en) * 1945-07-17 1947-08-19 Du Pont Blast cleaning
US3313067A (en) * 1964-10-20 1967-04-11 Gen Electric Process for deflashing articles
JPS5721268A (en) * 1980-07-11 1982-02-03 Nitto Electric Ind Co Ltd Resin particles for use in sand blasting process

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KR860001466B1 (en) 1986-09-26
JPS5937055A (en) 1984-02-29

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