KR20250168593A - 감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품 - Google Patents

감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품

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Publication number
KR20250168593A
KR20250168593A KR1020257036514A KR20257036514A KR20250168593A KR 20250168593 A KR20250168593 A KR 20250168593A KR 1020257036514 A KR1020257036514 A KR 1020257036514A KR 20257036514 A KR20257036514 A KR 20257036514A KR 20250168593 A KR20250168593 A KR 20250168593A
Authority
KR
South Korea
Prior art keywords
group
photosensitive resin
resin composition
represented
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257036514A
Other languages
English (en)
Korean (ko)
Inventor
다쿠미 오누마
사토시 아베
Original Assignee
에이치디 마이크로시스템즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이치디 마이크로시스템즈 가부시키가이샤 filed Critical 에이치디 마이크로시스템즈 가부시키가이샤
Publication of KR20250168593A publication Critical patent/KR20250168593A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
KR1020257036514A 2023-10-24 2023-10-24 감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품 Pending KR20250168593A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/038391 WO2025088704A1 (ja) 2023-10-24 2023-10-24 感光性樹脂組成物、パターン硬化物、パターン硬化物の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
KR20250168593A true KR20250168593A (ko) 2025-12-02

Family

ID=95515436

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257036514A Pending KR20250168593A (ko) 2023-10-24 2023-10-24 감광성 수지 조성물, 패턴 경화물, 패턴 경화물의 제조 방법, 및 전자 부품

Country Status (5)

Country Link
JP (1) JPWO2025088704A1 (https=)
KR (1) KR20250168593A (https=)
CN (1) CN121039567A (https=)
TW (1) TW202518171A (https=)
WO (1) WO2025088704A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009265520A (ja) 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013117669A (ja) * 2011-12-05 2013-06-13 Hitachi Chemical Co Ltd 感光性樹脂組成物、並びにこれを用いた感光性フィルム、レジストパターンの形成方法及びプリント配線板
JP2015151405A (ja) * 2014-02-10 2015-08-24 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP2018084626A (ja) * 2016-11-22 2018-05-31 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP2018146964A (ja) * 2017-03-08 2018-09-20 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP7133027B2 (ja) * 2018-09-27 2022-09-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス
JP7395817B2 (ja) * 2018-10-03 2023-12-12 Ｈｄマイクロシステムズ株式会社 パターン硬化膜の製造方法、感光性樹脂組成物、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP7601043B2 (ja) * 2021-03-30 2024-12-17 味の素株式会社 感光性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009265520A (ja) 2008-04-28 2009-11-12 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品

Also Published As

Publication number Publication date
JPWO2025088704A1 (https=) 2025-05-01
TW202518171A (zh) 2025-05-01
WO2025088704A1 (ja) 2025-05-01
CN121039567A (zh) 2025-11-28

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