KR20250105374A - 감광성 수지 조성물, 경화물, 및 반도체 소자 - Google Patents

감광성 수지 조성물, 경화물, 및 반도체 소자 Download PDF

Info

Publication number
KR20250105374A
KR20250105374A KR1020257013342A KR20257013342A KR20250105374A KR 20250105374 A KR20250105374 A KR 20250105374A KR 1020257013342 A KR1020257013342 A KR 1020257013342A KR 20257013342 A KR20257013342 A KR 20257013342A KR 20250105374 A KR20250105374 A KR 20250105374A
Authority
KR
South Korea
Prior art keywords
resin composition
photosensitive resin
diamine
group
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257013342A
Other languages
English (en)
Korean (ko)
Inventor
후미히코 가와우치
다츠야 마키노
기예르모 페르난데즈
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250105374A publication Critical patent/KR20250105374A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H01L21/02118—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
KR1020257013342A 2022-11-08 2023-11-07 감광성 수지 조성물, 경화물, 및 반도체 소자 Pending KR20250105374A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2022/041551 2022-11-08
PCT/JP2022/041551 WO2024100764A1 (ja) 2022-11-08 2022-11-08 感光性樹脂組成物、硬化物、及び半導体素子
PCT/JP2023/040068 WO2024101358A1 (ja) 2022-11-08 2023-11-07 感光性樹脂組成物、硬化物、及び半導体素子

Publications (1)

Publication Number Publication Date
KR20250105374A true KR20250105374A (ko) 2025-07-08

Family

ID=91032351

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257013342A Pending KR20250105374A (ko) 2022-11-08 2023-11-07 감광성 수지 조성물, 경화물, 및 반도체 소자

Country Status (6)

Country Link
US (1) US20250271757A1 (https=)
JP (1) JPWO2024101358A1 (https=)
KR (1) KR20250105374A (https=)
CN (1) CN119096199A (https=)
TW (1) TW202421674A (https=)
WO (2) WO2024100764A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025100369A1 (ja) * 2023-11-06 2025-05-15 株式会社レゾナック マレイミド樹脂、樹脂組成物、硬化物、シート、積層体、及びプリント配線板
WO2025187616A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025187615A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025253919A1 (ja) * 2024-06-07 2025-12-11 住友化学株式会社 ポリイミド系樹脂、ポリアミック酸樹脂、ポリアミック酸樹脂組成物及びその硬化膜、並びに半導体パッケージ
JP2026020989A (ja) * 2024-07-29 2026-02-10 株式会社レゾナック 硬化性組成物の製造方法及び硬化性組成物用混合物
JP2026020986A (ja) * 2024-07-29 2026-02-10 株式会社レゾナック 硬化性組成物及び硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007057595A (ja) 2005-08-22 2007-03-08 Jsr Corp ポジ型感光性絶縁樹脂組成物およびその硬化物
JP2008309885A (ja) 2007-06-12 2008-12-25 Hitachi Chem Co Ltd ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子デバイス
WO2010073948A1 (ja) 2008-12-26 2010-07-01 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102597875B1 (ko) * 2015-03-16 2023-11-03 다이요 홀딩스 가부시키가이샤 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
US20220179310A1 (en) * 2019-04-02 2022-06-09 Nippon Kayaku Kabushiki Kaisha Bismaleimide compound, photosensitive resin composition using same, cured product thereof, and semiconductor element
CN114207520B (zh) * 2019-08-01 2025-12-05 东丽株式会社 感光性树脂组合物、感光性片、固化膜、固化膜的制造方法、层间绝缘膜及电子部件
US20230095931A1 (en) * 2020-01-27 2023-03-30 Designer Molecules, Inc. Uv-curable resin compositions suitable for redistribution layers
KR102896548B1 (ko) * 2020-03-18 2025-12-08 도레이 카부시키가이샤 감광성 수지 조성물, 감광성 시트, 경화막, 경화막의 제조 방법, 전자 부품, 안테나 소자, 반도체 패키지 및 표시 장치
JP7306343B2 (ja) * 2020-07-17 2023-07-11 味の素株式会社 感光性樹脂組成物
WO2023106104A1 (ja) * 2021-12-09 2023-06-15 日産化学株式会社 感光性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007057595A (ja) 2005-08-22 2007-03-08 Jsr Corp ポジ型感光性絶縁樹脂組成物およびその硬化物
JP2008309885A (ja) 2007-06-12 2008-12-25 Hitachi Chem Co Ltd ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子デバイス
WO2010073948A1 (ja) 2008-12-26 2010-07-01 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス

Also Published As

Publication number Publication date
WO2024101358A1 (ja) 2024-05-16
WO2024100764A1 (ja) 2024-05-16
US20250271757A1 (en) 2025-08-28
TW202421674A (zh) 2024-06-01
CN119096199A (zh) 2024-12-06
JPWO2024101358A1 (https=) 2024-05-16

Similar Documents

Publication Publication Date Title
KR20250105374A (ko) 감광성 수지 조성물, 경화물, 및 반도체 소자
TWI413860B (zh) A negative photosensitive resin composition, a method for manufacturing a hardened embossed pattern, and a semiconductor device
WO2019044874A1 (ja) 感光性樹脂組成物
KR20250136335A (ko) 감광성 수지 조성물, 경화물, 및 반도체 소자
CN113168101B (zh) 感光性树脂组合物、图案固化膜的制造方法、固化膜、层间绝缘膜、覆盖涂层、表面保护膜及电子部件
KR20250171307A (ko) 감광성 수지 조성물, 경화물, 및 반도체 소자
KR20250136336A (ko) 감광성 수지 조성물, 경화물, 및 반도체 소자
JP2024147881A (ja) 感光性樹脂組成物、硬化物、及び半導体素子
CN114502617B (zh) 聚酰亚胺前体、感光性树脂组合物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件
WO2025100368A1 (ja) 感光性樹脂組成物、硬化物、及び半導体素子
WO2025159122A1 (ja) 感光性樹脂組成物、硬化物、及び半導体素子
WO2025100366A1 (ja) マレイミド樹脂の製造方法
WO2025121288A1 (ja) 絶縁膜の形成方法及び感光性樹脂組成物
WO2025121286A1 (ja) 感光性樹脂組成物、硬化物、及び半導体素子
WO2025134897A1 (ja) 感光性樹脂組成物、硬化物及び半導体素子
WO2025234333A1 (ja) 感光性樹脂組成物、硬化物、及び半導体素子
KR20250077509A (ko) 수지 조성물 및 그 제조 방법, 및 수지 조성물의 경화물
WO2024209647A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品
WO2025088705A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、及び電子部品
WO2025183117A1 (ja) ネガ型感光性樹脂組成物及び硬化レリーフパターンの製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000