KR20250108652A - 빔 장치, 라멜라 추출 장치, 라멜라 관찰 시스템 및 라멜라 제작 방법 - Google Patents

빔 장치, 라멜라 추출 장치, 라멜라 관찰 시스템 및 라멜라 제작 방법

Info

Publication number
KR20250108652A
KR20250108652A KR1020257018638A KR20257018638A KR20250108652A KR 20250108652 A KR20250108652 A KR 20250108652A KR 1020257018638 A KR1020257018638 A KR 1020257018638A KR 20257018638 A KR20257018638 A KR 20257018638A KR 20250108652 A KR20250108652 A KR 20250108652A
Authority
KR
South Korea
Prior art keywords
lamella
mark
processing
sample
microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257018638A
Other languages
English (en)
Korean (ko)
Inventor
즈까사 모리시따
쇼이찌 하세가와
유따까 이꾸
유고 오노다
Original Assignee
주식회사 히타치하이테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 히타치하이테크 filed Critical 주식회사 히타치하이테크
Publication of KR20250108652A publication Critical patent/KR20250108652A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32—Polishing; Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
KR1020257018638A 2022-12-20 2022-12-20 빔 장치, 라멜라 추출 장치, 라멜라 관찰 시스템 및 라멜라 제작 방법 Pending KR20250108652A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/046768 WO2024134744A1 (ja) 2022-12-20 2022-12-20 ビーム装置、ラメラ抽出装置、ラメラ観察システムおよびラメラ作製方法

Publications (1)

Publication Number Publication Date
KR20250108652A true KR20250108652A (ko) 2025-07-15

Family

ID=91588151

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257018638A Pending KR20250108652A (ko) 2022-12-20 2022-12-20 빔 장치, 라멜라 추출 장치, 라멜라 관찰 시스템 및 라멜라 제작 방법

Country Status (4)

Country Link
JP (1) JPWO2024134744A1 (https=)
KR (1) KR20250108652A (https=)
TW (1) TWI891170B (https=)
WO (1) WO2024134744A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001141620A (ja) 1999-11-18 2001-05-25 Seiko Instruments Inc 透過電子顕微鏡用試料の切り込み加工法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4283432B2 (ja) * 2000-11-06 2009-06-24 株式会社日立製作所 試料作製装置
EP2492950B1 (en) * 2011-02-25 2018-04-11 FEI Company Method for rapid switching between a high current mode and a low current mode in a charged particle beam system
DE102012010708B4 (de) * 2012-05-30 2021-12-23 Carl Zeiss Microscopy Gmbh Kombiniertes bearbeitungssystem zur bearbeitung mittels laser und fokussierten ionenstrahlen
TWI686837B (zh) * 2012-12-31 2020-03-01 美商Fei公司 用於具有一帶電粒子束之傾斜或偏斜研磨操作之基準設計
JP6541161B2 (ja) * 2017-11-17 2019-07-10 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP7389817B2 (ja) * 2019-11-20 2023-11-30 株式会社日立ハイテク ラメラの作製方法、解析システムおよび試料の解析方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001141620A (ja) 1999-11-18 2001-05-25 Seiko Instruments Inc 透過電子顕微鏡用試料の切り込み加工法

Also Published As

Publication number Publication date
JPWO2024134744A1 (https=) 2024-06-27
TW202441563A (zh) 2024-10-16
WO2024134744A1 (ja) 2024-06-27
TWI891170B (zh) 2025-07-21

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