KR810002160Y1 - Lug plate for i.c. printing board - Google Patents

Abstract

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Description

Lug plates for integrated circuits

1 is a bottom view of the present invention

2 is a partial cross-sectional view of the present invention.

3 is a plan view showing an example in which a circuit is actually configured on the lug plate of the present invention.

4 is a view showing a case in which two lug plates shown in FIG. 1 are integrally formed.

The present invention relates to a substrate, which is a kind of experiment kit, and more particularly to an inexpensive lug plate that enables to assemble integrated circuits and other devices, and to more easily measure electrical characteristics of each component. .

Conventionally, when conducting experiments on an integrated circuit (IC) and any circuit which is combined with other active and passive elements, the parts are soldered using an integrated circuit socket and a board (generally a universal board). It is known to connect each part electrically with a lead wire. Therefore, in the related art, a socket and a substrate, which are means for fixing an integrated circuit without soldering the substrate, must be purchased separately.

In addition, it was difficult to make accurate measurements because the measuring clip or various probes had to be in contact with the narrow fox space of the lead part of the electronic part or the lead when measuring the experiment.

Moreover, if the soldering iron is frequently applied when exchanging parts or dismantling the circuit, the copper plate attached to the board will be removed from the board and the board will be replaced.

The present invention has been devised in view of the above disadvantages and drawbacks, and an object thereof is to provide an inexpensive lug plate that facilitates experimental measurement and is reusable.

To this end, in the present invention, a copper plate of a rope extending radially from the center of the substrate is formed on one surface of the substrate, and holes are formed in the outer ends of the striped copper plate, and then the lug terminals are inserted and fixed. This lug terminal is soldered with active and passive elements except integrated circuits.

On the other hand, in each of the inner ends of the stripe copper plate, holes are formed in two rows corresponding to the number of pins of the integrated circuit, and eyelets are fixed to the holes. The eyelets are used to support the pins of the integrated circuit instead of the socket for the integrated circuit, and are not only small in size but also inexpensive in terms of unit cost. On the other hand, since each of the lug terminals and eyelets is electrically connected by a stripe copper plate, a flow for measuring the electrical characteristics of an active or passive element connected to a pin or lug terminal of a desired integrated circuit to a lug terminal having a large free space Accurate measurements can be obtained by contacting the clips or clips stably.

In addition, in the case of the present invention, since the part to be soldered is a lug terminal instead of a stripe copper plate, the relaxation from the substrate of the copper plate due to heat can be prevented.

When described with reference to the accompanying drawings, the advantages and features of the present invention as follows.

1 and 2 are bottom and cross-sectional views showing the structure of the lug plate according to the present invention, respectively.

Reference numeral 1 denotes an insulating substrate, and 2 denotes a striped copper plate formed on one surface of the substrate.

A lug terminal 3 is provided at an end of the striped copper plate 2 located at an outer circumference of the insulating substrate 1.

At the end of the copper plate 2 located in the center of the substrate 1, a plurality of holes 7 'are formed in two rows so as to fix a dual-in-lire integrated circuit. Since the number of pins of an integrated circuit that is commonly used is 14 or 16, holes corresponding thereto are also formed on the substrate 1, but in this figure, an example of 14 pins is shown. The eyelets 7, which serve to support the integrated circuits instead of the sockets, are fixed to the above-mentioned holes drilled in two rows as shown in FIG.

The center of the eyelet 7 is formed to accommodate a plate of the integrated circuit. As a result, electrical connection is made between the eyelet 7 and the lug terminal 3 for accommodating the pins of the integrated circuit.

In FIG. 1, 4 is a hole that allows the circuit board to be fixed to the chassis or other support by bolts.

One or two auxiliary holes 5 formed in the middle of the striped copper plate 2 should be prepared for soldering to the copper plate 2 without soldering the lug terminal 3 due to unavoidable circumstances. It is a hole installed.

FIG. 3 shows an example in which a predetermined circuit is actually formed on the lug plates of FIGS. 1 and 2. Electronic components are connected to the side opposite to the surface on which the copper plate is formed. Since the integrated circuit and the other devices are electrically connected through the lug terminal 3, it is necessary to contact the lug terminal 3 having a large contact space with a measuring flue or clip to test the electrical characteristics of each component. It is desirable to obtain accurate measurements.

4 is required when a circuit is to be combined into two integrated circuits.

As can be understood from the above description, according to the present invention, the integrated circuit can be fixed without soldering without using a socket, and can be easily reused without damaging the copper plate while facilitating disassembly and assembly of the parts and inspecting electrical characteristics. Lug plates for integrated circuits can be obtained.

Claims (1)

In the universal substrate formed of the copper plate by the screen printing method, the eyelet for fixing the integrated circuit is coupled to one end of the stripe copper plate, and the other end is coupled to the lug terminal for soldering elements other than the integrated circuit. Lug plate for integrated circuit.