KR860000413A - 동 또는 동합금 기재표면에의 내부식성 피막 형성방법 - Google Patents

동 또는 동합금 기재표면에의 내부식성 피막 형성방법 Download PDF

Info

Publication number
KR860000413A
KR860000413A KR1019850003761A KR850003761A KR860000413A KR 860000413 A KR860000413 A KR 860000413A KR 1019850003761 A KR1019850003761 A KR 1019850003761A KR 850003761 A KR850003761 A KR 850003761A KR 860000413 A KR860000413 A KR 860000413A
Authority
KR
South Korea
Prior art keywords
copper
base material
corrosion resistant
resistant film
forming
Prior art date
Application number
KR1019850003761A
Other languages
English (en)
Other versions
KR890004620B1 (ko
Inventor
가쯔도시(외 1) 야나기모도
Original Assignee
이시다 토꾸지로오
다이닛뽄 스크리인 세이조오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59115169A external-priority patent/JPS60258475A/ja
Priority claimed from JP60022164A external-priority patent/JPS61180233A/ja
Application filed by 이시다 토꾸지로오, 다이닛뽄 스크리인 세이조오 가부시기가이샤 filed Critical 이시다 토꾸지로오
Publication of KR860000413A publication Critical patent/KR860000413A/ko
Application granted granted Critical
Publication of KR890004620B1 publication Critical patent/KR890004620B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

동 또는 동합금 기재표면에의 내부식성 피막 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 동 또는 동합금으로 구성되는 기재의 표면에 수용성 고분자화합물 및 크로움산 암모늄으로 구성되는 감광액을 도포한 후 건조하고, 이어서 노광하여 현상함으로써 원하는 형의 내부식성 피막을 형성하는 동 또는 동합금 기재표면에의 내부식성 피막형성 방법에 있어서, 상기 감광액에 지방족아민을 첨가하고 감광액의 pH치를 6.1~7.8로 조제하는 것을 특징으로 하는 동 또는 동합금 기재표면에의 내부식성 피막형성 방법.
  2. 제1항에 있어서, 수용성 고분자화합물은 폴리비닐 알코올인 것을 특징으로 하는 동 또는 동합금기재 표면에의 내부식성 피막형성 방법.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019850003761A 1984-06-04 1985-05-30 동 또는 동합금 기재표면에의 내부식성 피막형성방법 KR890004620B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP115,169 1984-06-04
JP59-115169 1984-06-04
JP59115169A JPS60258475A (ja) 1984-06-04 1984-06-04 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法
JP22,164 1985-02-06
JP60022164A JPS61180233A (ja) 1985-02-06 1985-02-06 銅又は銅合金からなる基材表面への耐食性皮膜の形成方法

Publications (2)

Publication Number Publication Date
KR860000413A true KR860000413A (ko) 1986-01-28
KR890004620B1 KR890004620B1 (ko) 1989-11-20

Family

ID=26359338

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850003761A KR890004620B1 (ko) 1984-06-04 1985-05-30 동 또는 동합금 기재표면에의 내부식성 피막형성방법

Country Status (3)

