KR20260002842A - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치

Info

Publication number
KR20260002842A
KR20260002842A KR1020257037011A KR20257037011A KR20260002842A KR 20260002842 A KR20260002842 A KR 20260002842A KR 1020257037011 A KR1020257037011 A KR 1020257037011A KR 20257037011 A KR20257037011 A KR 20257037011A KR 20260002842 A KR20260002842 A KR 20260002842A
Authority
KR
South Korea
Prior art keywords
processing
main surface
point
substrate
irradiation point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257037011A
Other languages
English (en)
Korean (ko)
Inventor
스스무 하야카와
히데유키 이노우에
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20260002842A publication Critical patent/KR20260002842A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • H01L21/02013—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020257037011A 2023-04-07 2024-03-26 기판 처리 방법 및 기판 처리 장치 Pending KR20260002842A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2023-062786 2023-04-07
JP2023062786 2023-04-07
PCT/JP2024/011861 WO2024209992A1 (ja) 2023-04-07 2024-03-26 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
KR20260002842A true KR20260002842A (ko) 2026-01-06

Family

ID=92971741

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257037011A Pending KR20260002842A (ko) 2023-04-07 2024-03-26 기판 처리 방법 및 기판 처리 장치

Country Status (5)

Country Link
JP (1) JPWO2024209992A1 (https=)
KR (1) KR20260002842A (https=)
CN (1) CN120981893A (https=)
TW (1) TW202510063A (https=)
WO (1) WO2024209992A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203823A (ja) 2000-06-29 2002-07-19 Shin Etsu Handotai Co Ltd 半導体ウエーハの加工方法および半導体ウエーハ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4986664A (en) * 1984-02-07 1991-01-22 International Technical Associates System and process for controlled removal of material to produce a desired surface contour
US5953578A (en) * 1998-09-08 1999-09-14 Winbond Electronics Corp. Global planarization method using plasma etching
JP6849382B2 (ja) * 2016-10-17 2021-03-24 矢崎総業株式会社 レーザ加工方法及びレーザ加工装置
US20220184743A1 (en) * 2019-04-05 2022-06-16 Tokyo Electron Limited Substrate processing system and substrate processing method
WO2022054611A1 (ja) * 2020-09-09 2022-03-17 東京エレクトロン株式会社 レーザー加工装置、及びレーザー加工方法
TWI903014B (zh) * 2021-01-21 2025-11-01 日商東京威力科創股份有限公司 基板加工方法及基板加工裝置
JP7596191B2 (ja) * 2021-03-24 2024-12-09 株式会社東京精密 シリコンウエハの表面改質方法
JP7798582B2 (ja) * 2022-01-18 2026-01-14 株式会社東京精密 半導体ウエハ表面の平坦化装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203823A (ja) 2000-06-29 2002-07-19 Shin Etsu Handotai Co Ltd 半導体ウエーハの加工方法および半導体ウエーハ

Also Published As

Publication number Publication date
CN120981893A (zh) 2025-11-18
TW202510063A (zh) 2025-03-01
WO2024209992A1 (ja) 2024-10-10
JPWO2024209992A1 (https=) 2024-10-10

Similar Documents

Publication Publication Date Title
JP7483020B2 (ja) レーザー加工装置、及びレーザー加工方法
JP7655651B2 (ja) 基板加工方法、及び基板加工装置
CN109594125A (zh) 六方晶单晶锭和晶片的加工方法
JP6076601B2 (ja) レーザ加工方法、半導体デバイスの製造方法及びレーザ加工装置
KR20260002841A (ko) 기판 처리 방법 및 기판 처리 장치
JP6012185B2 (ja) 半導体デバイスの製造方法
JP2015037172A (ja) ウェーハの加工方法
JP5453123B2 (ja) 切削方法
JP5969214B2 (ja) 半導体デバイスの製造方法
KR20260002842A (ko) 기판 처리 방법 및 기판 처리 장치
KR20250174051A (ko) 기판 처리 방법 및 기판 처리 장치
KR101630492B1 (ko) 메모리 수리에 대한 적응적 처리 제약
WO2025258398A1 (ja) 基板処理方法および基板処理装置
JP6552948B2 (ja) ウエーハの加工方法、及び加工装置
TW202604664A (zh) 雷射加工裝置及雷射加工方法
JP2013157449A (ja) 半導体デバイスの製造方法
JP7656797B2 (ja) レーザ加工方法及び装置
WO2025047207A1 (ja) 基板処理方法および基板処理システム
JP6731766B2 (ja) レーザー加工方法
JP2026007509A (ja) ウェーハの製造方法、レーザー加工装置、及びウェーハ製造装置
JP2023032215A (ja) 加工方法
WO2020130053A1 (ja) レーザ加工方法、半導体部材製造方法及びレーザ加工装置
JP2013157455A (ja) 半導体デバイスの製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)