Country Link
US (1) US4634655A (ko)
EP (1) EP0164022A3 (ko)
KR (1) KR890004620B1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2721843B2 (ja) * 1989-03-23 1998-03-04 関西ペイント株式会社 プリント配線板の製造方法
US7371022B2 (en) * 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
US20110236376A1 (en) * 2008-09-08 2011-09-29 Smiley Stephen T Non-neutralizing immunity to influenza to prevent secondary bacterial pneumonia
US20100061995A1 (en) * 2008-09-08 2010-03-11 Damian Michael Carragher Immunotherapy To Treat Or Prevent Viral Infection
US9062116B2 (en) 2009-04-23 2015-06-23 Infinity Pharmaceuticals, Inc. Anti-fatty acid amide hydrolase-2 antibodies and uses thereof
CN104185376B (zh) * 2014-08-06 2017-04-26 东莞市凯昶德电子科技股份有限公司 一种线路板蚀刻方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE682742C (de) * 1935-05-18 1939-10-21 Heinrich Pruefer Dr Verfahren zur Herstellung einer lichtempfindlichen Chromat-Kolloid-Schicht fuer photomechanische Druckformen
GB506172A (en) * 1937-11-23 1939-05-23 August Paul Janke Improvements in and relating to the manufacture of photomechanical process printing blocks
US2676886A (en) * 1950-08-31 1954-04-27 Us Printing And Lithograph Com Method of producing printing plates
US2787546A (en) * 1955-02-08 1957-04-02 Eastman Kodak Co Light-sensitive photographic elements for photomechanical processes
US3074794A (en) * 1959-02-12 1963-01-22 Gisela K Oster Visible light bichromate process and material
US3284202A (en) * 1961-08-11 1966-11-08 Litho Chemical And Supply Co I Lithographic plate, its preparation and treatment solution therefor
FR1528489A (fr) * 1966-07-01 1968-06-07 Eastman Kodak Co Nouvelles compositions photosensibles utiles, notamment, pour la préparation de planches de reproduction photomécanique
US3598629A (en) * 1969-01-08 1971-08-10 Zenith Radio Corp Color cathode-ray tube
JPS6043306B2 (ja) * 1978-12-16 1985-09-27 タツタ電線株式会社 防食性セパレ−タ−フイルム
DE3144905A1 (de) * 1981-11-12 1983-05-19 Basf Ag, 6700 Ludwigshafen Zur herstellung von druck- und reliefformen geeignetes lichtempfindliches auszeichnungsmaterial und verfahren zur herstellung von druck- und reliefformen mittels dieses aufzeichnungsmaterials
JPS5934692A (ja) * 1982-08-20 1984-02-25 住友電気工業株式会社 フレキシブル印刷配線板の製造方法

Also Published As

Publication number Publication date
US4634655A (en) 1987-01-06
EP0164022A3 (en) 1986-12-03
KR890004620B1 (ko) 1989-11-20
EP0164022A2 (en) 1985-12-11

Similar Documents

Publication Publication Date Title
KR860000413A (ko) 동 또는 동합금 기재표면에의 내부식성 피막 형성방법
KR830010402A (ko) 감광성 중합체 조성물
KR860001110A (ko) 항균제 ⅱ의 제법
JPS57205192A (en) Optical information recording medium
KR900018734A (ko) 감광성조성물, 그것을 사용한 패턴형성방법 및 고분자화합물
KR830005325A (ko) 수용성 화학 발광 시스템
KR910013083A (ko) 자기기록매체
KR860003001A (ko) 돌출실이 구비된 자궁내 기구
KR860001884A (ko) 세균편모 염색액
JPS52130626A (en) Manufacture of photographic suport
KR830004662A (ko) 감광성 조성물
KR830007545A (ko) 프로스타글란딘의 제조방법
KR830003543A (ko) 감광성 조성물 및 패턴형성방법
JPS5744140A (en) Hardening method for photographic layer containing gelatin
JPS57105471A (en) Thickening of aqueous solution of gelatin
KR830003428A (ko) 파파베린 카바니온의 제조방법
KR830002015A (ko) 방식 피복 조성물
KR830007746A (ko) 에폭시 수지의 경화방법
KR950003568A (ko) 자석이 부착된 벽지
JPS5726844A (en) Hardening method for photographic layer containing gelatin
KR840006819A (ko) 열전도성이 양호한 점착테프
KR850006309A (ko) 시클로덱스트린 내포착화합물의 제조방법
JPS57189339A (en) Metallic thin film type magnetic recording medium and its manufacture
KR860000018A (ko) 감의 코오팅 처리방법
KR910009873A (ko) 필르밍액 조성물

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19971111

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee